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21. 发明授权

US06306670B1 Tool for handling a workpiece 失效
标题翻译：用于处理工件的工具
公开(公告)号：US06306670B1
公开(公告)日：2001-10-23
申请号：US09373354
申请日：1999-08-12
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , John W. Stayt
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , John W. Stayt
IPC分类号： H01L2166
CPC分类号： H01L21/68 , H01L21/6838
摘要： A system for flipping a semiconductor workpiece on its thin edge for microscope inspection of a workpiece facet is disclosed. The system has a holding device attached to a handling block. The holding device picks a workpiece by one of its thin edges. The edge of the workpiece may be attached to the holding device by vacuum. Then an operator rotates the handling block ninety degrees, which in turn rotates the holding device and workpiece ninety degrees. After rotation, one of the workpiece facets faces upward and perpendicular to the microscope for proper inspection of the facet.
摘要翻译：公开了一种用于在其薄边缘上翻转半导体工件用于工件面的显微镜检查的系统。系统具有附接到处理块的保持装置。保持装置通过其一个薄边缘拾取工件。工件的边缘可以通过真空附接到保持装置。然后操作者将处理块旋转90度，这又使保持装置和工件旋转90度。旋转后，其中一个工件面向上并垂直于显微镜，以正确检查该刻面。

22. 发明授权

US06290805B1 System and method for using a pick and place apparatus 有权
标题翻译：使用拾放设备的系统和方法
公开(公告)号：US06290805B1
公开(公告)日：2001-09-18
申请号：US09398188
申请日：1999-09-17
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , H01L21/6838 , Y10S156/941 , Y10S438/976 , Y10T156/11 , Y10T156/1132 , Y10T156/19
摘要： A system is provided for removing large semiconductor work pieces from an adhesive film. A pick and place apparatus is provided with a collet bar with elongated sides and opposed ends. A channel extends into a cavity on a lower surface of the collet bar. The channel receives a vacuum. The collet bar is angled from a longitudinal axis of the larger work piece to be removed. The work piece may be aligned with a cylindrical roller located under the adhesive film. The angle is chosen to extend the bar across a majority of the width of the work piece. By lowering the collet bar, a first end contacts the work piece, which may be tilted on the roller. Further lowering of the collet bar tilts the semiconductor work piece up into the same plane as the lower surface of the collet bar.
摘要翻译：提供了用于从粘合膜去除大的半导体工件的系统。拾取和放置装置设置有具有细长侧面和相对端的夹头条。通道延伸到夹头杆的下表面上的空腔中。通道接收真空。夹头条从要移除的较大工件的纵向轴线成角度。工件可以与位于粘合膜下方的圆柱滚子对准。选择该角度以将条延伸穿过工件的宽度的大部分。通过降低夹头杆，第一端接触可能在辊上倾斜的工件。夹头杆的进一步降低将半导体工件向上倾斜到与夹头杆的下表面相同的平面内。

23. 发明授权

US06277206B1 Method for unclogging solder-clogged collet using solder preform 失效
标题翻译：使用焊料预制件清除焊锡堵塞夹头的方法
公开(公告)号：US06277206B1
公开(公告)日：2001-08-21
申请号：US09366347
申请日：1999-08-02
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Mindaugas F. Dautartas
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , Mindaugas F. Dautartas
IPC分类号： B08B700
CPC分类号： H01L21/67138 , B23K1/018 , B23K2101/40
摘要： A method for unblocking a vacuum collet channel clogged with solder includes moving a solder-clogged collet into contact with a preform of solder, and melting the solder clog and the preform into a single melted mass, cooling the melted mass to solidify it, and moving the collet away from the cooled mass, leaving the clog behind.
摘要翻译：用于阻止由焊料堵塞的真空夹头通道的方法包括将焊料堵塞的夹头移动与焊料预成型件接触，并将焊料堵塞和预成型件熔化成单个熔化的质量，冷却熔化的质量以使其固化并移动夹头远离冷却的质量，留下堵塞。

