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21. 发明授权

US07123272B2 Game machine, game title display control method and program 有权
标题翻译：游戏机，游戏标题显示控制方法和程序
公开(公告)号：US07123272B2
公开(公告)日：2006-10-17
申请号：US10107059
申请日：2002-03-28
申请人： Shinji Moriyama
发明人： Shinji Moriyama
IPC分类号： G09G5/00 , A63F13/00 , G06F3/00
CPC分类号： A63F13/52 , A63F13/10 , A63F13/44 , A63F13/92 , A63F2300/204 , A63F2300/66
摘要： A game machine capable of causing a player to pay attention to a game title image. The game machine comprises a default game title image storing section (52), an optional game title image storing section (54), an operation input section (60), a selection section (62), and a display section (64). When no game operation input is made within a predetermined time after a predetermined timing, the selection section (62) selects a default game title image so that the default game title image is displayed by the display section (62). When any game operation input is made within a predetermined time, on the other hand, either a default or optional game title image is displayed by the display section (62) depending on whether the content of the game operation input satisfies a predetermined condition.
摘要翻译：一种能够使玩家注意游戏标题图像的游戏机。游戏机包括默认游戏标题图像存储部分（52），可选游戏标题图像存储部分（54），操作输入部分（60），选择部分（62）和显示部分（64）。当在预定定时之后的预定时间内没有进行游戏操作输入时，选择部分（62）选择默认游戏标题图像，使得显示部分（62）显示默认游戏标题图像。另一方面，当在预定时间内进行任何游戏操作输入时，根据游戏操作输入的内容是否满足预定条件，由显示部分（62）显示默认或可选的游戏标题图像。

22. 发明授权

US06946202B1 Powder coating 失效
标题翻译：粉末涂料
公开(公告)号：US06946202B1
公开(公告)日：2005-09-20
申请号：US08815592
申请日：1997-03-12
申请人： Masayuki Maruta , Yukiya Sato , Katsutoshi Aoki , Yasunori Inagaki , Kuniyasu Kawabe , Hisakazu Tajima , Shinji Moriyama
发明人： Masayuki Maruta , Yukiya Sato , Katsutoshi Aoki , Yasunori Inagaki , Kuniyasu Kawabe , Hisakazu Tajima , Shinji Moriyama
IPC分类号： B05D5/06 , C09D5/03 , B32B27/36 , B32B15/08 , C08K7/00
CPC分类号： B05D5/061 , B05D2401/32 , C09D5/032 , Y10S524/904 , Y10S525/934 , Y10T428/31678 , Y10T428/31786
摘要： A combination of powder coatings usable in a powder coating method for forming a coating film having visually homogeneous hue by mixing two or more powder coatings of which each color is different. In the combination of powder coatings, each of differences in triboelectric charges of two or more powder coatings is 5.0 μC/g or less. The coating method usable herein includes the step of applying onto a substrate to be coated two or more powder coatings of which each color is different, in which the triboelectric charges are controlled in the above given ranges.
摘要翻译：粉末涂料的组合可用于通过混合两种或更多种颜色不同的粉末涂料形成具有目视均匀色调的涂膜的粉末涂料方法。在粉末涂料的组合中，两种或更多种粉末涂料的摩擦电荷差异为5.0μC/ g以下。可用于本发明的涂布方法包括将涂布在待涂覆的基材上的步骤，其中每种颜色不同的两种或更多种粉末涂料，其中摩擦电荷控制在上述给定范围内。

