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21. 发明授权

US06354916B1 Modified plating solution for plating and planarization and process utilizing same 有权
公开(公告)号：US06354916B1
公开(公告)日：2002-03-12
申请号：US09544558
申请日：2000-04-06
申请人： Cyprian Uzoh , Bulent Basol , Homayoun Talieh
发明人： Cyprian Uzoh , Bulent Basol , Homayoun Talieh
IPC分类号： B24B100
CPC分类号： B24B37/042 , C25D3/38 , C25D7/12 , H01L21/2885 , H01L21/3212 , H01L21/7684 , H01L21/76877 , H01L23/53228 , H01L2924/0002 , H01L2924/00
摘要： A modified plating solution that can be used to electroplate a high quality conductive material that can be effectively polished and planarized includes (1) a solvent, (2) an ionic species of the conductive material to be deposited, (3) at least one additive to improve electrical and structural properties, and (4) a modifying agent.

22. 发明申请

US20070066054A1 Method of forming contact layers on substrates 有权
标题翻译：在基片上形成接触层的方法
公开(公告)号：US20070066054A1
公开(公告)日：2007-03-22
申请号：US11232718
申请日：2005-09-21
申请人： Cyprian Uzoh , Bulent Basol , Hung-Ming Wang , Homayoun Talieh
发明人： Cyprian Uzoh , Bulent Basol , Hung-Ming Wang , Homayoun Talieh
IPC分类号： H01L21/44
CPC分类号： H01L21/2885 , C25D5/02 , C25D7/123 , C25D17/005
摘要： A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.
摘要翻译：提供了一种用于在基板的表面上制造可移除接触结构以在电加工期间将电从接触构件传导到表面的方法。该方法包括在表面上形成导电层。导电层的预定区域被接触层选择性地涂覆，使得当在导电层上进行电处理时，接触构件接触接触层。

23. 发明申请

US20050269212A1 Method of making rolling electrical contact to wafer front surface 失效
标题翻译：制造与晶片正面滚动电接触的方法
公开(公告)号：US20050269212A1
公开(公告)日：2005-12-08
申请号：US11123268
申请日：2005-05-05
申请人： Homayoun Talieh , Cyprian Uzoh , Bulent Basol
发明人： Homayoun Talieh , Cyprian Uzoh , Bulent Basol
IPC分类号： C25D5/06 , B23H3/00 , B23H3/04 , B23H5/08 , C25D7/12 , C25D17/00 , C25D21/00 , C25F7/00 , H01L21/288
CPC分类号： B23H3/04 , B23H5/08 , C25D5/08 , C25D17/00 , C25D17/001 , C25D17/005 , C25F7/00 , H01L21/2885
摘要： Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
摘要翻译：可以通过包括第一和第二导电元件的特定装置来提供导电材料在包含导电材料的电解质的衬底的包括半导体晶片的表面上的基本均匀沉积。第一导电元件可以具有相同或不同构造的多个电触点，或者可以是导电焊盘的形式，并且可以在基本上所有的衬底表面上与衬底表面接触或以其他方式电互连。当在电解质与衬底表面和第二导电元件物理接触的同时在第一和第二导电元件之间施加电势时，导电材料沉积在衬底表面上。可以使施加在阳极和阴极之间的电压的极性反转，从而可以对沉积的导电材料进行电蚀刻。

24. 发明授权

US06413388B1 Pad designs and structures for a versatile materials processing apparatus 失效
标题翻译：垫片设计和结构，用于多功能材料加工设备
公开(公告)号：US06413388B1
公开(公告)日：2002-07-02
申请号：US09511278
申请日：2000-02-23
申请人： Cyprian Uzoh , Bulent Basol , Homayoun Talieh
发明人： Cyprian Uzoh , Bulent Basol , Homayoun Talieh
IPC分类号： C25D1700
CPC分类号： B24B37/26 , B23H5/08 , C25D17/001 , C25D17/14
摘要： An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member contains a plurality of channels, each forming a passage from the top surface to the bottom surface, and each allowing the electrolyte and electric field flow therethrough. A pad is attached to the rigid member via a fastener. The pad also allows for electrolyte and electric field flow therethrough to the substrate.
摘要翻译：提供一种能够辅助控制用于处理基板的电解质流动和电场分布的装置。它包括具有预定形状的顶表面和底表面的刚性构件。刚性构件包括多个通道，每个通道形成从顶表面到底表面的通道，并且每个通道允许电解质和电场流过其中。垫通过紧固件附接到刚性构件。衬垫还允许电解质和电场流过衬底。