24. 发明授权

US6142853A Method and apparatus for holding laser wafers during a fabrication process to minimize breakage 有权
标题翻译：在制造过程中保持激光晶片的方法和装置，以使断裂最小化
公开(公告)号：US6142853A
公开(公告)日：2000-11-07
申请号：US219785
申请日：1998-12-23
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： B24B37/04 , B24B41/06 , B24B1/00
CPC分类号： B24B37/30 , B24B37/042 , B24B41/068
摘要： A method and apparatus utilizing a thermal release mounting material to adhere a laser wafer to a wafer support during a semiconductor fabrication process is provided. A first surface of the mounting material contains an adhesive and is adhered to a wafer support. The wafer support contains apertures for allowing air bubbles to escape while the mounting material is being applied to the wafer support, thus, ensuring that the film is planar to the support. The laser wafer is adhered to a second surface of the mounting material. The second surface of the mounting material comprises a thermal release material. After undergoing the fabrication process, the thermal release material of the mounting material is heated to a release temperature allowing the laser wafer to be readily removed from the wafer support.
摘要翻译：提供了一种在半导体制造过程中利用热释放安装材料将激光晶片粘附到晶片支架的方法和装置。安装材料的第一表面包含粘合剂并且粘附到晶片支撑件上。晶片支撑件包含用于允许气泡逸出的孔，同时将安装材料施加到晶片支撑件，从而确保膜与支撑件平坦。激光晶片粘附到安装材料的第二表面。安装材料的第二表面包括热释放材料。在经历制造过程之后，将安装材料的热释放材料加热到释放温度，从而允许激光晶片从晶片支撑件中容易地移除。

25. 发明授权

US6137305A Method and apparatus for testing laser bars 有权
标题翻译：用于测试激光棒的方法和装置
公开(公告)号：US6137305A
公开(公告)日：2000-10-24
申请号：US178900
申请日：1998-10-26
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： G01R31/26 , G01R31/28 , H01S5/00 , H01S5/02 , H01S5/40
CPC分类号： H01S5/0014 , G01R31/2635 , G01R31/2831 , H01S5/0201 , H01S5/4025
摘要： A method and apparatus are disclosed for testing individual laser chips located on a laser bar containing a plurality of chips. Laser bars are transported widthwise on a moving plastic film sheet, which is passed over an elongated pedestal which is aligned with the film sheet. The pedestal has a width which is less than the length of a laser bar, so that the unsupported portion of the plastic film under the ends of the laser bars may be drawn downward and away from the bar. This provides access to the metalized underside of the bar, which serves as a common N-contact for all of the laser chips on the bar. A probe is placed in contact with the undersurface of the bar, and at least one additional probe is placed in contact with a P-contact on one of the laser devices. A chip activation signal is applied between the two probes, and a sensor detects whether or not the chip being probed emits radiation. Failure to emit radiation or to emit radiation in an expected manner is indicative of a bad chip.
摘要翻译：公开了一种用于测试位于包含多个芯片的激光棒上的各个激光芯片的方法和装置。激光棒在移动的塑料薄膜片上沿宽度方向传送，该片移过与薄膜片对准的细长底座。基座的宽度小于激光棒的长度，使得在激光棒的端部之下的塑料膜的未支撑部分可以向下拉并远离棒。这提供了进入金属化的条的金属化的下侧，其作为棒上所有激光芯片的常见N-接触。探针放置成与棒的下表面接触，并且至少一个附加探针与其中一个激光器件上的P接触放置成接触。在两个探针之间施加芯片激活信号，并且传感器检测被探测的芯片是否发射辐射。未能以预期的方式发射辐射或发射辐射表示不良芯片。

26. 发明授权

US6109861A Apparatus and method for rotating semiconductor objects 有权
标题翻译：用于旋转半导体物体的装置和方法
公开(公告)号：US6109861A
公开(公告)日：2000-08-29
申请号：US135186
申请日：1998-08-17
申请人： Joseph Michael Freund , Raymond Frank Gruszka , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , Raymond Frank Gruszka , George John Przybylek , Dennis Mark Romero
IPC分类号： H01L21/677 , H01L21/683 , B65G47/24
CPC分类号： H01L21/67294 , H01L21/67718 , H01L21/67721 , H01L21/6838
摘要： A device and method for the automated rotating of semiconductor objects during the fabrication process is disclosed. The device uses a slotted base fixture with a channel, lifting members with ducts, and a vacuum. Semiconductor objects are rotated from a vertical position to a substantially horizontal essentially evenly spaced parallel configuration. The positioning of the semiconductor objects by the device is such that the facet end of each semiconductor object remains undisturbed. The configuration of the semiconductor objects allows for quick and easy transfer to a storage surface or transfer to further semiconductor processing steps.
摘要翻译：公开了一种在制造过程中自动旋转半导体物体的装置和方法。该设备使用具有通道的开槽底架，具有导管的提升构件和真空。半导体物体从垂直位置旋转到基本上水平的基本均匀间隔的平行配置。半导体器件由器件的定位使得每个半导体物体的刻面保持不受干扰。半导体物体的配置允许快速且容易地转移到存储表面或转移到进一步的半导体处理步骤。

