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21. 发明授权

US07671417B2 Memory cell array, method of producing the same, and semiconductor memory device using the same 有权
标题翻译：存储单元阵列，其制造方法以及使用其的半导体存储器件
公开(公告)号：US07671417B2
公开(公告)日：2010-03-02
申请号：US11840559
申请日：2007-08-17
申请人： Eiji Yoshida , Tetsu Tanaka , Toshihiko Miyashita
发明人： Eiji Yoshida , Tetsu Tanaka , Toshihiko Miyashita
IPC分类号： H01L29/72
CPC分类号： H01L21/845 , H01L27/108 , H01L27/10802 , H01L27/10826 , H01L27/10879 , H01L27/1211 , H01L29/66795 , H01L29/6681 , H01L29/7841 , H01L29/785
摘要： A memory cell array includes isolated semiconductor regions formed on a supporting insulating substrate, memory cells formed in the respective semiconductor regions, and insulating regions formed so as to insulate the memory cells. Each memory cell formed in a semiconductor region includes a source region, a drain region, a front gate region formed on a gate insulating film formed on one of side surfaces of the semiconductor region such that the source region and the drain region are separated from each other by the front gate region, and a back gate region formed on a gate insulating film formed on an opposite side surface of the semiconductor region such that the source region and the drain region are separated from each other by the back gate region. Each memory cell shares the back gate region with a memory cell adjacent in a row direction.
摘要翻译：存储单元阵列包括形成在支撑绝缘基板上的隔离半导体区域，形成在各个半导体区域中的存储单元，以及形成为使得存储单元绝缘的绝缘区域。形成在半导体区域中的每个存储单元包括源极区域，漏极区域，形成在形成在半导体区域的一个侧表面上的栅极绝缘膜上的前栅极区域，使得源极区域和漏极区域与每个以及形成在栅极绝缘膜上的背栅极区域，该栅极绝缘膜形成在半导体区域的相对侧表面上，使得源极区域和漏极区域由背栅极区域彼此分离。每个存储单元与在行方向上相邻的存储单元共享背栅区。

22. 发明授权

US07428964B2 Chain cover and slat conveyor using the same 失效
标题翻译：链盖和板条输送机使用相同
公开(公告)号：US07428964B2
公开(公告)日：2008-09-30
申请号：US11664000
申请日：2005-09-29
申请人： Eiji Yoshida
发明人： Eiji Yoshida
IPC分类号： B65G17/06
CPC分类号： B65G17/42 , B65G17/067 , B65G2201/02
摘要： A chain cover includes side covers each formed with a shaft hole for receiving a coupling pin of a roller chain, two top covers each having a length substantially equal to a chain pitch of the roller chain, and a coupling plate coupling the top covers adjacent to each other. The side cover at each end of the chain cover has a convexly arcuate front edge concentric with the shaft hole and a concavely arcuate rear edge similar to the front edge, and the coupling plate and two top covers cooperate to form a slat. A plurality of these chain covers can be mounted on a plurality of parallel roller chains to cover the top and sides of each roller chain and form a flat goods conveying surface between the roller chains, thereby forming a slat conveyor which is less expensive than a roller conveyor and provides excellent conveying stability.
摘要翻译：链盖包括侧盖，每个侧盖形成有用于接收滚子链的联接销的轴孔，两个顶盖各自具有基本上等于滚子链的链节距的长度，以及联接板，彼此。链盖每端的侧盖具有与轴孔同心的凸形弓形前边缘和类似于前边缘的凹弧形后边缘，并且联接板和两个顶盖配合形成板条。多个这些链条盖可以安装在多个平行的滚子链上，以覆盖每个滚子链的顶部和侧面，并在滚子链之间形成一个扁平的货物输送表面，从而形成一个比滚筒便宜的板条输送机输送机，提供良好的输送稳定性。

23. 发明授权

US07395847B2 Jig for a semiconductor substrate 有权
标题翻译：夹具用于半导体衬底
公开(公告)号：US07395847B2
公开(公告)日：2008-07-08
申请号：US11075721
申请日：2005-03-10
申请人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
发明人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
IPC分类号： B32B37/00
CPC分类号： H01L21/67092 , B24B37/042 , B32B37/003 , B32B37/1018 , B32B38/0012 , B32B2310/0831 , B32B2457/14 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , Y10T29/5313 , Y10T29/53191 , Y10T428/1452 , H01L2924/3512 , H01L2924/00
摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.
摘要翻译：本发明涉及一种制造半导体衬底的方法，该半导体衬底包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片键合步骤; 以及用于这种方法的半导体衬底夹具。本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。当橡胶膜22的体积增加时，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1 。使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

