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21. 发明授权

US07477194B2 Conductive pattern and method of making 有权
标题翻译：导电图案和制作方法
公开(公告)号：US07477194B2
公开(公告)日：2009-01-13
申请号：US11294039
申请日：2005-12-05
申请人： James P. Coleman , Scott Wayne Ferguson , Jaime C. Grunlan , Ian J. Forster , Andrew W. Holman , Peikang Liu
发明人： James P. Coleman , Scott Wayne Ferguson , Jaime C. Grunlan , Ian J. Forster , Andrew W. Holman , Peikang Liu
IPC分类号： H01Q1/38
CPC分类号： H01L23/49855 , G06K19/07749 , H01L21/4846 , H01L24/95 , H01L2224/95085 , H05K1/095 , H05K1/165 , H05K3/205 , H05K3/32 , H05K3/386 , H05K2201/0347 , H05K2203/1469 , H05K2203/1545 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/49155 , Y10T156/1062
摘要： A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
摘要翻译：形成导电图案的方法包括选择性地电镀对应于图案的衬底的顶部部分，并且将导电图案与衬底分离。电镀还可以包括将导电图案电连接到电气部件。诸如包含碳颗粒的墨的导电油墨可以选择性地放置在导电基底上，以便于电镀所需图案和/或促进图案与基底的分离。导电图案的示例是用于诸如标签或标签的射频识别（RFID）设备的天线。可以电连接到天线的电气部件的一个例子是RFID带或芯片。

22. 发明申请

US20080060750A1 METHOD AND APPARATUS FOR CREATING RFID DEVICES USING PENETRABLE CARRIER 审中-公开
标题翻译：使用透明载体创建RFID设备的方法和装置
公开(公告)号：US20080060750A1
公开(公告)日：2008-03-13
申请号：US11469370
申请日：2006-08-31
申请人： Haochuan Wang , Ali Mehrabi , Stephen Li , Kouroche Kian , Xiaoming He , Peikang Liu
发明人： Haochuan Wang , Ali Mehrabi , Stephen Li , Kouroche Kian , Xiaoming He , Peikang Liu
IPC分类号： B65C9/18 , G08B13/14 , H01Q17/00 , H01R43/00
CPC分类号： G06K19/07749 , G06K19/077 , G06K19/07718 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2221/68322 , H01L2221/68354 , H01L2224/16225 , H01L2224/2919 , H01L2224/75 , H01L2224/7565 , H01L2224/7598 , H01L2224/81001 , H01L2224/81191 , H01L2224/83192 , H01L2224/83851 , H01L2224/90 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , Y10T29/49018 , Y10T29/49117 , H01L2924/00 , H01L2224/0401
摘要： A method for assembling a semiconductor device from a plurality of chips is disclosed. The method includes providing a penetrable carrier having a penetrable carrier substrate and an adhesive layer; providing a plurality of chips disposed on a surface of the adhesive layer; providing a second substrate; bringing the surface of the adhesive layer of the penetrable carrier close to the second substrate; pinning the plurality of chips against the second substrate through the penetrable carrier; and, moving the penetrable carrier away from the second substrate such that the plurality of pinned chips are removed from the surface of the adhesive layer on the penetrable carrier.
摘要翻译：公开了一种从多个芯片组装半导体器件的方法。该方法包括提供具有可穿透的载体基底和粘合剂层的可穿透载体; 提供设置在所述粘合剂层的表面上的多个芯片; 提供第二基板; 将可穿透载体的粘合剂层的表面接近第二基底; 通过可穿透的载体将多个芯片固定在第二基板上; 并且使可穿透的载体从第二基板移开，使得多个被钉扎的芯片从可穿透的载体上的粘合剂层的表面移除。

23. 发明授权

US07224280B2 RFID device and method of forming 有权
标题翻译： RFID设备和成型方法
公开(公告)号：US07224280B2
公开(公告)日：2007-05-29
申请号：US10871169
申请日：2004-06-18
申请人： Scott Wayne Ferguson , David N. Edwards , Peikang Liu , Jason Munn , Ian J. Forster , Samuel A. Linder , Thomas Craig Weakley , David Puleston , Steven C. Kennedy , Christine U. Dang
发明人： Scott Wayne Ferguson , David N. Edwards , Peikang Liu , Jason Munn , Ian J. Forster , Samuel A. Linder , Thomas Craig Weakley , David Puleston , Steven C. Kennedy , Christine U. Dang
IPC分类号： H01Q13/14
CPC分类号： G06K19/07752 , G06K19/07745 , G06K19/07749 , G06K19/07756 , H01L2224/16 , H01L2924/01046 , H01L2924/01079 , H01L2924/1461 , H01L2924/3011 , H01Q1/22 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , Y10T29/49124 , H01L2924/00
摘要： A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.
摘要翻译：射频识别（RFID）嵌体包括芯片和天线之间的电连接。电气连接包括导电插入引线和电容连接。电容连接可能涉及将天线和插入器引线紧密接合，其间具有介电垫，以允许天线和插入器引线之间的电容耦合。介电垫可以包括非导电粘合剂和高介电材料，例如氧化钛。这些连接提供了方便，快速和有效的方式来操作地耦合天线和插入器。 RFID嵌体可以是RFID标签或RFID标签的一部分。