27. 发明授权

US6045321A Method and apparatus for transporting laser bars 失效
标题翻译：用于传送激光棒的方法和装置
公开(公告)号：US6045321A
公开(公告)日：2000-04-04
申请号：US46409
申请日：1998-03-23
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： H01S5/40 , B25J11/00
CPC分类号： H01S5/4025
摘要： A method of transporting a laser bar, such as from a facet coat holding fixture, and an apparatus for implementing the same. A vacuum collet is automatically positioned at a predetermined position vertically and horizontally offset with respect to a facet of the laser bar. A vacuum is then applied to the vacuum collet to pull the laser bar against it and hold the laser bar in place. Since the vacuum collet is offset horizontally as well as vertically from the bar, the laser bar flips by 90.degree. when the vacuum is applied such that the laser bar longitudinal surface winds up abutting a bottom surface of the vacuum collet, and contact with the laser bar facets is substantially avoided. The vacuum collet is then transported while the vacuum is maintained to thereby transport the laser bar.
摘要翻译：传送激光棒的方法，例如从小面保持夹具固定的方法和用于实施该激光棒的装置。真空夹头自动地定位在相对于激光棒的小平面垂直和水平偏移的预定位置处。然后将真空度施加到真空夹头上以将激光棒拉向其并将激光棒保持在适当位置。由于真空夹头水平方向与棒材垂直偏移，当施加真空时，激光棒翻转90°，使得激光棒纵向表面向上靠近真空夹头的底表面并与激光器接触棒面很大程度上避免了。然后在保持真空的同时输送真空夹头，从而输送激光棒。

28. 发明授权

US6036196A Collet arrangement for integrated circuit structures 有权
标题翻译：集成电路结构的套管布置
公开(公告)号：US6036196A
公开(公告)日：2000-03-14
申请号：US178899
申请日：1998-10-26
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： B23B5/22 , B25B11/00 , B28D5/00 , H01L21/683
CPC分类号： B28D5/0094 , B25B11/007 , H01L21/6838 , Y10T279/11
摘要： The conforming, tungsten carbide collet utilized for odd shaped integrated circuit structures is replaced by a plurality of individual collects of the type utilized for integrated circuits. These are typically made of polymide, which is substantially softer than tungsten carbide. In a preferred embodiment, the elongated collect usually used with respect to laser bars is replaced by two individual collects of the type described, which contact the laser bars only near their ends.
摘要翻译：用于奇数形集成电路结构的一致的碳化钨夹头由用于集成电路的多种单独集合代替。这些通常由聚酰亚胺制成，其比碳化钨基本上软。在优选实施例中，相对于激光棒通常使用的细长收集器由所述类型的两个单独的收集器代替，其仅在其端部附近接触激光条。

29. 发明授权

US5938211A Alignment ledge for automatic and repeatable theta registration of laser bars 有权
标题翻译：激光棒自动和可重复的θ对准的对准凸缘
公开(公告)号：US5938211A
公开(公告)日：1999-08-17
申请号：US131739
申请日：1998-08-10
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero
IPC分类号： B23B5/22 , B65G47/91
CPC分类号： B65G47/91 , Y10T279/11 , Y10T279/3487
摘要： A system for positioning an article at a predetermined angular orientation with respect to a vacuum collet comprising a vacuum collet having an article pickup surface; and an alignment ledge overhanging the pickup surface, wherein the alignment ledge is at a predetermined angular orientation with respect to the vacuum collet.
摘要翻译：一种用于将制品定位在相对于真空夹头的预定角度定位处的系统，所述真空夹头包括具有物品拾取表面的真空夹头; 以及伸出拾取表面的对准凸缘，其中对准凸缘相对于真空夹头处于预定的角度定向。

30. 发明授权

US5899730A Method of handling semiconductor wafers, bars and chips 失效
标题翻译：处理半导体晶片，棒和芯片的方法
公开(公告)号：US5899730A
公开(公告)日：1999-05-04
申请号：US970982
申请日：1997-11-14
申请人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
发明人： Joseph Michael Freund , George John Przybylek , Dennis Mark Romero , John William Stayt, Jr.
IPC分类号： H01L21/301 , H01L21/673 , H01L21/68
CPC分类号： H01L21/67346 , H01L21/6836 , H01L2221/68327
摘要： The invention is a method for handling material which may be in the form of semiconductor wafers, bars, and/or chips. The material is mounted to a flexible film which is heated so as to result in an adhesion strength sufficient to hold the material in place, but low enough so that the material can be removed easily when desired.
摘要翻译：本发明是用于处理可能是半导体晶片，条和/或芯片形式的材料的方法。该材料被安装到柔性膜上，该柔性膜被加热以产生足够的粘合强度以将材料保持在适当的位置，但是足够低，使得当需要时可以容易地去除材料。

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