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21. 发明申请

US20100053883A1 METHODS AND APPARATUS FOR COOLING ELECTRONIC DEVICES THROUGH USER INTERFACES 有权
标题翻译：通过用户界面冷却电子设备的方法和装置
公开(公告)号：US20100053883A1
公开(公告)日：2010-03-04
申请号：US12241009
申请日：2008-09-29
申请人： Ihab A. Ali , Bemard K. Rihn
发明人： Ihab A. Ali , Bemard K. Rihn
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/203
摘要： An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device.
摘要翻译：电子设备可以设置有容纳在壳体内的用户界面部件和冷却部件。壳体可以包括具有穿过其形成的开口的至少一个表面，并且使用者界面可以包括通过其形成的一个端口。用户接口端口可以提供在壳体开口和冷却部件之间的通道的至少第一部分。通道可允许在冷却部件和壳体开口之间更换流体以冷却电子设备。

22. 发明申请

US20100051243A1 METHODS AND APPARATUS FOR COOLING ELECTRONIC DEVICES USING FLOW SENSORS 有权
标题翻译：使用流量传感器冷却电子设备的方法和装置
公开(公告)号：US20100051243A1
公开(公告)日：2010-03-04
申请号：US12241010
申请日：2008-09-29
申请人： Ihab A. Ali , Frank Liang
发明人： Ihab A. Ali , Frank Liang
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： G06F1/203 , G06F1/1613 , G06F1/206 , H01L23/34 , H01L23/467 , H01L2924/0002 , Y02D10/16 , H01L2924/00
摘要： An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.
摘要翻译：电子设备可以设置有具有限定空腔的至少一个壁和至少部分地包含在腔内的流量传感器的壳体。流量传感器可以被配置为检测与通过空腔的第一部分的流体的流动相关的流动特性。电子设备还可以包括被配置为基于检测到的流量特性来改变电子设备的性能特性的处理器。

23. 发明授权

US07397164B1 Substantially noiseless cooling device for electronic devices 有权
标题翻译：电子设备基本无噪声的冷却装置
公开(公告)号：US07397164B1
公开(公告)日：2008-07-08
申请号：US10912788
申请日：2004-08-06
申请人： Ihab A. Ali
发明人： Ihab A. Ali
IPC分类号： H01L41/04
CPC分类号： F04D33/00 , G06F1/203
摘要： A cooling device of an electronic component. The cooling device comprises a carrier having one or more openings, a piezoelectric member moveably disposed in one of the openings, a plurality of conductive wires disposed within the carrier and extending into the openings, wherein one or more conductive wires being coupled to the piezoelectric member, and an interconnecting member connecting the conductive wires to a power source, wherein when power is supplied, the piezoelectric member vibrates to circulate air and dissipate heat.
摘要翻译：电子部件的冷却装置。冷却装置包括具有一个或多个开口的载体，可移动地设置在其中一个开口中的压电元件，设置在载体内并延伸到开口中的多个导线，其中一个或多个导线连接到压电元件以及将导线连接到电源的互连构件，其中当供电时，压电构件振动以使空气循环并散发热量。

24. 发明授权

US06353538B1 Protective cover and packaging for multi-chip memory modules 有权
标题翻译：多芯片内存模块的保护盖和封装
公开(公告)号：US06353538B1
公开(公告)日：2002-03-05
申请号：US09311783
申请日：1999-05-13
申请人： Ihab A. Ali , Shawn S. McEuen
发明人： Ihab A. Ali , Shawn S. McEuen
IPC分类号： H05K700
CPC分类号： H01L23/3675 , H01L25/0655 , H01L2924/0002 , H01L2924/00
摘要： A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generating varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, the packaging cover consists of a plastic material having a sheet of metal coupled to an interior surface of the packaging cover. In one embodiment, the packaging cover includes two separate covers, with a first cover having an insert pin, and a second cover having an insert receptacle to receive the insert pin. In an alternative embodiment, the first cover of the packaging cover includes a set of clip snaps to secure a coupling between the first cover and a second cover of the packaging cover.
摘要翻译：一种存储器模块，其具有封装封装封装封装的板，该板具有多个单独的芯片，其动态地产生变化量的热量。包装盖在多个分离的存储器芯片之间提供局部散热。单独的芯片通过一组焊球与板相互连接。包装盖还提供了板和芯片的刚性封装。在一个实施例中，存储器模块包括在封装盖内移动的导热物质，以将热量从分离的芯片传导到包装盖。在一个实施例中，包装盖由具有耦合到包装盖的内表面的金属片的塑料材料组成。在一个实施例中，包装盖包括两个单独的盖，第一盖具有插入销，第二盖具有用于接收插入销的插入件插座。在替代实施例中，包装盖的第一盖包括一组夹扣，以固定第一盖和包装盖的第二盖之间的联接。

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