专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US08567940B2 Medium feed device and recording apparatus 有权
标题翻译：介质进料装置和记录装置
公开(公告)号：US08567940B2
公开(公告)日：2013-10-29
申请号：US13015048
申请日：2011-01-27
申请人： Hiroyuki Tajima
发明人： Hiroyuki Tajima
IPC分类号： B41J2/01
CPC分类号： B41J2/01 , B65H9/00
摘要： A medium feed device has a configuration in which a feed section is provided to send a medium in the front-and-back direction of the medium feed device, the device includes a guide member which guides the medium in the back face side of the medium feed device, the guide member is provided to be capable of being extended and contracted in a direction connecting the base end side and the free-end side of the guide member, and the guide member forms a feed pathway for the medium which is held to have a roll shape which is sent further from the back face side than the guide member, in a first state where the guide member is contracted, and forms a feed pathway for a fed medium of a single sheet shape which is sent from the guide member, in a second state where the guide member is extended.
摘要翻译：介质供给装置具有这样的构造，其中设置有馈送部分以在介质供给装置的前后方向上发送介质，该装置包括引导构件，该引导构件在介质的背面侧引导介质引导构件设置成能够在与引导构件的基端侧和自由端侧连接的方向上伸缩，并且引导构件形成用于介质的进给通路，具有在引导构件收缩的第一状态下从背面侧进一步送出的辊状，并且形成从引导构件发送的单片状的供给介质的供给路径在引导构件延伸的第二状态下。

22. 发明授权

US08368108B2 Light emitting element housing package 失效
标题翻译：发光元件外壳包装
公开(公告)号：US08368108B2
公开(公告)日：2013-02-05
申请号：US13137930
申请日：2011-09-21
申请人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
发明人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2933/0091 , H01L2924/00014
摘要： A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a light emitting element chip is electrically connected, wherein a white thin film layer formed from a sintered body of white inorganic particles is formed on at least an upper surface of the wiring pattern, except a connection region in the wiring pattern to be connected to the light emitting element chip.
摘要翻译：一种发光元件外壳封装，包括其上安装有发光元件的陶瓷基板，以及形成在陶瓷基板上并与发光元件芯片电连接的布线图案，其中形成有白色薄膜层除了要连接到发光元件芯片的布线图案中的连接区域之外，在布线图案的至少上表面上形成白色无机颗粒的烧结体。

23. 发明申请

US20120155086A1 LED MODULE FOR LIGHTING 有权
标题翻译： LED模组照明
公开(公告)号：US20120155086A1
公开(公告)日：2012-06-21
申请号：US13330892
申请日：2011-12-20
申请人： Syota SHIMONISHI , Hiroyuki Tajima , Yosuke Tsuchiya , Hideaki Kato
发明人： Syota SHIMONISHI , Hiroyuki Tajima , Yosuke Tsuchiya , Hideaki Kato
IPC分类号： F21V21/00
CPC分类号： H05K1/026 , F21K9/00 , F21V25/10 , F21Y2105/10 , F21Y2115/10 , H05B33/0821 , H05K1/0269 , H05K2201/09381 , H05K2201/10106 , H05K2201/2054 , H05K2203/162 , Y02B20/341
摘要： An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost.An LED module for lighting includes a wiring substrate having a plurality of wiring patterns formed thereon, and a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit. In the LED module, the wiring patterns comprises an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit, the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the wiring patterns with the LED chips, and forms guard electrodes, and both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.
摘要翻译：本发明的目的是提供一种能够以低成本保护LED芯片免受过电压的LED模块。用于照明的LED模块包括其上形成有多个布线图案的布线基板和连接到布线图案的多个LED芯片，以构成串联电路或串联并联电路。在LED模块中，布线图案包括构成电路的阳极侧电极的阳极侧布线图案和构成电路的阴极侧电极的阴极侧布线图案，阳极侧布线图案和阴极侧布线图案设置成围绕LED芯片的布线图案的连接区域形成保护电极，并且阳极侧布线图案的两个边缘部分分别面对具有间隙的阴极侧布线图案的两个边缘部分。

