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21. 发明授权

US08269226B2 Light emitting device, and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08269226B2
公开(公告)日：2012-09-18
申请号：US13215397
申请日：2011-08-23
申请人： Ji Hyung Moon , Sang Youl Lee , Chung song Kim , Kwang Ki Choi , June O Song
发明人： Ji Hyung Moon , Sang Youl Lee , Chung song Kim , Kwang Ki Choi , June O Song
IPC分类号： H01L27/15
CPC分类号： H01L33/44 , H01L33/20 , H01L33/382 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device including a light emitting structure including a second conductive type semiconductor layer, an active layer, and a first conductive type semiconductor layer, and a first protective layer disposed on a side of the light emitting structure, wherein the first protective layer overlaps with the first conductive type semiconductor layer in a vertical direction.
摘要翻译：一种包括发光结构的发光器件，包括第二导电类型半导体层，有源层和第一导电类型半导体层，以及设置在发光结构侧的第一保护层，其中第一保护层重叠第一导电类型半导体层在垂直方向上。

22. 发明申请

US20120138969A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING DEVICE WITH THE SAME 有权
标题翻译：发光装置，发光装置包装，以及具有该发光装置的照明装置
公开(公告)号：US20120138969A1
公开(公告)日：2012-06-07
申请号：US13242345
申请日：2011-09-23
申请人： Ji Hyung Moon , Sang Youl Lee , Chung song Kim , June O Song , Kwang Ki Choi
发明人： Ji Hyung Moon , Sang Youl Lee , Chung song Kim , June O Song , Kwang Ki Choi
IPC分类号： H01L33/60
CPC分类号： H01L33/382 , F21K9/00 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/387 , H01L33/405 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： The present invention relates to a light emitting device, a light emitting device package, and a lighting device with the same. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a second electrode layer formed on an underside of the light emitting structure connected to the second conductive type semiconductor layer electrically, a first electrode layer in contact with the first conductive type semiconductor layer passed through the second conductive type semiconductor layer and the active layer, and an insulating layer formed between the second electrode layer and the first electrode layer, between the second conductive type semiconductor layer and the first electrode layer, and between the active layer and the first electrode layer.
摘要翻译：本发明涉及一种发光器件，发光器件封装以及具有该发光器件的照明器件。发光器件包括：发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层，形成在与第二导电类型半导体层连接的发光结构的下侧上的第二电极层与通过第二导电类型半导体层和有源层的第一导电类型半导体层接触的第一电极层和形成在第二电极层和第一电极层之间的绝缘层，在第二导电类型半导体层和第一电极层，以及有源层和第一电极层之间。

23. 发明授权

US08766287B2 Light emitting device, light emitting device package, and lighting device with the same 有权
标题翻译：发光装置，发光装置封装和照明装置
公开(公告)号：US08766287B2
公开(公告)日：2014-07-01
申请号：US13242345
申请日：2011-09-23
申请人： Ji Hyung Moon , Sang Youl Lee , Chung Song Kim , Kwang Ki Choi , June O Song
发明人： Ji Hyung Moon , Sang Youl Lee , Chung Song Kim , Kwang Ki Choi , June O Song
IPC分类号： H01L29/18 , H01L33/38 , H01L25/075 , H01L33/62 , H01L27/15 , H01L33/20 , F21K99/00
CPC分类号： H01L33/382 , F21K9/00 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/387 , H01L33/405 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： The present invention relates to a light emitting device, a light emitting device package, and a lighting device with the same.The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a second electrode layer formed on an underside of the light emitting structure connected to the second conductive type semiconductor layer electrically, a first electrode layer in contact with the first conductive type semiconductor layer passed through the second conductive type semiconductor layer and the active layer, and an insulating layer formed between the second electrode layer and the first electrode layer, between the second conductive type semiconductor layer and the first electrode layer, and between the active layer and the first electrode layer.
摘要翻译：本发明涉及一种发光器件，发光器件封装以及具有该发光器件的照明器件。发光器件包括：发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层，形成在与第二导电类型半导体层连接的发光结构的下侧上的第二电极层与通过第二导电类型半导体层和有源层的第一导电类型半导体层接触的第一电极层和形成在第二电极层和第一电极层之间的绝缘层，在第二导电类型半导体层和第一电极层，以及有源层和第一电极层之间。