23. 发明授权

US06329879B1 High frequency power amplifier system and wireless communication system 失效
标题翻译：高频功率放大器系统和无线通信系统
公开(公告)号：US06329879B1
公开(公告)日：2001-12-11
申请号：US09437264
申请日：1999-11-10
申请人： Masashi Maruyama , Hitoshi Akamine , Tsutomu Kobori , Shinji Moriyama
发明人： Masashi Maruyama , Hitoshi Akamine , Tsutomu Kobori , Shinji Moriyama
IPC分类号： H03F304
CPC分类号： H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6644 , H01L2224/05599 , H01L2224/48227 , H01L2224/48465 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/09701 , H01L2924/1305 , H01L2924/13063 , H01L2924/15313 , H01L2924/16152 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H03F1/306 , H03F1/565 , H03F3/601 , H03F3/604 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： Disclosed herein is a high frequency power amplifier system having a transistor comprised of a first electrode, a second electrode and a control electrode and for controlling current which flows between the first electrode and the second electrode by applying a potential to the control electrode, and a resistance type potential divider circuit for determining a dc bias potential applied to the control electrode of the transistor, and wherein an input signal is inputted to the control electrode, an output signal is outputted from the first electrode and a control signal is inputted to the resistance type potential divider circuit. One resistor of the resistance type potential divider circuit is comprised of a temperature compensating resistor whose resistance value varies linearly, so that a temperature characteristic of an idle current defined as an output when the control signal is not inputted, assumes a negative temperature characteristic.
摘要翻译：本文公开了一种高频功率放大器系统，其具有包括第一电极，第二电极和控制电极的晶体管，并且用于通过向控制电极施加电位来控制在第一电极和第二电极之间流动的电流，电阻型分压器电路，用于确定施加到晶体管的控制电极的直流偏置电位，并且其中输入信号被输入到控制电极，从第一电极输出输出信号，并将控制信号输入到电阻型分压电路。电阻型分压器电路的一个电阻器由电阻值线性变化的温度补偿电阻器构成，使得当不输入控制信号时被定义为输出的空闲电流的温度特性呈现负温度特性。

24. 发明授权

US5723246A Binder resin and toner for electrostatic development containing the same 失效
标题翻译：粘合剂树脂和用于静电开发的调色剂含有它
公开(公告)号：US5723246A
公开(公告)日：1998-03-03
申请号：US652308
申请日：1996-05-23
申请人： Katsutoshi Aoki , Yoshihiro Ueno , Tetsuhiro Semura , Shinji Moriyama , Kuniyasu Kawabe
发明人： Katsutoshi Aoki , Yoshihiro Ueno , Tetsuhiro Semura , Shinji Moriyama , Kuniyasu Kawabe
IPC分类号： G03G9/087
CPC分类号： G03G9/08797 , G03G9/08795
摘要： The binder resin for producing a toner includes the following three resins (A) to (C): resin (A) having a softening point of 120.degree. C. or more and 170.degree. C. or less, a glass transition temperature of 58.degree. C. or more and less than 75.degree. C., and a weight percentage of components insoluble to chloroform at 25.degree. C. of 5% by weight or more and 50% by weight or less; resin (B) having a softening point of 90.degree. C. or more and 120.degree. C. or less, a glass transition temperature of 58.degree. C. or more and less than 75.degree. C., and a weight percentage of components insoluble to chloroform at 25.degree. C. of less than 5% by weight; and resin (C) having a softening point of 80.degree. C. or more and less than 110.degree. C., a glass transition temperature of 45.degree. C. or more and less than 58.degree. C., and a weight percentage of components insoluble to chloroform at 25.degree. C. of less than 5% by weight.
摘要翻译：用于制造调色剂的粘合剂树脂包括以下三种树脂（A）至（C）：软化点为120℃以上且170℃以下，玻璃化转变温度为58℃的树脂（A） ℃以上且小于75℃，25℃下不溶于氯仿的成分的重量百分数为5重量％以上且50重量％以下。软化点为90℃以上且120℃以下，玻璃化转变温度为58℃以上且小于75℃的树脂（B），以及不溶于 25℃的氯仿小于5重量％; 和软化点为80℃以上且小于110℃，玻璃化转变温度为45℃以上且小于58℃的树脂（C），并且组分的重量百分比不溶于在25℃下的氯仿小于5重量％。

25. 发明授权

US08581395B2 Hybrid integrated circuit device and electronic device 有权
标题翻译：混合集成电路器件和电子器件
公开(公告)号：US08581395B2
公开(公告)日：2013-11-12
申请号：US13523464
申请日：2012-06-14
申请人： Shinji Moriyama , Tomio Yamada
发明人： Shinji Moriyama , Tomio Yamada
IPC分类号： H01L23/34 , H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/28
CPC分类号： H01L23/13 , H01L23/10 , H01L23/3121 , H01L23/3677 , H01L23/49811 , H01L23/49838 , H01L23/49894 , H01L23/50 , H01L23/66 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H03G3/3042 , H05K1/0263 , H05K1/141 , H05K1/183 , H05K3/3405 , H05K3/3436 , H05K3/3452 , H05K2201/099 , H05K2201/09909 , H05K2201/10371 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A hybrid integrated circuit device having high mount reliability includes a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.
摘要翻译：具有高安装可靠性的混合集成电路装置包括：作为陶瓷布线基板的模块基板，布置在模块基板的主表面上的多个电子部件部件，布置在模块基板的背面上的多个电极端子模块基板和固定到模块基板以覆盖模块基板的主表面的盖。电极端子包括沿着模块基板的边缘排列的电极端子和位于内部的电源电压端子。沿着基板边缘排列的电极端子至少在其靠近基板边缘的部分中涂覆有几十微米或更小的厚度的保护膜。连接加强端子由彼此独立的多个分开的端子组成，并且是接地端子。

