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21. 发明授权

US07939784B2 Electrostatic chuck support assembly 有权
标题翻译：静电吸盘支架组件
公开(公告)号：US07939784B2
公开(公告)日：2011-05-10
申请号：US12362139
申请日：2009-01-29
申请人： Robert Steger , Keith Comendant
发明人： Robert Steger , Keith Comendant
IPC分类号： B23K10/00
CPC分类号： H01L21/67248 , H01L21/6831 , Y10T279/23
摘要： A method of tuning the thermal conductivity of an electrostatic chuck (ESC) support assembly comprises measuring the temperature at a plurality of sites on a support assembly surface in which each site is associated with a given cell, determining from the measurements any fractional reduction in area suggested for each cell, and removing material from the support assembly surface within each cell in accordance with the suggested fractional reduction in order to decrease thermal conductivity in that cell. The material removal can result in an improvement to the equilibrium temperature uniformity of the electrostatic chuck support assembly at the chuck surface of an electrostatic chuck bonded to the support assembly surface, or can result in an equilibrium temperature profile of the ESC support assembly which approaches or achieves a target equilibrium temperature profile. Thermal conductivity tuning can thus take place by a method comprising defining a cell structure, determining the target areal density of each cell and removing a fractional area of material to achieve the target areal density for that cell. Material removal can be effected by drilling, routing, laser machining or grit blast machining on an X-Y table.
摘要翻译：调整静电卡盘（ESC）支撑组件的导热性的方法包括测量支撑组件表面上的多个位置处的温度，其中每个部位与给定的电池相关联，从测量中确定任何部分面积的减小建议每个电池，并根据建议的分数还原从每个电池中的支撑组件表面去除材料，以降低该电池中的热导率。材料去除可以改善静电卡盘支撑组件在与支撑组件表面接合的静电卡盘的卡盘表面处的平衡温度均匀性，或者可以导致ESC支撑组件的平衡温度分布接近或接近达到目标平衡温度曲线。因此，热导率调节可以通过包括限定单元结构，确定每个单元的目标面积密度和去除材料的分数区域以实现该单元的目标面积密度的方法发生。通过在X-Y台上进行钻孔，布线，激光加工或砂粒加工可以实现材料去除。

22. 发明申请

US20070181257A1 Faraday Shield Disposed Within An Inductively Coupled Plasma Etching apparatus 审中-公开
标题翻译：电感耦合等离子体蚀刻装置中的法拉第屏蔽
公开(公告)号：US20070181257A1
公开(公告)日：2007-08-09
申请号：US11696327
申请日：2007-04-04
申请人： Keith Comendant , Robert Steger
发明人： Keith Comendant , Robert Steger
IPC分类号： C23F1/00
CPC分类号： H01J37/32633 , H01J37/321
摘要： An apparatus and method is provided for positioning and utilizing a Faraday shield in direct exposure to a plasma within an inductively coupled plasma etching apparatus. Broadly speaking, the Faraday shield configuration maintains a condition of an etching chamber window. At a minimum, positioning the Faraday shield between the window and the plasma prevents erosion of the window resulting from plasma sputter and shunts heat generated by an etching process away from the window.
摘要翻译：提供了一种用于在电感耦合等离子体蚀刻装置内定位和利用法拉第屏蔽件直接暴露于等离子体的装置和方法。一般来说，法拉第屏蔽配置保持蚀刻室窗口的状态。至少将法拉第屏蔽定位在窗口和等离子体之间可以防止由等离子体溅射引起的窗口的侵蚀，并且将由蚀刻工艺产生的热分流离开窗口。

23. 发明授权

US07998296B2 Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system 有权
标题翻译：保护适于在等离子体处理系统中使用的衬底支架中的接合层的方法
公开(公告)号：US07998296B2
公开(公告)日：2011-08-16
申请号：US12230238
申请日：2008-08-26
申请人： Tony Ricci , Jim Tappan , Keith Comendant
发明人： Tony Ricci , Jim Tappan , Keith Comendant
IPC分类号： B32B37/00
CPC分类号： H01L21/76251 , H01L21/68757 , H01L21/68785
摘要： A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions the provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.
摘要翻译：一种保护适于在等离子体处理系统中使用的衬底支撑体中的接合层的方法。该方法包括以下步骤：用基板材料将基板支撑件的上部构件附接到基板支撑件的下部构件。粘合剂被施加到上部构件的外周和下部构件的上周边，并且保护环围绕上部构件的外周和下部构件的上周边定位。保护环最初是以提供机械稳定性和可加工性的尺寸制造的。然后将保护环加工成与衬底支撑应用的设计一致的最终尺寸的精确组合。

