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    • 21. 发明授权
    • Nonvolatile memory devices having a fin shaped active region
    • 具有鳍形有源区域的非易失性存储器件
    • US07863686B2
    • 2011-01-04
    • US12536740
    • 2009-08-06
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • H01L29/66
    • H01L27/115H01L27/11521
    • A nonvolatile memory device includes a semiconductor substrate and a device isolation layer on the semiconductor substrate. A fin-shaped active region is formed between portions of the device isolation layer. A sidewall protection layer is formed on the sidewall of the fin-shaped active region where source and drain regions are formed. Thus, it may be possible to reduce the likelihood of an undesirable connection between an interconnection layer connected to the source and drain regions and a lower sidewall of the active region so that charge leakage from the interconnection layer to a substrate can be prevented or reduced. The sidewall protection layer may be formed using the device isolation layer. Alternatively, an insulating layer having an etch selectivity with respect to an interlayer insulating layer may be formed on the device isolation layer so as to cover the sidewall of the active region.
    • 非易失性存储器件包括半导体衬底和半导体衬底上的器件隔离层。 翅片形有源区形成在器件隔离层的各部分之间。 侧壁保护层形成在形成源区和漏区的鳍状有源区的侧壁上。 因此,可以降低连接到源极和漏极区域的互连层和有源区域的下侧壁之间的不期望的连接的可能性,从而可以防止或减少从互连层到衬底的电荷泄漏。 侧壁保护层可以使用器件隔离层形成。 或者,可以在器件隔离层上形成具有相对于层间绝缘层的蚀刻选择性的绝缘层,以覆盖有源区的侧壁。
    • 23. 发明申请
    • Nonvolatile Memory Devices Having a Fin Shaped Active Region
    • 具有鳍形活动区域的非易失性存储器件
    • US20090294837A1
    • 2009-12-03
    • US12536740
    • 2009-08-06
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • H01L29/792H01L29/78
    • H01L27/115H01L27/11521
    • A nonvolatile memory device includes a semiconductor substrate and a device isolation layer on the semiconductor substrate. A fin-shaped active region is formed between portions of the device isolation layer. A sidewall protection layer is formed on the sidewall of the fin-shaped active region where source and drain regions are formed. Thus, it may be possible to reduce the likelihood of an undesirable connection between an interconnection layer connected to the source and drain regions and a lower sidewall of the active region so that charge leakage from the interconnection layer to a substrate can be prevented or reduced. The sidewall protection layer may be formed using the device isolation layer. Alternatively, an insulating layer having an etch selectivity with respect to an interlayer insulating layer may be formed on the device isolation layer so as to cover the sidewall of the active region.
    • 非易失性存储器件包括半导体衬底和半导体衬底上的器件隔离层。 翅片形有源区形成在器件隔离层的各部分之间。 侧壁保护层形成在形成源区和漏区的鳍状有源区的侧壁上。 因此,可以降低连接到源极和漏极区域的互连层和有源区域的下侧壁之间的不期望的连接的可能性,从而可以防止或减少从互连层到衬底的电荷泄漏。 侧壁保护层可以使用器件隔离层形成。 或者,可以在器件隔离层上形成具有相对于层间绝缘层的蚀刻选择性的绝缘层,以覆盖有源区的侧壁。
    • 25. 发明申请
    • Non-volatile memory devices and methods of operating the same
    • 非易失性存储器件及其操作方法
    • US20060180851A1
    • 2006-08-17
    • US11402389
    • 2006-04-12
    • Chang-Hyun LeeJung-Dal Choi
    • Chang-Hyun LeeJung-Dal Choi
    • H01L29/788
    • G11C16/12G11C16/14G11C16/26H01L27/115H01L27/11521H01L27/11524H01L27/11526H01L27/11529H01L29/40114H01L29/42332H01L29/513H01L29/7782H01L29/792H01L29/7923
    • Non-volatile memory devices and methods of operating the same are disclosed. A non-volatile memory device includes a semiconductor substrate. A tunnel insulating layer and a gate electrode are on the semiconductor substrate. A multiple tunnel insulation layer with a plurality of layers, a charge storage insulation layer, and a multiple blocking insulation layer with a plurality of layers are sequentially stacked between the gate electrode and the tunnel insulating layer. A first diffusion region and a second diffusion region in the semiconductor substrate are adjacent to opposite respective sides of the gate electrode. When a voltage is applied to the gate electrode and the semiconductor substrate to form a voltage level difference therebetween, a minimum field in the tunnel insulation layer is stronger than a minimum field in the blocking insulation layer. A minimum field established at a blocking insulation layer can be stronger than a minimum field established at a tunnel insulation layer, and the migration probability of charges through the tunnel insulation layer can be higher than that of charges through the blocking insulation layer. Therefore, it may be possible to use lower operation voltages, obtain higher program and erase speeds, and/or obtain a greater difference between threshold values of a program threshold voltage and an erase threshold voltage. As a result, a multi-valued non-volatile memory device may be formed therefrom.