26. 发明授权

US08222734B2 Hybrid integrated circuit device and electronic device 有权
标题翻译：混合集成电路器件和电子器件
公开(公告)号：US08222734B2
公开(公告)日：2012-07-17
申请号：US13306347
申请日：2011-11-29
申请人： Shinji Moriyama , Tomio Yamada
发明人： Shinji Moriyama , Tomio Yamada
IPC分类号： H01L23/24 , H01L23/04 , H01L23/053 , H01L23/12 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/28
CPC分类号： H01L23/13 , H01L23/10 , H01L23/3121 , H01L23/3677 , H01L23/49811 , H01L23/49838 , H01L23/49894 , H01L23/50 , H01L23/66 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H03G3/3042 , H05K1/0263 , H05K1/141 , H05K1/183 , H05K3/3405 , H05K3/3436 , H05K3/3452 , H05K2201/099 , H05K2201/09909 , H05K2201/10371 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A hybrid integrated circuit device having high mount reliability includes a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.
摘要翻译：具有高安装可靠性的混合集成电路装置包括：作为陶瓷布线基板的模块基板，布置在模块基板的主表面上的多个电子部件部件，布置在模块基板的背面上的多个电极端子模块基板和固定到模块基板以覆盖模块基板的主表面的盖。电极端子包括沿着模块基板的边缘排列的电极端子和位于内部的电源电压端子。沿着基板边缘排列的电极端子至少在其靠近基板边缘的部分中涂覆有几十微米或更小的厚度的保护膜。连接加强端子由彼此独立的多个分开的端子组成，并且是接地端子。

27. 发明授权

US07871750B2 Process for preparing mixed color toner 有权
标题翻译：混合彩色调色剂的制备方法
公开(公告)号：US07871750B2
公开(公告)日：2011-01-18
申请号：US11954839
申请日：2007-12-12
申请人： Shinji Moriyama
发明人： Shinji Moriyama
IPC分类号： G03G9/16
CPC分类号： G03G9/16 , G03G9/0808 , G03G9/0926
摘要： A process for preparing a mixed color toner obtained by mixing two or more kinds of color toners of which each color is different, including the following steps (1) and (2): (1) determining zeta potential distributions of each of the color toners, and (2) mixing the color toners in combination so that an overlapping ratio of the zeta potential distributions is 70.0% or more; a mixed color toner obtainable by the process; a two-component developer containing the toner; and a method of forming fixed images using the toner. The mixed color toner obtainable by the present invention is used for, for example, developing a latent image formed in electrophotography, electrostatic recording method, electrostatic printing method, or the like.
摘要翻译：包括以下步骤（1）和（2）的两种或多种颜色不同的彩色调色剂混合得到的混合色调色剂的制备方法：（1）确定每种颜色调色剂的ζ电位分布，和（2）组合色彩调色剂，使ζ电位分布的重叠率为70.0％以上; 可以通过该方法获得的混色调色剂; 含有调色剂的双组分显影剂; 以及使用调色剂形成固定图像的方法。通过本发明获得的混合色调色剂可用于例如显影在电子照相术，静电记录方法，静电印刷方法等中形成的潜像。

