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    • 21. 发明申请
    • THIN FILM MAGNETIC HEAD AND MANUFACTURING METHOD THEREOF
    • 薄膜磁头及其制造方法
    • US20090045162A1
    • 2009-02-19
    • US12252411
    • 2008-10-16
    • Yoshitaka SASAKIHiroyuki ItohTakehiro KamigamaTatsushi Shimizu
    • Yoshitaka SASAKIHiroyuki ItohTakehiro KamigamaTatsushi Shimizu
    • G11B5/33B05D5/12
    • G11B5/3116G11B5/1278
    • A thin film magnetic head has a configuration in which a main magnetic pole film having a magnetic pole end portion on a medium opposing surface (ABS) side facing a magnetic disk, a write shield film facing the magnetic pole end portion so as to form a recording gap film on the medium opposing surface side, and a thin film coil wound around at least a part of the write shield film are laminated. Further, the thin film magnetic head has an upper yoke magnetic pole film whose size is larger than that of the main magnetic pole film at a part more distant from the ABS than the recording gap film, and this upper yoke magnetic pole film is bonded to the side of the main magnetic pole film close to the thin film coil. In the upper yoke magnetic pole film, an end portion on the ABS side is retracted in a direction apart from the ABS in accordance with an increase in film thickness which is measured from the surface of the main magnetic pole film.
    • 薄膜磁头具有这样的结构,其中在与磁盘相对的介质相对表面(ABS)侧上具有磁极端部的主磁极膜,面对磁极端部的写入屏蔽膜以形成 记录间隙膜在介质相对表面侧上,并且缠绕在写保护膜的至少一部分上的薄膜线圈。 此外,薄膜磁头具有比记录间隙膜更远离ABS的部分的尺寸大于主磁极膜的上磁轭磁极膜,并且该上磁轭磁极膜粘合到 主磁极膜的一侧靠近薄膜线圈。 在上磁轭磁极膜中,根据从主磁极膜的表面测量的膜厚度的增加,ABS侧的端部沿与ABS隔离的方向缩回。
    • 22. 发明授权
    • Magnetic head for perpendicular magnetic recording and method of manufacturing same
    • 用于垂直磁记录的磁头及其制造方法
    • US07468864B2
    • 2008-12-23
    • US10880509
    • 2004-07-01
    • Yoshitaka SasakiDong-Hong LiShigeki TanemuraHiroyuki Itoh
    • Yoshitaka SasakiDong-Hong LiShigeki TanemuraHiroyuki Itoh
    • G11B5/31
    • G11B5/1278Y10T428/11Y10T428/1107
    • A pole layer has an end located in a medium facing surface, the end having: a first side close to a substrate; a second side located opposite to the first side; a third side connecting an end of the first side to an end of the second side; and a fourth side connecting the other end of the first side to the other end of the second side. The second side defines a track width. The end of the pole layer located in the medium facing surface has a width that decreases toward the first side. The pole layer is disposed in a groove of a pole-layer-encasing layer made of a nonmagnetic insulating material, with a nonmagnetic conductive film provided between the encasing layer and the pole layer. The pole layer incorporates: a first layer located closer to the surface of the groove; and a second layer located farther from the surface of the groove.
    • 极层具有位于介质面向表面中的端部,其端部具有靠近基板的第一侧面; 与第一侧相对的第二侧; 连接所述第一侧端部与所述第二侧端部的第三侧面; 以及将第一侧的另一端与第二侧的另一端连接的第四侧。 第二面定义轨道宽度。 位于介质相对表面中的极层的端部具有朝向第一侧减小的宽度。 极层设置在由非磁性绝缘材料制成的极层包裹层的沟槽中,其中设置在包层和极层之间的非磁性导电膜。 极层包括:位于更靠近凹槽表面的第一层; 以及位于距凹槽表面更远的第二层。
    • 23. 发明申请
    • Load sensor
    • 负载传感器
    • US20080121511A1
    • 2008-05-29
    • US11998086
    • 2007-11-28
    • Yukihiro SaitohHiroyuki Itoh
    • Yukihiro SaitohHiroyuki Itoh
    • H01H35/00
    • B60N2/002B60R21/01516G01G19/4142
    • A load sensor is provided as a seat sensor that includes a first film formed in a linear shape, a second film formed in the same shape as the first film and arranged facing the first film, sensor electrodes arranged between the first film and the second film facing each other. The electrodes are normally spaced apart from each other and come in contact with each other upon receiving a load. The electrodes are connected to a connector through a conducting portion arranged between the first film and the second film. The seat sensor is disposed on a seat where a large compressive force is applied by a passenger.