25. 发明申请

US20060006060A1 Method and apparatus for processing a substrate with minimal edge exclusion 审中-公开
标题翻译：用于处理具有最小边缘排除的基板的方法和装置
公开(公告)号：US20060006060A1
公开(公告)日：2006-01-12
申请号：US11225913
申请日：2005-09-13
申请人： Bulent Basol , Cyprian Uzoh , Homayoun Talieh
发明人： Bulent Basol , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25D17/00
CPC分类号： C25D5/02 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/3212 , H01L21/76877
摘要： An apparatus for processing a material on a surface of a wafer having a diameter includes a cavity defined by a peripheral wall terminating at a peripheral edge and having at least one lateral dimension smaller than the wafer diameter and at least one lateral dimension larger than the wafer diameter and configured to hold a process solution proximate to the peripheral edge such that the process solution will always contact a first wafer surface region, a head configured to hold the wafer above the cavity peripheral edge so that the surface of the wafer faces the cavity, and an electrical contact member positioned outside the cavity peripheral wall and configured to contact a second wafer surface region where the lateral dimension of the cavity is smaller than the wafer diameter and to maintain electrical contact with the wafer when the wafer is moved relative to the contact member. Advantages of the invention include substantially full surface treatment of the wafer.
摘要翻译：一种用于处理具有直径的晶片表面上的材料的设备包括由外围壁限定的空腔，该外围壁终止于外围边缘并具有至少一个小于晶片直径的横向尺寸和至少一个大于晶片的横向尺寸并且被配置为将处理溶液保持靠近外围边缘，使得处理溶液将始终接触第一晶片表面区域，头部被配置为将晶片保持在空腔周边边缘上方，使得晶片的表面面向空腔，以及电接触构件，其定位在所述腔周壁外部并且被配置为接触所述腔的横向尺寸小于所述晶片直径的第二晶片表面区域，并且当所述晶片相对于所述触点移动时与所述晶片保持电接触会员。本发明的优点包括晶片的基本全表面处理。

26. 发明申请

US20050145484A1 Apparatus for avoiding particle accumulation in electrochemical processing 审中-公开
标题翻译：用于避免电化学处理中的颗粒积聚的装置
公开(公告)号：US20050145484A1
公开(公告)日：2005-07-07
申请号：US11057297
申请日：2005-02-10
申请人： Bulent Basol , Cyprian Uzoh , Homayoun Talieh
发明人： Bulent Basol , Cyprian Uzoh , Homayoun Talieh
IPC分类号： B08B1/04 , B24B37/04 , B24B53/00 , B24B53/007 , C25D5/22 , C25D7/12 , C25F3/16 , H01L21/288 , H01L21/304 , H01L21/768 , B23H7/26
CPC分类号： B24B53/017 , B24B37/04 , B24B53/001 , C25D5/22 , C25D17/001 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary method, the workpiece surface influencing device is occasionally placed in contact with a conditioning substrate coated with an inert material, and the bias applied to the electrodeposition system is reversed. According to another exemplary method, the workpiece surface influencing device is conditioned using mechanical contact members, such as brushes, and conditioning of the workpiece surface influencing device occurs, for example, through physical brushing of the workpiece surface influencing device with the brushes. According to a further exemplary method, the workpiece surface influencing device is rotated in different direction during electrodeposition.
摘要翻译：提出了用于去除或减小在电沉积期间使用的工件表面影响装置上形成金属颗粒的尺寸并限制金属颗粒形成或生长的速率的系统和方法。根据示例性的方法，工件表面影响装置偶尔地与涂覆有惰性材料的调理基板接触，并且施加到电沉积系统的偏压被反转。根据另一示例性方法，使用诸如刷子的机械接触构件对工件表面影响装置进行调节，并且例如通过用刷子物理刷刷工件表面影响装置来发生工件表面影响装置的调节。根据另一示例性方法，在电沉积期间，工件表面影响装置在不同方向上旋转。