28. 发明授权

US07706756B2 RF power module 有权
标题翻译：射频功率模块
公开(公告)号：US07706756B2
公开(公告)日：2010-04-27
申请号：US11626485
申请日：2007-01-24
申请人： Yusuke Sato , Nobuyoshi Maejima , Tomoaki Kudaishi , Shinji Moriyama , Naoki Kuroda , Ryota Sato , Masashi Okano
发明人： Yusuke Sato , Nobuyoshi Maejima , Tomoaki Kudaishi , Shinji Moriyama , Naoki Kuroda , Ryota Sato , Masashi Okano
IPC分类号： H04B1/44 , H04Q7/20
CPC分类号： H03F3/195 , H01L2224/05554 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/12032 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H03F3/68 , H03F3/72 , H03F2200/111 , H03F2200/294 , H03F2200/451 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.
摘要翻译：提供了一种技术，用于在增强电子设备的性能的同时，实现具有功率放大器电路的电子设备的尺寸的减小。用于移动通信设备的RF功率模块包括安装在布线板上的第一和第二半导体芯片，无源部件以及第一和第二集成无源部件。在第一半导体芯片中，形成用于GSM 900和DCS 1800的功率放大器电路的MISFET元件，并且还形成控制电路。在第一集成无源部件中，形成用于GSM 900的低通滤波器电路，并且在第二集成无源部件中形成用于DCS 1800的低通滤波器电路。在第二半导体芯片中，形成用于GSM 900和DCS 1800的天线切换电路。在布线板的上表面上，第二半导体芯片设置在集成的无源元件之间的第一半导体芯片的旁边。

29. 发明申请

US20070252264A1 Hybrid integrated circuit device, and method for fabricating the same, and electronic device 有权
标题翻译：混合集成电路装置及其制造方法以及电子装置
公开(公告)号：US20070252264A1
公开(公告)日：2007-11-01
申请号：US11819334
申请日：2007-06-27
申请人： Shinji Moriyama , Tomio Yamada
发明人： Shinji Moriyama , Tomio Yamada
IPC分类号： H01L23/48
CPC分类号： H01L23/13 , H01L23/10 , H01L23/3121 , H01L23/3677 , H01L23/49811 , H01L23/49838 , H01L23/49894 , H01L23/50 , H01L23/66 , H01L24/48 , H01L24/73 , H01L25/165 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H03G3/3042 , H05K1/0263 , H05K1/141 , H05K1/183 , H05K3/3405 , H05K3/3436 , H05K3/3452 , H05K2201/099 , H05K2201/09909 , H05K2201/10371 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.
摘要翻译：具有高安装可靠性的混合集成电路装置包括：模块基板，其是陶瓷布线基板，布置在模块基板的主表面上的多个电子部件部件，布置在模块基板的后表面上的多个电极端子模块基板和固定到模块基板以覆盖模块基板的主表面的盖。电极端子包括沿着模块基板的边缘排列的多个电极端子和位于内部的电源电压端子。沿着基板边缘排列的电极端子至少在其靠近基板边缘的部分中涂覆有几十微米或更小的厚度的保护膜。连接加强端子由彼此独立的多个分开的端子组成，并且是接地端子。

30. 发明申请

US20070210866A1 RF POWER MODULE 有权
标题翻译：射频功率模块
公开(公告)号：US20070210866A1
公开(公告)日：2007-09-13
申请号：US11626485
申请日：2007-01-24
申请人： Yusuke Sato , Nobuyoshi Maejima , Tomoaki Kudaishi , Shinji Moriyama , Naoki Kuroda , Ryota Sato , Masashi Okano
发明人： Yusuke Sato , Nobuyoshi Maejima , Tomoaki Kudaishi , Shinji Moriyama , Naoki Kuroda , Ryota Sato , Masashi Okano
IPC分类号： H03F3/68
CPC分类号： H03F3/195 , H01L2224/05554 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/12032 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H03F3/68 , H03F3/72 , H03F2200/111 , H03F2200/294 , H03F2200/451 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.
摘要翻译：提供了一种技术，用于在增强电子设备的性能的同时，实现具有功率放大器电路的电子设备的尺寸的减小。用于移动通信设备的RF功率模块包括安装在布线板上的第一和第二半导体芯片，无源部件以及第一和第二集成无源部件。在第一半导体芯片中，形成用于GSM 900和DCS 1800的功率放大器电路的MISFET元件，并且还形成控制电路。在第一集成无源部件中，形成用于GSM 900的低通滤波器电路，并且在第二集成无源部件中形成用于DCS 1800的低通滤波器电路。在第二半导体芯片中，形成用于GSM 900和DCS 1800的天线切换电路。在布线板的上表面上，第二半导体芯片设置在集成的无源元件之间的第一半导体芯片的旁边。

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