    • 本发明提供负载传感器作为座椅传感器,该座椅传感器包括形成为直线状的第一膜,与第一膜成形为相同形状且与第一膜相对配置的第二膜,布置在第一膜和第二膜之间的传感器电极 面对对方 电极通常彼此间隔开并且在接收到负载时彼此接触。 电极通过布置在第一膜和第二膜之间的导电部分连接到连接器。 座椅传感器设置在乘客施加大的压缩力的座椅上。
    • 25. 发明授权
    • Laminate coil and brushless motor using same
    • 层压线圈和无刷电机采用相同
    • US07291956B2
    • 2007-11-06
    • US10523822
    • 2003-08-07
    • Hiroyuki ItohTadaaki Hourai
    • Hiroyuki ItohTadaaki Hourai
    • H02K17/00
    • H02K3/26Y10T29/49071
    • A laminate coil for an integral n-phase motor (n is a natural number of 2 or more) having pluralities of coil poles formed by patterned conductor coils formed in a laminate constituted by pluralities of insulating layers, the laminate coil comprising input and output terminals formed on an outer surface of the laminate, a first connecting line connecting the input terminal to the coil poles, and second connecting lines series-connecting coil poles having the same polarity, the first and second connecting lines being formed by conductor patterns, and the coil poles being formed on pluralities of insulating layers sandwiched by the first and second connecting lines.
    • 一种用于整体n相电动机的层叠线圈(n为2以上的自然数),具有由多个绝缘层构成的层叠体中形成的图案化导体线圈形成的多个线圈极,层叠线圈包括输入和输出端子 形成在所述层叠体的外表面上,将所述输入端子连接到所述线圈极的第一连接线和具有相同极性的第二连接线串联连接线圈极,所述第一和第二连接线由导体图案形成, 线圈极被形成在被第一和第二连接线夹持的多个绝缘层上。
    • 28. 发明申请
    • Method for manufacturing semiconductor device or semiconductor wafer
    • 制造半导体器件或半导体晶片的方法
    • US20070139857A1
    • 2007-06-21
    • US11641913
    • 2006-12-20
    • Kaori WatanabeHiroyuki ItohTakatoshi Hattori
    • Kaori WatanabeHiroyuki ItohTakatoshi Hattori
    • H01T23/00
    • H01L21/67051H01L21/67219
    • A method for manufacturing a semiconductor device or a semiconductor wafer is provided, in which a removal of slurry that is adherently remained on the back surface of the semiconductor wafer can be ensured without a need for employing an increased dimension of apparatus. An edge portion of a semiconductor wafer is polished while a back surface of the semiconductor wafer is chucked to a chucking unit of a first polishing unit, and then, the polished semiconductor wafer is dechucked from the chucking unit of the first polishing unit. Next, a predetermined gap is formed in a location above the chucking unit of the second polishing unit, and the semiconductor wafer is disposed therein. Water is discharged form the chucking unit of the second polishing unit to clean the back surface of the semiconductor wafer W. Thereafter, the back surface of the semiconductor wafer is chucked to the chucking unit of the second polishing unit, and then the semiconductor wafer is polished.
    • 提供了一种用于制造半导体器件或半导体晶片的方法,其中可以确保去除粘附在半导体晶片的背表面上的浆料,而不需要采用增加的设备尺寸。 抛光半导体晶片的边缘部分,同时将半导体晶片的背面夹持到第一抛光单元的夹持单元,然后将抛光的半导体晶片从第一抛光单元的夹持单元中拔出。 接下来,在第二研磨单元的夹持单元上方的位置形成预定的间隙,并且在其中配置半导体晶片。 水从第二研磨单元的夹持单元排出,以清洁半导体晶片W的背面。然后,将半导体晶片的背面夹持到第二研磨单元的夹持单元,然后将半导体晶片 抛光
    • 30. 发明授权
    • Optical amplifier
    • 光放大器
    • US07215464B1
    • 2007-05-08
    • US11396551
    • 2006-04-04
    • Kosuke KomakiHiroyuki Itoh
    • Kosuke KomakiHiroyuki Itoh
    • H04B4/00H04B10/12
    • H04B10/296H04B2210/003
    • Optical amplifier which can eliminate the need for an optical detection section before an external attenuating medium, can prevent SN degradation, and can reduce power required for pumping light. An attenuation amount detection section detects an amount of signal light attenuation caused by a variable optical attenuator and the external attenuating medium connected in series, by means of a front optical detection section provided before the variable optical attenuator and the external attenuating medium and a back optical detection section provided thereafter. An attenuation amount control section controls the variable optical attenuator such that the amount of signal light attenuation detected by the attenuation amount detection section is kept constant. A connection detection section detects a connection or disconnection of the external attenuating medium in accordance with the amount of signal light attenuation obtained when the amount of attenuation caused by the variable optical attenuator is minimized.
    • 可以消除在外部衰减介质之前需要光学检测部分的光放大器,可以防止SN降级,并且可以减少泵浦光所需的功率。 衰减量检测部分通过设置在可变光衰减器和外部衰减介质之前的前光检测部分和后光学器件来检测由可变光衰减器和外部衰减介质串联连接的信号光衰减量 检测部分。 衰减量控制部分控制可变光衰减器,使得衰减量检测部分检测到的信号光衰减量保持不变。 连接检测部分根据由可变光衰减器引起的衰减量最小化时获得的信号光衰减量来检测外部衰减介质的连接或断开。