24. 发明申请

US20110291140A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 审中-公开
标题翻译：发光装置和发光装置包装
公开(公告)号：US20110291140A1
公开(公告)日：2011-12-01
申请号：US13116192
申请日：2011-05-26
申请人： Kwang Ki Choi , Ji hyung Moon , June O Song , Sang Youl Lee , Tae Yeon Seong , Se Yeon Jung , Joon Woo Jeon , Seong Han Park
发明人： Kwang Ki Choi , Ji hyung Moon , June O Song , Sang Youl Lee , Tae Yeon Seong , Se Yeon Jung , Joon Woo Jeon , Seong Han Park
IPC分类号： H01L33/10 , H01L33/26
CPC分类号： H01L33/40 , H01L33/0079 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/405 , H01L2224/48091 , H01L2224/48247 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Provided is a light emitting device. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a gallium barrier layer on the light emitting structure layer, and a metal electrode layer on the gallium barrier layer.
摘要翻译：提供了一种发光装置。发光器件包括发光结构层，该发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层，发光结构层上的镓阻挡层，以及镓势垒上的金属电极层层。

25. 发明授权

US08674389B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08674389B2
公开(公告)日：2014-03-18
申请号：US13339513
申请日：2011-12-29
申请人： Hwan Hee Jeong , Ji Hyung Moon , Sang Youl Lee , June O Song
发明人： Hwan Hee Jeong , Ji Hyung Moon , Sang Youl Lee , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/42 , H01L33/22 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first and second conductive type semiconductor layers, an electrode on the first conductive type semiconductor layer, a reflective layer under the second conductive type semiconductor layer, a protective layer on an outer portion of the reflective layer, the protective layer including a first portion between the reflective layer and the second conductive layer, and a second portion that extends beyond the second conductive type semiconductor layer; and a light extraction structure including a compound semiconductor on the second portion of the protective layer.
摘要翻译：公开了一种发光器件和发光器件封装。发光器件包括在第一和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构，第一导电类型半导体层上的电极，反射在所述第二导电类型半导体层下面的层，在所述反射层的外部部分上的保护层，所述保护层包括在所述反射层和所述第二导电层之间的第一部分，以及延伸超过所述第二导电类型半导体的第二部分层; 以及在保护层的第二部分上包括化合物半导体的光提取结构。

26. 发明授权

US08581277B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08581277B2
公开(公告)日：2013-11-12
申请号：US13528453
申请日：2012-06-20
申请人： Ji Hyung Moon , Hwan Hee Jeong , Sang Youl Lee , June O Song
发明人： Ji Hyung Moon , Hwan Hee Jeong , Sang Youl Lee , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/20 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed are a light emitting device. The light emitting device includes a light emitting structure including a first and second conductive semiconductors, and an active layer; an insulating layer on a lateral surface of the light emitting structure; an electrode on the first conductive semiconductor layer; an electrode layer under the second conductive semiconductor layer; and a protective layer including a first portion between the light emitting structure and the electrode layer and a second portion extending outward beyond a lower surface of the light emitting structure, wherein the first conductive semiconductor layer includes a first top surface including a roughness on a first region, and a second top surface lower than the first region and being closer the lateral surface of the light emitting structure than the first region, wherein the second top surface is disposed on an edge portion of the first conductive semiconductor layer.
摘要翻译：公开了一种发光器件。发光器件包括包括第一和第二导电半导体的发光结构和有源层; 在所述发光结构的侧表面上的绝缘层; 第一导电半导体层上的电极; 第二导电半导体层下面的电极层; 以及包括发光结构和电极层之间的第一部分的保护层和向外延伸超过发光结构的下表面的第二部分，其中第一导电半导体层包括第一顶表面，第一顶表面包括在第一以及比第一区域低的第二顶表面，并且比第一区域更靠近发光结构的侧表面，其中第二顶表面设置在第一导电半导体层的边缘部分上。

27. 发明申请

US20110193058A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME 有权
标题翻译：发光装置和具有该发光装置的发光装置包装
公开(公告)号：US20110193058A1
公开(公告)日：2011-08-11
申请号：US13024883
申请日：2011-02-10
申请人： Ji Hyung MOON , Hwan Hee JEONG , Sang Youl LEE , June O Song
发明人： Ji Hyung MOON , Hwan Hee JEONG , Sang Youl LEE , June O Song
IPC分类号： H01L33/06
CPC分类号： H01L33/58 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/20 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the first conductive type semiconductor layer includes a stepped structure having a second top surface stepped lower than the first top surface thereof; an insulating layer disposed on a lateral surface of the light emitting structure and the second top surface of the first conductive type semiconductor layer; an electrode electrically connected with the first conductive type semiconductor layer; an electrode layer under the second conductive type semiconductor layer; and a protective layer disposed on a periphery portion of a lower surface of the second conductive type semiconductor layer.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括在第一导电类型半导体层和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构，其中第一导电类型半导体层包括阶梯式结构，其具有比第一顶表面低的第二顶表面; 绝缘层，设置在所述发光结构的侧表面和所述第一导电类型半导体层的所述第二顶表面上; 与第一导电型半导体层电连接的电极; 第二导电型半导体层下的电极层; 以及设置在所述第二导电型半导体层的下表面的周边部分上的保护层。