24. 发明申请

US20080073184A1 Chain Cover and Slat Conveyor Using the Same 失效
标题翻译：链盖和板式输送机使用它
公开(公告)号：US20080073184A1
公开(公告)日：2008-03-27
申请号：US11664000
申请日：2005-09-29
申请人： Eiji Yoshida
发明人： Eiji Yoshida
IPC分类号： B65G17/06 , B65G21/00
CPC分类号： B65G17/42 , B65G17/067 , B65G2201/02
摘要： A plurality of chain covers are mounted on a plurality of roller chains arranged in parallel to cover the top and sides of each roller chain and form a flat goods conveying surface between the roller chains, thereby forming a slat conveyor which is more inexpensive than a roller conveyor and provides excellent conveying stability. A chain cover 1 is provided which includes side covers 3 each formed with a shaft hole 5 for receiving one end of a coupling pin 22 of a roller chain 21, two top covers 2 each having a length L substantially equal to a chain pitch of the roller chain, and a coupling plate 4 for coupling the top covers 2 adjacent to each other. With this chain cover 1, the side cover 3 at each end of the chain cover has a convexly arcuate front edge 7 which is concentric with the shaft hole 5 and a concavely arcuate rear edge 8 which is similar to the front edge, and the coupling plate 4 and two top covers 2 cooperate to form a slat.
摘要翻译：多个链条盖安装在平行布置的多个滚子链上，以覆盖每个滚子链的顶部和侧面，并在滚子链之间形成平坦的货物输送表面，由此形成一个比滚筒更便宜的板条输送机输送机，提供良好的输送稳定性。提供链盖1，其包括侧盖3，每个侧盖3形成有用于接收滚子链21的联接销22的一端的轴孔5，两个顶盖2，每个顶盖2的长度L基本上等于滚子链，以及用于连接彼此相邻的顶盖2的联接板4。对于该链条盖1，链盖每端的侧盖3具有与轴孔5同心的凸形弓形前边缘7和类似于前边缘的凹弧形后边缘8，并且联轴器板4和两个顶盖2配合形成板条。

25. 发明授权

US06846193B2 Socket 失效
标题翻译：插座
公开(公告)号：US06846193B2
公开(公告)日：2005-01-25
申请号：US10426658
申请日：2003-05-01
申请人： Eiji Yoshida
发明人： Eiji Yoshida
IPC分类号： G01R31/26 , G01R1/04 , G01R1/073 , H01L23/32 , H01R13/187 , H01R13/26 , H01R33/76 , H01R11/22
CPC分类号： G01R1/0483 , H01R13/2442 , H01R2201/20 , H05K7/1023
摘要： The present invention provides a socket capable of attaching an IC chip in such a manner that a rear face of the IC chip faces a detector side. By fitting the shape of a package lead (10) into the shape of a positioning structure (6), a package (9) is positioned at and housed in a predetermined portion inside a housing part (2). The package (9) is housed in such a manner that a rear face (9b) thereof faces upwardly. The package lead (10) is pressed by one end (3a1) of a top portion (3a) of a socket lead (3), and is also sandwiched between the socket lead (3) and a upper face of a protrusion (6a) of the positioning structure (6) in the vertical direction. As a result, the socket lead (3) and package lead (10) are securely brought into contact with each other, and the package (9) and a socket base (1) are mutually fixed.
摘要翻译：本发明提供一种能够以IC芯片的背面朝向检测器侧的方式安装IC芯片的插座。通过将封装引线（10）的形状装配成定位结构（6）的形状，封装（9）被定位并容纳在壳体部分（2）内的预定部分中。包装（9）以使其后表面（9b）向上的方式容纳。封装引线（10）被插座引线（3）的顶部（3a）的一端（3a1）挤压，并且也夹在插座引线（3）和突起（6a）的上表面之间，的定位结构（6）。结果，插座引线（3）和封装引线（10）牢固地彼此接触，并且封装（9）和插座基座（1）相互固定。