    • 公开了非易失性存储器件及其操作方法。 非易失性存储器件包括半导体衬底。 隧道绝缘层和栅电极位于半导体衬底上。 具有多个层的多重隧道绝缘层,电荷存储绝缘层和具有多个层的多重阻挡绝缘层依次堆叠在栅电极和隧道绝缘层之间。 半导体衬底中的第一扩散区域和第二扩散区域与栅电极的相对的相对侧相邻。 当向栅电极和半导体衬底施加电压以形成其间的电压电平差时,隧道绝缘层中的最小场强比阻挡绝缘层中的最小场强。 在阻挡绝缘层处建立的最小场强可以比在隧道绝缘层处建立的最小场强更强,并且通过隧道绝缘层的电荷的迁移概率可以高于通过阻挡绝缘层的电荷的迁移概率。 因此,可以使用较低的操作电压,获得更高的编程和擦除速度,和/或获得程序阈值电压和擦除阈值电压的阈值之间的较大差异。 结果,可以从其形成多值非易失性存储器件。
    • 26. 发明授权
    • Operating a non-volatile memory device
    • 操作非易失性存储设备
    • US06894924B2
    • 2005-05-17
    • US10133684
    • 2002-04-25
    • Jung-Dal ChoiChang-Hyun Lee
    • Jung-Dal ChoiChang-Hyun Lee
    • G11C16/04G11C16/10G11C16/14G11C16/26
    • G11C16/0466G11C16/10G11C16/14G11C16/26
    • An operation method of programming, erasing, and reading a silicon-oxide-nitride-oxide-silicon (SONOS) non-volatile memory device having a tunnel oxide layer thicker than 20 Å is provided. A program operation of the method is accomplished by applying a program voltage higher than 0 volts and a ground voltage to a gate electrode and a channel region of a selected SONOS cell transistor, respectively. Also, an erasing operation is accomplished by applying a ground voltage and a first erase voltage lower than 0 volts to a bulk region and a gate electrode of a selected SONOS cell transistor, respectively, and by applying a second erasure voltage to either a drain region or a source region of the selected SONOS cell transistor. The second erase voltage is a ground voltage or a positive voltage. In addition, a read operation is accomplished using either a backward read mode or a forward read mode. Thus, it is possible to remarkably improve a bake retention characteristic, which is sensitive to a thickness of the tunnel oxide layer.
    • 提供了一种编程,擦除和读取具有大于20埃的隧道氧化物层的氧化硅 - 氧化物 - 氧化物 - 硅(SONOS)非易失性存储器件的操作方法。 该方法的程序操作通过分别向所选择的SONOS单元晶体管的栅电极和沟道区施加高于0伏的编程电压和接地电压来实现。 此外,擦除操作是通过分别对所选择的SONOS单元晶体管的体区域和栅电极施加接地电压和低于0伏特的第一擦除电压来实现的,并且通过向漏极区域施加第二擦除电压 或所选择的SONOS单元晶体管的源极区域。 第二擦除电压是接地电压或正电压。 此外,使用反向读取模式或正向读取模式来实现读取操作。 因此,可以显着提高对隧道氧化物层的厚度敏感的烘烤保持特性。