24. 发明申请

US20120067085A1 Method of manufacturing light-emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：US20120067085A1
公开(公告)日：2012-03-22
申请号：US13137150
申请日：2011-07-22
申请人： Seiji Yamaguchi , Koji Tasumi , Hiroyuki Tajima , Satoshi Wada , Miki Moriyama , Kazuya Aida , Hiroki Watanabe
发明人： Seiji Yamaguchi , Koji Tasumi , Hiroyuki Tajima , Satoshi Wada , Miki Moriyama , Kazuya Aida , Hiroki Watanabe
IPC分类号： C03B23/20
CPC分类号： C03C27/00 , H01L33/56 , H01L2224/13 , H01L2933/005
摘要： A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.
摘要翻译：一种制造包括安装在基板上并用玻璃密封的发光元件的发光装置的方法。该方法包括通过加热至高于玻璃的屈服点的温度的第一模具加热玻璃，玻璃与第一模具接触，并将玻璃压靠在安装在基板上的发光元件上，第二模具由第二模具模具用玻璃密封发光元件。

25. 发明授权

US07758041B2 Clutch apparatus, conveyance apparatus and recording apparatus 失效
标题翻译：离合器装置，输送装置和记录装置
公开(公告)号：US07758041B2
公开(公告)日：2010-07-20
申请号：US11833597
申请日：2007-08-03
申请人： Tokujiro Okuno , Hiroyuki Tajima , Kiyotaka Nakamura
发明人： Tokujiro Okuno , Hiroyuki Tajima , Kiyotaka Nakamura
IPC分类号： B65H5/00 , B65H1/08
CPC分类号： F16D11/06 , B65H3/0607 , B65H3/0661 , B65H3/34 , B65H3/56 , B65H3/565 , B65H2220/09 , B65H2301/4222 , B65H2403/421 , B65H2403/47 , B65H2403/512 , B65H2403/70 , B65H2513/412 , F16D11/16
摘要： [Object] To provide a clutch apparatus that can smoothly switch from a clutch engaged state to a clutch non-engaged state, while tooth jump does not occur even with a small-sized clutch apparatus.[Solving Means] A recessed portion 153 is provided in a cam face of a cam 45. A cam shaft 13 is configured to pivot by a predetermined amount as a cam follower 51 is fitted in the recessed portion, and, when the cam initiates to engage the cam follower, it enters a clutch engaged state. A driven side gear 99 is pivoted by a predetermined amount as the cam follower is fitted in the recessed portion and, thereby, a clutch member 93 is rotated by a predetermined amount in a direction in which a toothed portion 94 is spaced apart from a drive side gear 92. In a state where the cam follower is not fitted in the recessed portion, when the clutch member 93 switches its clutch state, at least a portion of a swing locus of the toothed portion 94 of the clutch member 93 maintains a clearance with a gear tooth of the drive side gear 92.
摘要翻译：本发明提供一种能够从离合器接合状态顺利地切换到离合器未接合状态的离合器装置，而即使使用小型离合器装置也不会发生跳齿。 [解决方案]凹凸部153设置在凸轮45的凸轮面中。凸轮轴13构造成当凸轮从动件51装配在凹部中时枢转预定量，并且当凸轮开始接合凸轮从动件，它进入离合器接合状态。从动侧齿轮99随着凸轮从动件嵌合在凹部中而枢转预定量，因此离合器构件93沿齿形部分94与驱动器间隔开的方向旋转预定量在凸轮从动件未装配在凹部中的状态下，当离合器构件93切换离合器状态时，离合器构件93的齿部94的摆动轨迹的至少一部分保持间隙与驱动侧齿轮92的齿轮齿。

26. 发明申请

US20100052006A1 Light emitting semiconductor device 有权
标题翻译：发光半导体器件
公开(公告)号：US20100052006A1
公开(公告)日：2010-03-04
申请号：US12585058
申请日：2009-09-02
申请人： Shigeo Takeda , Hiroyuki Tajima , Shota Shimonishi , Yosuke Tsuchiya
发明人： Shigeo Takeda , Hiroyuki Tajima , Shota Shimonishi , Yosuke Tsuchiya
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/507 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum.
摘要翻译：发光半导体器件包括：基底; 包括晶体生长基础的发光半导体元件，并且设置在所述基底基板上，使得所述晶体生长基底面向与所述基底基板相反的方向; 密封基底基板上的发光半导体的第一透明密封介质; 以及第二透明密封介质，其密封所述第一透明密封介质上的所述发光半导体并且包含磷光体。发光强度高的部分的第二密封介质的厚度大于第一密封介质的其他部分的厚度; 并且具有高发光强度的部分被定义为来自发光半导体元件的发光强度最大的部分。