26. 发明授权

US06732911B2 Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system 有权
标题翻译：焊接接头系统，焊接方法，半导体器件制造方法以及半导体器件制造系统
公开(公告)号：US06732911B2
公开(公告)日：2004-05-11
申请号：US09970802
申请日：2001-10-05
申请人： Hirohisa Matsuki , Hiroyuki Matsui , Eiji Yoshida , Takao Ohno , Koki Otake , Akiyo Mizutani , Motoshu Miyajima , Masataka Mizukoshi , Eiji Watanabe
发明人： Hirohisa Matsuki , Hiroyuki Matsui , Eiji Yoshida , Takao Ohno , Koki Otake , Akiyo Mizutani , Motoshu Miyajima , Masataka Mizukoshi , Eiji Watanabe
IPC分类号： B23K3538
CPC分类号： B23K1/008 , B23K2101/36 , H05K3/3489
摘要： There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid supplying means for supplying a formic acid into the heating/melting area, an exhausting means for exhausting a gas from the heating/melting area and its neighboring area to create a lower pressure area in the heating/melting area as compared to the pressure of outside the chamber, heating means for heating directly or indirectly the solder-adhered object in the heating/melting area, and an air-stream suppressing means for disturbing a gas flow between the heating/melting area and the carrying areas. Accordingly, there can be provided a solder jointing system for jointing solder layers of a semiconductor device, an electronic device, or the like to the wirings or the pads, which is capable of having a high processing ability and preventing re-oxidation.
摘要翻译：设置有通过开口穿过焊料粘附物体的开口的室，并且具有加热/熔化区域的室，用于将焊料粘附物携带到加热/熔融区域中的承载机构，用于将甲酸供应到加热/熔化区域的酸供应装置，用于从加热/熔化区域及其相邻区域排出气体的排气装置，以在加热/熔化区域中产生较低压力区域，在室外，用于在加热/熔化区域中直接或间接加热焊接物体的加热装置，以及用于扰乱加热/熔化区域和承载区域之间的气流的气流抑制装置。因此，可以提供一种用于将半导体器件，电子器件等的焊料层接合到布线或焊盘上的焊接接合系统，其能够具有高处理能力并防止再氧化。

27. 发明授权

US06662545B1 Chain cover 失效
标题翻译：链盖
公开(公告)号：US06662545B1
公开(公告)日：2003-12-16
申请号：US10287705
申请日：2002-11-05
申请人： Eiji Yoshida
发明人： Eiji Yoshida
IPC分类号： F16G1306
CPC分类号： B65G19/24 , B65G17/065 , F16G13/06 , F16G13/20
摘要： A chain cover is provided which can be mounted on a general-purpose roller chain, can be attached and detached to and from the chain, and will not impair bendability of the chain. Side covers for covering both sides of the chain extend from both ends of a top cover for covering a top of the chain. Each side cover has a shaft hole for receiving a coupling pin of the chain, a convex arcuate front edge that is concentric with the shaft hole, a concave arcuate rear edge opposed to the front edge, and a tapered guide surface. The top cover is supported directly by roller links of the chain to allow the coupling pin to be inserted not deeply into the shaft hole.
摘要翻译：提供了可以安装在通用滚子链上的链条盖，可以链接和拆卸链条，并且不会损害链条的弯曲性。用于覆盖链的两侧的侧盖从顶盖的两端延伸以覆盖链的顶部。每个侧盖具有用于接收链条的联接销的轴孔，与轴孔同心的凸形弓形前边缘，与前边缘相对的凹弧形后边缘和锥形引导表面。顶盖由链条的滚子连杆直接支撑，以使连接销不会深入轴孔插入。

28. 发明授权

US06388333B1 Semiconductor device having protruding electrodes higher than a sealed portion 有权
标题翻译：具有比密封部分高的突出电极的半导体器件
公开(公告)号：US06388333B1
公开(公告)日：2002-05-14
申请号：US09605687
申请日：2000-06-27
申请人： Fumihiko Taniguchi , Kouhei Orikawa , Tadashi Uno , Fumihiko Ando , Akira Takashima , Hiroshi Onodera , Eiji Yoshida , Kazuo Teshirogi
发明人： Fumihiko Taniguchi , Kouhei Orikawa , Tadashi Uno , Fumihiko Ando , Akira Takashima , Hiroshi Onodera , Eiji Yoshida , Kazuo Teshirogi
IPC分类号： H01L2940
CPC分类号： H01L25/50 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/05001 , H01L2224/05023 , H01L2224/05548 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2225/06586 , H01L2225/06593 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/05099 , H01L2224/45015 , H01L2924/207
摘要： A plurality of semiconductor devices can be mounted on a mounting board in a three-dimensional structure by stacking one on another with a simple structure. A semiconductor element is mounted on a first surface of an interposer. Electrode pads connected to the semiconductor element are arranged around the semiconductor element on the first surface of the interposer. Protruding electrodes are provided on the respective electrode pads. Through holes are formed in the interposer so as to extend from a second surface opposite to the first surface of the redistribution substrate to the respective electrode pads. The semiconductor element is encapsulated by a seal resin. Each of the protruding electrodes is higher than the sealed portion of the semiconductor element.
摘要翻译：多个半导体器件可以通过以简单的结构彼此堆叠而以三维结构安装在安装板上。半导体元件安装在插入件的第一表面上。连接到半导体元件的电极焊盘围绕该中介层的第一表面上的半导体元件布置。突出电极设置在相应的电极焊盘上。在插入器中形成通孔，从与再分布基板的第一表面相反的第二表面延伸到相应的电极焊盘。半导体元件由密封树脂封装。每个突出电极比半导体元件的密封部分高。