24. 发明申请

US20110143462A1 ADJUSTING SUBSTRATE TEMPERATURE TO IMPROVE CD UNIFORMITY 有权
标题翻译：调整基板温度以提高光盘的均匀性
公开(公告)号：US20110143462A1
公开(公告)日：2011-06-16
申请号：US12966506
申请日：2010-12-13
申请人： Keith William Gaff , Harmeet Singh , Keith Comendant , Vahid Vahedi
发明人： Keith William Gaff , Harmeet Singh , Keith Comendant , Vahid Vahedi
IPC分类号： H01L21/3065 , H01L21/66
CPC分类号： H01J37/20 , H01L21/67248 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A plasma etching system having a substrate support assembly with multiple independently controllable heater zones. The plasma etching system is configured to control etching temperature of predetermined locations so that pre-etch and/or post-etch non-uniformity of critical device parameters can be compensated for.
摘要翻译：一种等离子体蚀刻系统，具有具有多个可独立控制的加热器区域的基板支撑组件。等离子体蚀刻系统被配置为控制预定位置的蚀刻温度，从而可以补偿临界器件参数的预蚀刻和/或蚀刻后不均匀性。

25. 发明申请

US20110083318A1 QUARTZ GUARD RING CENTERING FEATURES 有权
标题翻译： QUARTZ GUARD戒指中心特点
公开(公告)号：US20110083318A1
公开(公告)日：2011-04-14
申请号：US12967717
申请日：2010-12-14
申请人： Dean J. Larson , Daniel Brown , Keith Comendant , Victor Wang
发明人： Dean J. Larson , Daniel Brown , Keith Comendant , Victor Wang
IPC分类号： B23P11/00
CPC分类号： H01J37/3255 , H01J37/32009 , H01J37/32568 , Y10T29/49002
摘要： An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.
摘要翻译：一种电极组件和使外环围绕用于半导体衬底处理的等离子体反应室中的电极组件对中的方法。该方法包括将外环围绕电极组件的背衬构件的外表面定位，并且在外环和背衬构件之间插入至少一个定心元件。定心元件可以是容纳在背衬构件的外表面上的空腔中的多个弹簧加载的定心元件，定心元件具有适于接触外圈的第一端和适于容纳弹簧的第二端。外环围绕背衬构件的外表面，使得多个弹簧加载的定心元件位于背衬构件的外表面和外环的内表面之间。

26. 发明授权

US07875824B2 Quartz guard ring centering features 有权
标题翻译：石英护环中心功能
公开(公告)号：US07875824B2
公开(公告)日：2011-01-25
申请号：US11701507
申请日：2007-02-02
申请人： Dean J. Larson , Daniel Brown , Keith Comendant , Victor Wang
发明人： Dean J. Larson , Daniel Brown , Keith Comendant , Victor Wang
IPC分类号： B23K10/00
CPC分类号： H01J37/3255 , H01J37/32009 , H01J37/32568 , Y10T29/49002
摘要： An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.
摘要翻译：一种电极组件和使外环围绕用于半导体衬底处理的等离子体反应室中的电极组件对中的方法。该方法包括将外环围绕电极组件的背衬构件的外表面定位，并且在外环和背衬构件之间插入至少一个定心元件。定心元件可以是容纳在背衬构件的外表面上的空腔中的多个弹簧加载的定心元件，定心元件具有适于接触外圈的第一端和适于容纳弹簧的第二端。外环围绕背衬构件的外表面，使得多个弹簧加载的定心元件位于背衬构件的外表面和外环的内表面之间。

27. 发明申请

US20100116788A1 Substrate temperature control by using liquid controlled multizone substrate support 审中-公开
标题翻译：通过使用液体多基质底物支持底物温度控制
公开(公告)号：US20100116788A1
公开(公告)日：2010-05-13
申请号：US12292081
申请日：2008-11-12
申请人： Harmeet Singh , Keith Comendant
发明人： Harmeet Singh , Keith Comendant
IPC分类号： B44C1/22 , C23F1/08 , C23C16/54 , C23C14/22 , C23C14/34
CPC分类号： H01L21/67248 , C23C16/4586 , C23C16/46 , C23C16/463 , C23C16/50 , C23C16/52 , H01J2237/2001 , H01L21/67109 , H01L21/6831
摘要： A substrate support useful in a reaction chamber of a plasma processing apparatus is provided. The substrate support comprises a base member and a heat transfer member overlying the base member. The heat transfer member has multiple zones to individually heat and cool each zone of the heat transfer member. An electrostatic chuck overlies the heat transfer member. The electrostatic chuck has a support surface for supporting a substrate in a reaction chamber of the plasma processing apparatus. A source of cold liquid and a source of hot liquid are in fluid communication with flow passages in each zone. A valve arrangement is operable to independently control temperature of the liquid by adjusting a mixing ratio of the hot liquid to the cold liquid circulating in the flow passages. In another embodiment, heating elements along a supply line and transfer lines heat a liquid from a liquid source before circulating in the flow passages.
摘要翻译：提供了一种用于等离子体处理装置的反应室中的基板支架。衬底支撑件包括基部构件和覆盖基底构件的传热构件。传热构件具有多个区域以分别加热和冷却传热构件的每个区域。静电吸盘覆盖传热部件。静电卡盘具有用于在等离子体处理装置的反应室中支撑基板的支撑表面。冷液源和热液体源与每个区域中的流动通道流体连通。阀装置可操作以通过调节热液体与在流动通道中循环的冷液体的混合比来独立地控制液体的温度。在另一个实施例中，沿着供应管线和输送管线的加热元件在流动通道中循环之前加热来自液体源的液体。