27. 发明申请

US20090206718A1 LED lamp module 有权
标题翻译： LED灯模组
公开(公告)号：US20090206718A1
公开(公告)日：2009-08-20
申请号：US12320824
申请日：2009-02-05
申请人： Shota Shimonishi , Hiroyuki Tajima , Toshimasa Hayashi , Hideki Kokubu
发明人： Shota Shimonishi , Hiroyuki Tajima , Toshimasa Hayashi , Hideki Kokubu
IPC分类号： H01J61/52
CPC分类号： F21V29/70 , F21K9/00 , F21V19/0015 , F21V29/87 , F21V29/89 , H01L33/64 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion. The LED lamp module includes a cover covering a part of the LED lamp other than the light output surface and the flexible board and pressing the LED lamp
摘要翻译：本发明提供一种LED灯模块，包括金属基座，安装在金属基底上的柔性基板，具有通孔，表面安装型LED灯，其包括在陶瓷封装的背面上具有突出部分的陶瓷封装， LED芯片安装在陶瓷封装上，并具有光输出面。突出部分通过通孔与金属基座热连接，并且LED灯通过导电构件在突出部分之外的部分处与柔性板电连接。 LED灯模块包括覆盖除了光输出表面之外的LED灯的一部分的盖和柔性板并按压LED灯

28. 发明申请

US20050116456A1 Vehicular shock absorbing body 失效
标题翻译：车辆减震体
公开(公告)号：US20050116456A1
公开(公告)日：2005-06-02
申请号：US10988841
申请日：2004-11-16
申请人： Hiroyuki Tajima , Takahiko Sato , Osamu Fukawatase , Takeaki Kato
发明人： Hiroyuki Tajima , Takahiko Sato , Osamu Fukawatase , Takeaki Kato
IPC分类号： B60R21/00 , B60R21/02 , B60R21/04 , B60R21/045
CPC分类号： B60R21/045 , B60R2021/0051 , B60R2021/0414
摘要： The invention provides a vehicular shock absorbing body which absorbs a shock by a grid-like rib formed on a support plate portion and can inhibit a load point at an initial stage and a terminal stage, in a load-displacement (F-S) curve of the vehicular shock absorbing body. A shock absorbing body (40) used for absorbing a shock in a vehicle and made of a synthetic resin, is provided with a support plate portion (42), and a shock absorbing portion (45) formed in a grid shape on the support plate portion (42) by a plurality of thin ribs (44, 44), and plastically deforming at a time of applying a shock load so as to be absorbable a shock energy. A notch (a leading end side notch) 48 is formed between grid crossing points (46) in the thin rib (44) from a leading end side, and a notch (a root side notch) 50 is formed from a root side of the grid crossing points (46) so as to include the support plate portion (42), thereby inhibiting a load point from being generated at an initial stage and a terminal stage in the F-S curve.
摘要翻译：本发明提供了一种车辆冲击吸收体，其通过形成在支撑板部分上的格栅状肋吸收冲击，并且能够抑制在初始阶段和末端阶段的载荷位置（FS）曲线中的载荷点车辆减震体。用于吸收车辆中的冲击并由合成树脂制成的减震体（40）设置有支撑板部分（42）和在支撑板上形成为格子状的冲击吸收部分（45）部分（42）由多个薄肋（44,44）构成，并且在施加冲击载荷时塑性变形以便可吸收冲击能。从前端侧在薄肋（44）的格栅交叉点（46）之间形成有切口（前端侧切口）48，并且从切口（根侧切口）50的根侧形成有切口栅格交叉点（46），以包括支撑板部分（42），从而阻止在FS曲线的初始阶段和终端阶段产生负载点。

29. 外观设计

USD689450S1 Light emitting diode 有权
公开(公告)号：USD689450S1
公开(公告)日：2013-09-10
申请号：US29424056
申请日：2012-06-07
申请人： Syota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya , Akira Sengoku
设计人： Syota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya , Akira Sengoku

30. 发明申请

US20120074445A1 Light emitting element housing package 失效
标题翻译：发光元件外壳包装
公开(公告)号：US20120074445A1
公开(公告)日：2012-03-29
申请号：US13137930
申请日：2011-09-21
申请人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
发明人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2933/0091 , H01L2924/00014
摘要： A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a light emitting element chip is electrically connected, wherein a white thin film layer formed from a sintered body of white inorganic particles is formed on at least an upper surface of the wiring pattern, except a connection region in the wiring pattern to be connected to the light emitting element chip.
摘要翻译：一种发光元件外壳封装，包括其上安装有发光元件的陶瓷基板，以及形成在陶瓷基板上并与发光元件芯片电连接的布线图案，其中形成有白色薄膜层除了要连接到发光元件芯片的布线图案中的连接区域之外，在布线图案的至少上表面上形成白色无机颗粒的烧结体。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式