28. 发明授权

US08354664B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08354664B2
公开(公告)日：2013-01-15
申请号：US13024883
申请日：2011-02-10
申请人： Ji Hyung Moon , Hwan Hee Jeong , Sang Youl Lee , June O Song
发明人： Ji Hyung Moon , Hwan Hee Jeong , Sang Youl Lee , June O Song
IPC分类号： H01L29/06
CPC分类号： H01L33/58 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/20 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the first conductive type semiconductor layer includes a stepped structure having a second top surface stepped lower than the first top surface thereof; an insulating layer disposed on a lateral surface of the light emitting structure and the second top surface of the first conductive type semiconductor layer; an electrode electrically connected with the first conductive type semiconductor layer; an electrode layer under the second conductive type semiconductor layer; and a protective layer disposed on a periphery portion of a lower surface of the second conductive type semiconductor layer.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括在第一导电类型半导体层和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构，其中第一导电类型半导体层包括阶梯式结构，其具有比第一顶表面低的第二顶表面; 绝缘层，设置在所述发光结构的侧表面和所述第一导电类型半导体层的所述第二顶表面上; 与第一导电型半导体层电连接的电极; 第二导电型半导体层下的电极层; 以及设置在所述第二导电型半导体层的下表面的周边部分上的保护层。

29. 发明授权

US08143639B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08143639B2
公开(公告)日：2012-03-27
申请号：US13011479
申请日：2011-01-21
申请人： Hwan Hee Jeong , Ji Hyung Moon , Sang Youl Lee , June O Song
发明人： Hwan Hee Jeong , Ji Hyung Moon , Sang Youl Lee , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/42 , H01L33/22 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, an electrode on the first conductive type semiconductor layer, a reflective layer under the second conductive type semiconductor layer, a protective layer at outer peripheral portions of a lower surface of the second conductive type semiconductor layer, and a light extraction structure including a compound semiconductor on the protective layer.
摘要翻译：公开了一种发光器件和发光器件封装。发光器件包括在第一导电类型半导体层和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构，第一导电类型的电极半导体层，第二导电类型半导体层下面的反射层，在第二导电类型半导体层的下表面的外周部分处的保护层，以及在保护层上包括化合物半导体的光提取结构。

30. 发明授权

US08552452B2 Light emitting device and lighting instrument including the same 有权
标题翻译：发光装置和照明器具等
公开(公告)号：US08552452B2
公开(公告)日：2013-10-08
申请号：US13213767
申请日：2011-08-19
申请人： Hwan Hee Jeong , Sang Youl Lee , Young kyu Jeong , Chung song Kim , June O Song , Kwang Ki Choi , Eun Joo Kim
发明人： Hwan Hee Jeong , Sang Youl Lee , Young kyu Jeong , Chung song Kim , June O Song , Kwang Ki Choi , Eun Joo Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/387 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a light emitting device including, a second electrode layer, a light emitting structure that includes a second conductive semiconductor layer, an active layer and a first conductive semiconductor layer and that is provided on the second electrode layer, a first electrode layer that includes a pad part and an electrode part connected to the pad part and that is provided on the light emitting structure, and a current blocking layer arranged between the second electrode layer and the light emitting structure in such a way that a part of the current block layer overlaps to correspond to the first electrode layer, wherein a width of the current blocking layer corresponding to the electrode part is different depending upon a clearance with the pad part.
摘要翻译：公开了一种发光器件，包括第二电极层，发光结构，其包括第二导电半导体层，有源层和第一导电半导体层，并且设置在第二电极层上，第一电极层包括焊盘部分和连接到焊盘部分并且设置在发光结构上的电极部分以及布置在第二电极层和发光结构之间的电流阻挡层，使得当前阻挡层的一部分重叠以对应于第一电极层，其中对应于电极部分的电流阻挡层的宽度根据与焊盘部分的间隙而不同。

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