28. 发明授权

US07651269B2 Temperature probes having a thermally isolated tip 有权
标题翻译：具有热隔离尖端的温度探头
公开(公告)号：US07651269B2
公开(公告)日：2010-01-26
申请号：US11826941
申请日：2007-07-19
申请人： Keith Comendant
发明人： Keith Comendant
IPC分类号： G01K1/00 , G01K11/20 , G01K7/00 , G01K13/00
CPC分类号： G01K1/143 , G01K1/16
摘要： Temperature probes for measuring the temperature of objects are disclosed. The temperature probes include a housing and a tip in thermal contact with an end of the housing. The tip is adapted to contact a surface of the object whose temperature is to be measured by the temperature probe. A portion of the housing in contact with the tip has a high thermal resistance effective to thermally isolate the tip from an adjacent portion of the housing. A sensor is located inside of the housing and adapted to measure the temperature of the tip.
摘要翻译：公开了用于测量物体温度的温度探头。温度探头包括壳体和与壳体的端部热接触的尖端。尖端适于接触由温度探针测量温度的物体的表面。与尖端接触的壳体的一部分具有有效地将尖端与壳体的相邻部分热隔离的高热阻。传感器位于壳体内部并适于测量尖端的温度。

29. 发明授权

US07431788B2 Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system 有权
标题翻译：保护适于在等离子体处理系统中使用的衬底支架中的接合层的方法
公开(公告)号：US07431788B2
公开(公告)日：2008-10-07
申请号：US11183849
申请日：2005-07-19
申请人： Anthony Ricci , Jim Tappan , Keith Comendant
发明人： Anthony Ricci , Jim Tappan , Keith Comendant
IPC分类号： B32B37/00
CPC分类号： H01L21/76251 , H01L21/68757 , H01L21/68785
摘要： A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions that provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.
摘要翻译：一种保护适于在等离子体处理系统中使用的衬底支撑体中的接合层的方法。该方法包括以下步骤：用基板材料将基板支撑件的上部构件附接到基板支撑件的下部构件。粘合剂被施加到上部构件的外周和下部构件的上周边，并且保护环围绕上部构件的外周和下部构件的上周边定位。保护环最初由具有提供机械稳定性和可加工性的尺寸制成。然后将保护环加工成与衬底支撑应用的设计一致的最终尺寸的精确组合。

30. 发明申请

US20080083736A1 Method of tuning thermal conductivity of electrostatic chuck support assembly 有权
标题翻译：调整静电卡盘支撑组件的导热性的方法
公开(公告)号：US20080083736A1
公开(公告)日：2008-04-10
申请号：US11511367
申请日：2006-08-29
申请人： Robert Steger , Keith Comendant
发明人： Robert Steger , Keith Comendant
IPC分类号： H05B1/02 , H01L21/683 , B23K9/02
CPC分类号： H01L21/67248 , H01L21/6831 , Y10T279/23
摘要： A method of tuning the thermal conductivity of an electrostatic chuck (ESC) support assembly comprises measuring the temperature at a plurality of sites on a support assembly surface in which each site is associated with a given cell, determining from the measurements any fractional reduction in area suggested for each cell, and removing material from the support assembly surface within each cell in accordance with the suggested fractional reduction in order to decrease thermal conductivity in that cell. The material removal can result in an improvement to the equilibrium temperature uniformity of the electrostatic chuck support assembly at the chuck surface of an electrostatic chuck bonded to the support assembly surface, or can result in an equilibrium temperature profile of the ESC support assembly which approaches or achieves a target equilibrium temperature profile. Thermal conductivity tuning can thus take place by a method comprising defining a cell structure, determining the target areal density of each cell and removing a fractional area of material to achieve the target areal density for that cell. Material removal can be effected by drilling, routing, laser machining or grit blast machining on an X-Y table.
摘要翻译：调整静电卡盘（ESC）支撑组件的导热性的方法包括测量支撑组件表面上的多个位置处的温度，其中每个部位与给定的电池相关联，从测量中确定任何部分面积的减小建议每个电池，并根据建议的分数还原从每个电池中的支撑组件表面去除材料，以降低该电池中的热导率。材料去除可以改善静电卡盘支撑组件在与支撑组件表面接合的静电卡盘的卡盘表面处的平衡温度均匀性，或者可以导致ESC支撑组件的平衡温度分布接近或接近达到目标平衡温度曲线。因此，热导率调节可以通过包括限定单元结构，确定每个单元的目标面积密度和去除材料的分数区域以实现该单元的目标面积密度的方法发生。通过在X-Y台上进行钻孔，布线，激光加工或砂粒加工可以实现材料去除。

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