27. 发明申请

US20050042873A1 Method and system to provide electroplanarization of a workpiece with a conducting material layer 审中-公开
标题翻译：提供工件与导电材料层的电平面化的方法和系统
公开(公告)号：US20050042873A1
公开(公告)日：2005-02-24
申请号：US10925358
申请日：2004-08-23
申请人： Cyprian Uzoh , Bulent Basol , Homayoun Talieh
发明人： Cyprian Uzoh , Bulent Basol , Homayoun Talieh
IPC分类号： C25F3/14 , H01L21/288 , H01L21/321 , H01L21/768 , H01L23/532 , H01L27/10 , H01L21/302 , H01L21/461
CPC分类号： H01L21/76843 , C25F3/14 , H01L21/288 , H01L21/32115 , H01L21/3212 , H01L21/7684 , H01L21/76849 , H01L21/76867 , H01L21/76886 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods to operate upon a nonplanar top surface of a conductive surface layer of a workpiece, so as to, for example, preserve the structural integrity of a dielectric film layer disposed below the conductive surface layer, are presented. According to an exemplary method, a layer of conducting material such as a conducting paste is applied over the nonplanar top surface of the conductive surface layer to obtain a planar top surface. At least a portion of the conducting material layer and at least a portion of the conductive surface layer are removed in a planar manner to at least partially planarize the nonplanar top surface. The conducting material layer may be annealed so that the conducting material layer diffuses with the conductive surface layer prior to removal of at least the portions of conducting material layer and the conductive surface layer.
摘要翻译：提供了在工件的导电表面层的非平面顶表面上操作以便例如保持设置在导电表面层下方的电介质膜层的结构完整性的系统和方法。根据示例性方法，在导电表面层的非平面顶表面上施加诸如导电浆料的导电材料层以获得平坦的顶表面。导电材料层的至少一部分和导电表面层的至少一部分以平面方式去除，以至少部分平坦化非平面顶表面。导电材料层可以退火，使得在去除至少导电材料层和导电表面层的部分之前，导电材料层与导电表面层扩散。

28. 发明授权

US06413403B1 Method and apparatus employing pad designs and structures with improved fluid distribution 失效
标题翻译：使用具有改进的流体分布的垫设计和结构的方法和装置
公开(公告)号：US06413403B1
公开(公告)日：2002-07-02
申请号：US09621969
申请日：2000-07-21
申请人： Paul Lindquist , Bulent Basol , Cyprian Uzoh , Homayoun Talieh
发明人： Paul Lindquist , Bulent Basol , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25D500
CPC分类号： B24B37/26 , B23H5/08 , C25D17/001 , C25D17/14
摘要： An apparatus capable of assisting in controlling an electrolyte flow and distribution of an electric field, a magnetic field, or an electromagnetic field in order to process a substrate is provided with improved fluid distribution. A support member having a top surface and a bottom surface contains at least one support member electrolyte channel. Each support member electrolyte channel forms a passage between the top surface and the bottom surface and allows the electrolyte to flow therethrough. A pad is attachable to the support member and contains at least one set of pad electrolyte channels also allowing for electrolyte flow therethrough to the substrate. Each support member electrolyte channel is connected to one set of pad electrolyte channels by fluid distribution structure. A method of assisting in control of the electrolyte flow and distribution of the electric field, the magnetic field, or the electromagnetic field, utilizing the apparatus, is also provided.
摘要翻译：能够有助于控制电解质流动和电场分布，磁场或电磁场以便处理衬底的装置提供改进的流体分布。具有顶表面和底表面的支撑构件包含至少一个支撑构件电解质通道。每个支撑构件电解质通道在顶表面和底表面之间形成通道，并允许电解质流过其中。衬垫可附接到支撑构件并且包含至少一组衬垫电解质通道，还允许电解质流过衬底。每个支撑构件电解质通道通过流体分配结构连接到一组垫片电解质通道。还提供了一种利用该装置协助控制电解质流动和分布电场，磁场或电磁场的方法。

