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    • 22. 发明授权
    • Nonvolatile semiconductor memory device and manufacturing method thereof
    • 非易失性半导体存储器件及其制造方法
    • US08581326B2
    • 2013-11-12
    • US12727644
    • 2010-03-19
    • Shigeto OotaYoshimasa MikajiriRyouhei Kirisawa
    • Shigeto OotaYoshimasa MikajiriRyouhei Kirisawa
    • H01L29/788H01L21/336
    • H01L29/792H01L27/11578H01L27/11582H01L27/1203H01L29/66833H01L29/7926
    • A nonvolatile semiconductor memory device including first laminated bodies each having a plurality of first gate electrodes of first memory cells, second laminated bodies each having a plurality of second gate electrodes of second memory cells, gate insulating film portions located on side surfaces of the first and second laminated bodies, first semiconductor layers that are each located between the first and second laminated bodies, first select transistors connected to an uppermost one of the first memory cells, second select transistors connected to an uppermost one of the second memory cells, isolation insulating films to separate the first and second select transistors into portions on the first and second laminated body sides, and a substrate potential applying electrode located to penetrate the isolation insulating films from a front surface side to a back surface side and connected to the first semiconductor layers.
    • 一种非易失性半导体存储器件,包括:第一层叠体,其具有第一存储单元的多个第一栅电极;第二层叠体,每个第二层叠体具有第二存储单元的多个第二栅电极,位于第一存储单元的侧表面的栅绝缘膜部; 第二层叠体,各自位于第一和第二层叠体之间的第一半导体层,连接到第一存储单元中的最上面的第一选择晶体管,连接到第二存储单元中最上面的第一选择晶体管,隔离绝缘膜 将第一和第二选择晶体管分离成第一和第二层叠体侧的部分,以及位于从前表面侧到背面侧穿透隔离绝缘膜并连接到第一半导体层的衬底电位施加电极。
    • 24. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08320182B2
    • 2012-11-27
    • US12725827
    • 2010-03-17
    • Ryouhei KirisawaMasaru KitoShigeto OotaYoshimasa Mikajiri
    • Ryouhei KirisawaMasaru KitoShigeto OotaYoshimasa Mikajiri
    • G11C11/34G11C16/04
    • G11C16/14G11C16/0483G11C16/10G11C16/26H01L27/11582
    • A nonvolatile semiconductor memory device includes: a memory unit; and a control unit. The memory unit includes: first and second memory strings including first and second memory transistors with first and second select gates, respectively; and first and second wirings connected thereto. In a selective erase operation of a selected cell transistor of the first memory transistors, the control unit applies V1 voltage to the first wiring, applies V2 voltage lower than V1 to a selected cell gate of the selected cell transistor, applies V3 voltage not higher than V1 and higher than V2 to a non-selected cell gate of the first memory transistors, applies V1 or V4 voltage not higher than V1 and not lower than V3 to the first select gate, and applies V2 or V4 voltage higher than V2 and not higher than V3 to the second wiring or sets the second wiring in a floating state.
    • 非易失性半导体存储器件包括:存储器单元; 和控制单元。 存储单元包括:第一和第二存储器串,分别包括具有第一和第二选择栅极的第一和第二存储器晶体管; 以及与其连接的第一和第二布线。 在第一存储晶体管的所选单元晶体管的选择性擦除操作中,控制单元向第一布线施加V1电压,向所选单元晶体管的选定单元栅极施加低于V1的V2电压,施加不高于 V1并且高于V2到第一存储晶体管的未选择的单元栅极,向第一选择栅施加不高于V1且不低于V3的V1或V4电压,并且施加V2或V4电压高于V2而不是更高 而不是V3到第二布线,或将第二布线置于浮置状态。