29. 发明授权

US06378277B1 Vertical sealing device for vertical type forming, filling and closing machine for flexible packages 失效
标题翻译：垂直式成型垂直密封装置，柔性包装灌装封闭机
公开(公告)号：US06378277B1
公开(公告)日：2002-04-30
申请号：US09438960
申请日：1999-11-12
申请人： Tatsuo Inoue , Eiji Yoshida , Naohiko Kakutani
发明人： Tatsuo Inoue , Eiji Yoshida , Naohiko Kakutani
IPC分类号： B65B920
CPC分类号： B65B9/2021 , B65B9/207 , B65B57/08
摘要： A vertical sealing device for a packing machine includes a pair of feed units for feeding a cylindrical-formed packaging material and a center heat sealer for the heat-sealing of a vertical seam of the packaging material. When the operation of the machine is halted, the feed units feed the packaging material from a steady speed mode to a deceleration mode. During this deceleration mode, the operation of the center heat sealer is stopped. On the other hand, when the operation of the packing machine is restarted, the feed units feed the packaging material in an acceleration mode, and during this acceleration mode, the center heat sealer starts operating.
摘要翻译：用于包装机的立式密封装置包括用于供给圆柱形包装材料的一对进料单元和用于热封包装材料的垂直接缝的中心热封机。当机器的操作停止时，进给单元将包装材料从稳定速度模式送入减速模式。在该减速模式下，停止中央热封机的运转。另一方面，当包装机的操作重新开始时，进给单元以加速模式进给包装材料，并且在该加速模式期间，中央热封机开始运转。

30. 发明授权

US4578257A Process for removing sulfur dioxide from off-gas 失效
标题翻译：从废气中除去二氧化硫的方法
公开(公告)号：US4578257A
公开(公告)日：1986-03-25
申请号：US720811
申请日：1985-04-08
申请人： Yoshihiko Kudo , Eiji Yoshida
发明人： Yoshihiko Kudo , Eiji Yoshida
IPC分类号： B01D53/50 , B01D53/77 , C01F11/46 , C01B17/00
CPC分类号： C01F11/464 , B01D53/501
摘要： Disclosed is an improvement in a process for desulfurization of off-gas, which process comprises contacting an off-gas which contains sulfur dioxide with an absorbing solution containing at least a sulfosuccinate, a sulfate and a crystalline gypsum to absorb the sulfur dioxide for removal therefrom, and oxidizing the resulting absorbed solution with an oxygen-containing gas while neutralizing the solution with limestone in order to fix the sulfur dioxide in the form of gypsum for separation. The improvement comprises adding maleic anhydride and limestone to the absorbed solution during the residence time of the absorbed solution, the resulting absorbed solution being oxidized with an oxygen-containing gas to reproduce an absorbing solution therefrom so as to be effectively reused for the absorption of sulfur dioxide in the off-gas for separation.
摘要翻译：公开了废气脱硫方法的改进，该方法包括使含有二氧化硫的废气与至少含有磺基琥珀酸盐，硫酸盐和结晶石膏的吸收溶液接触以吸收二氧化硫以从中除去，并用含氧气体氧化所得的吸收溶液，同时用石灰石中和溶液，以将二氧化硫固定为石膏形式用于分离。该改进包括在吸收溶液的停留时间内将吸附的溶液中加入马来酸酐和石灰石，所得吸收的溶液用含氧气体氧化以再生其吸收溶液，以便有效地重新用于吸收硫废气中的二氧化物用于分离。

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