29. 发明授权

US07309413B2 Providing electrical contact to the surface of a semiconductor workpiece during processing 有权
标题翻译：在加工期间向半导体工件的表面提供电接触
公开(公告)号：US07309413B2
公开(公告)日：2007-12-18
申请号：US10459321
申请日：2003-06-10
申请人： Homayoun Talieh , Cyprian Uzoh , Bulent M. Basol
发明人： Homayoun Talieh , Cyprian Uzoh , Bulent M. Basol
IPC分类号： C25D5/04 , C25D7/12 , C25F3/12
CPC分类号： B23H3/04 , B23H5/08 , C25D5/08 , C25D17/00 , C25D17/001 , C25D17/005 , C25F7/00 , H01L21/2885
摘要： Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
摘要翻译：可以通过包括第一和第二导电元件的特定装置来提供导电材料在包含导电材料的电解质的衬底的包括半导体晶片的表面上的基本均匀沉积。第一导电元件可以具有相同或不同构造的多个电触点，或者可以是导电焊盘的形式，并且可以在基本上所有的衬底表面上与衬底表面接触或以其他方式电互连。当在电解质与衬底表面和第二导电元件物理接触的同时在第一和第二导电元件之间施加电势时，导电材料沉积在衬底表面上。可以使施加在阳极和阴极之间的电压的极性反转，从而可以对沉积的导电材料进行电蚀刻。

30. 发明申请

US20050034976A1 Method and apparatus for plating and polishing semiconductor substrate 有权
标题翻译：电镀和抛光半导体衬底的方法和装置
公开(公告)号：US20050034976A1
公开(公告)日：2005-02-17
申请号：US10946703
申请日：2004-09-21
申请人： Homayoun Talieh , Cyprian Uzoh
发明人： Homayoun Talieh , Cyprian Uzoh
IPC分类号： B24B37/16 , C25D5/06 , C25D5/22 , C25D7/12 , C25D17/00 , C25D17/12 , C25D17/14 , C25F7/00 , H01L21/288 , H01L21/304 , H01L21/3205 , H01L21/321 , C25D5/48
CPC分类号： B24B37/16 , C25D5/06 , C25D5/22 , C25D7/123 , C25D17/001 , C25D17/14 , C25F7/00 , H01L21/3212
摘要： The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used for plating/depositing the conductive material and another chamber can be used for polishing the semiconductor substrate. The plating/depositing process can be performed using brush plating or electro chemical mechanical deposition and the polishing process can be performed using electropolishing or chemical mechanical polishing. The present invention further provides a method and apparatus for intermittently applying the conductive material to the semiconductor substrate and also intermittently polishing the substrate when such conductive material is not being applied to the substrate. Furthermore, the present invention provides a method and apparatus that plates/deposits and/or polishes a conductive material and improves the electrolyte mass transfer properties on a substrate using a novel anode assembly.
摘要翻译：本发明提供一种在半导体衬底上沉积/沉积导电材料然后抛光相同衬底的方法和装置。这通过在单个设备中提供多个室来实现，其中一个室可以用于电镀/沉积导电材料，并且另一个室可以用于抛光半导体衬底。电镀/沉积工艺可以使用刷镀或电化学机械沉积进行，并且可以使用电抛光或化学机械抛光进行抛光工艺。本发明还提供一种用于将导电材料间歇地施加到半导体衬底的方法和装置，并且当这种导电材料未被施加到衬底时也间歇地抛光衬底。此外，本发明提供了一种使用新型阳极组件对导电材料进行平板/沉积和/或抛光并改善基板上的电解质传质性质的方法和装置。

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