24. 发明授权

US6096101A Method of preparing electrochemical cells 失效
公开(公告)号：US6096101A
公开(公告)日：2000-08-01
申请号：US811845
申请日：1997-03-05
申请人： Peikang Liu , Porter Mitchell , Feng Gao
发明人： Peikang Liu , Porter Mitchell , Feng Gao
IPC分类号： H01M4/04 , H01M4/131 , H01M4/133 , H01M4/1391 , H01M4/1393 , H01M4/62 , H01M10/052 , H01M10/0525 , H01M10/0565 , H01M10/058 , H01M10/36 , H01M6/00
CPC分类号： H01M4/623 , H01M10/052 , H01M10/0565 , H01M10/058 , H01M4/04 , H01M4/0402 , H01M4/0404 , H01M4/0409 , H01M4/0435 , H01M4/131 , H01M4/133 , H01M4/1391 , H01M4/1393 , H01M4/621 , H01M10/0525 , Y02P70/54 , Y10T29/49108
摘要： Anodes, cathodes, and/or solid electrolytes (or separator layers) of an electrochemical cell can be fabricated from aqueous compositions containing monomers and/or polymers. In one formulation, the aqueous composition contains binding materials that are polymerized and crosslinked. In a second formulation, the composition is a latex having as aqueous phase and a solid polymer phase. Upon removal of water, the compositions provide a polymeric structure suitable for use as an electrode or solid electrolyte.

25. 发明授权

US6015639A Thermally stable, highly conductive salt 失效
标题翻译：热稳定，高导电性盐
公开(公告)号：US6015639A
公开(公告)日：2000-01-18
申请号：US16608
申请日：1998-01-30
申请人： Feng Gao , Jeremy Barker , Peikang Liu
发明人： Feng Gao , Jeremy Barker , Peikang Liu
IPC分类号： H01B1/12 , H01M10/0525 , H01M10/0568 , H01M6/18
CPC分类号： H01M10/0568 , H01B1/122 , H01M10/0525
摘要： The invention provides a new family of compounds and a method of making the compounds. The new compounds are useful as ion conductive salts, and particularly useful as salts for batteries. The compounds of the invention are prepared from three principal reagents, bis (trifluoromethanesufonyl) methane (CF.sub.3 SO.sub.2).sub.2 CH.sub.2 ; benzoyl chloride; and pyridine which facilitates reaction and then is removed. A precursor sodium salt (CF.sub.3 SO.sub.2).sub.2 CHNa is first prepared. Then, equimolar amounts of the precursor sodium salt and pyridine are dissolved in anhydrous acetonitrile. A stoichiometric amount of the selected substitute benzoyl chloride is then added drop by drop. After addition of Li.sub.3 PO.sub.4, there is pyridine release and formation of the product of the aforesaid two reagents. In the benzene ring, R.sub.1, R.sub.2, R.sub.3, R.sub.4, and R.sub.5 are each identical or different and are each independently selected from hydrogen and an electron withdrawing substituent.
摘要翻译：本发明提供一种新的化合物族和一种制备该化合物的方法。新化合物可用作离子导电盐，并且特别用作电池的盐。本发明的化合物由三种主要试剂，二（三氟甲磺酰基）甲烷（CF 3 SO 2）2 CH 2; 苯甲酰氯; 和吡啶，这有助于反应然后被除去。首先制备前体钠盐（CF 3 SO 2）2 CHNa。然后将等摩尔量的前体钠盐和吡啶溶于无水乙腈中。然后逐滴加入化学计量的所选择的替代苯甲酰氯。添加Li3PO4后，存在吡啶释放并形成上述两种试剂的产物。在苯环中，R 1，R 2，R 3，R 4和R 5各自相同或不同，各自独立地选自氢和吸电子取代基。

26. 发明授权

US5720780A Film forming method for lithium ion rechargeable batteries 失效
标题翻译：锂离子充电电池成膜方法
公开(公告)号：US5720780A
公开(公告)日：1998-02-24
申请号：US743286
申请日：1996-11-04
申请人： Peikang Liu , Feng Gao
发明人： Peikang Liu , Feng Gao
IPC分类号： H01M2/16 , H01M4/13 , H01M4/62 , H01M6/18 , H01M10/052 , H01M10/0525 , H01M10/0565 , H01M6/00
CPC分类号： H01M10/0525 , H01M10/052 , H01M10/0565 , H01M2/164 , H01M4/13 , H01M2/1646 , H01M2/1653 , H01M2300/0085 , H01M4/62 , H01M4/621 , H01M6/181 , H01M6/188 , Y10T29/49108
摘要： A novel processing method provides a separator or electrode film demonstrating good physical properties and excellent conductive properties. Specifically, a binder of a suitable polymer, such as a polyvinylidene difluoride (PVdF) homopolymer, and a filler material such as silica or alumina are homogenized, such as by ball milling, to form a mixture free of solvents or plasticizers. An appropriate plasticizer, such as dimethyl adipate, is mixed into the binder and filler materials, and the resulting material is formed into a sheet. The sheet is hot pressed or melt processed at a temperature greater than the softening point but less than the melting point of the polymer mix. Electrode films can also be made using the method herein.
摘要翻译：新颖的加工方法提供了表现出良好物理性能和优异导电性能的隔膜或电极膜。具体地说，将诸如聚偏二氟乙烯（PVdF）均聚物和填料如二氧化硅或氧化铝的合适聚合物的粘合剂如球磨使其均化，以形成不含溶剂或增塑剂的混合物。将适当的增塑剂如己二酸二甲酯混合到粘合剂和填充材料中，并将所得材料形成为片材。片材在大于软化点但小于聚合物混合物的熔点的温度下进行热压或熔融加工。也可以使用本文的方法制造电极膜。

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