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    • 26. 发明授权
    • Residue removing liquid composition and method for cleaning semiconductor element using same
    • 残渣除去液组合物及使用其的半导体元件的清洗方法
    • US08623587B2
    • 2014-01-07
    • US13057338
    • 2009-07-07
    • Kyoko KamataKeiichi TanakaHiroshi Matsunaga
    • Kyoko KamataKeiichi TanakaHiroshi Matsunaga
    • G03F7/26
    • H01L21/02071C11D7/10C11D7/244C11D7/261C11D7/34C11D7/5004C11D7/5013C11D7/5022C11D11/0047H01L21/02063
    • Provided are a residue removing liquid composition capable of completely removing a resist residue and a titanium (Ti)-derived residue that remains after dry etching and ashing in via hole formation in a production process for a semiconductor substrate having metal wiring of aluminum (Al) or an Al alloy, at a low temperature in a short time, not corroding parts of an interlayer insulating material, a wiring material and others, and a cleaning method for semiconductor devices using it.The residue removing liquid composition contains (A) ammonium fluoride, (B) methanesulfonic acid, (C) a carbon-carbon triple bond-having compound, (D) a water-soluble organic solvent, and (E) water, wherein the content of (A), (C), (D) and (E) in the residue removing liquid composition is from 0.005 to 2% by mass, from 0.1 to 10% by mass, from 60 to 75% by mass and from 5 to 38% by mass, respectively, and (B) is contained in an amount of from 0.9 to 1.5 times (by mol) the amount of (A).
    • 本发明提供一种残留物除去液体组合物,其能够在具有铝(Al)金属配线的半导体基板的制造工序中完全除去抗蚀剂残渣和残留在通孔形成中的干法蚀刻和灰化之后残留的钛(Ti) 或Al合金,在短时间内的低温下,不会腐蚀层间绝缘材料的部分,布线材料等,以及使用它的半导体器件的清洁方法。 除去残渣的液体组合物含有(A)氟化铵,(B)甲磺酸,(C)具有碳 - 碳三键的化合物,(D)水溶性有机溶剂和(E)水, 残渣除去液组合物中的(A),(C),(D)和(E)为0.005〜2质量%,0.1〜10质量%,60〜75质量% 38质量%,(B)的含量为(A)的量的0.9〜1.5倍(摩尔)。
    • 27. 发明申请
    • SILICON ETCHANT AND METHOD FOR PRODUCING TRANSISTOR BY USING SAME
    • 硅蚀刻剂及其制造方法
    • US20130203263A1
    • 2013-08-08
    • US13819107
    • 2011-07-26
    • Kenji ShimadaHiroshi Matsunaga
    • Kenji ShimadaHiroshi Matsunaga
    • H01L21/306
    • H01L21/30604H01L21/02068H01L21/32134H01L29/51H01L29/66545H01L29/78
    • According to the present invention, there is provided an etching solution used for selectively etching a dummy gate made of silicon in a process for producing a transistor including a laminate formed of at least a high dielectric material film and an aluminum metal gate by the method of removing the dummy gate made of silicon to replace the dummy gate with the aluminum metal gate, and a process for producing a transistor using the etching solution. The present invention relates to a silicon etching solution used for etching the dummy gate made of silicon which includes 0.1 to 40% by weight of at least one alkali compound selected from the group consisting of ammonia, a diamine and a polyamine represented by the general formula (1), 5 to 50% by weight of at least one polyhydric alcohol represented by the general formula (2) and 40 to 94.9% by weight of water, and a process for producing a transistor using the silicon etching solution.
    • 根据本发明,提供了一种用于在制造包括由至少高介电材料膜和铝金属栅极形成的层压体的晶体管的工艺中选择性地蚀刻由硅制成的虚拟栅极的蚀刻溶液,其方法为 去除由硅制成的虚拟栅极以用铝金属栅极替代伪栅极,以及使用该蚀刻溶液制造晶体管的工艺。 本发明涉及用于蚀刻由硅制成的虚拟栅极的硅蚀刻溶液,其包括0.1至40重量%的至少一种选自氨,二胺和由通式表示的多胺的碱金属化合物 (1),5〜50重量%的由通式(2)表示的至少一种多元醇和40〜94.9重量%的水,以及使用硅蚀刻溶液制造晶体管的方法。