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    • 21. 发明申请
    • Memory Constructions Comprising Magnetic Materials
    • 包含磁性材料的记忆体构造
    • US20110140218A1
    • 2011-06-16
    • US13025073
    • 2011-02-10
    • Joel A. Drewes
    • Joel A. Drewes
    • H01L29/82
    • H01L27/222G11C11/161H01L43/08H01L43/12
    • The invention includes a method of forming a semiconductor construction, such as an MRAM construction. A block is formed over a semiconductor substrate. First and second layers are formed over the block, and over a region of the substrate proximate the block. The first and second layers are removed from over the block while leaving portions of the first and second layers over the region proximate the block. At least some of the first layer is removed from under the second layer to form a channel over the region proximate the block. A material, such as a soft magnetic material, is provided within the channel. The invention also includes semiconductor constructions.
    • 本发明包括形成诸如MRAM结构的半导体结构的方法。 在半导体衬底上形成块。 第一层和第二层形成在块上方,并且在靠近块的衬底的区域上方形成。 将第一层和第二层从块上方移除,同时将第一层和第二层的部分留在靠近块的区域上。 从第二层下面移除第一层中的至少一些,以在靠近块的区域上形成通道。 在通道内提供诸如软磁材料的材料。 本发明还包括半导体结构。
    • 22. 发明授权
    • Assemblies comprising magnetic elements and magnetic barrier or shielding
    • 组件包括磁性元件和磁屏障或屏蔽
    • US07902580B2
    • 2011-03-08
    • US12561994
    • 2009-09-17
    • Joel A. Drewes
    • Joel A. Drewes
    • H01L29/82
    • H01L27/222G11C11/161H01L43/08H01L43/12
    • The invention includes a method of forming a semiconductor construction, such as an MRAM construction. A block is formed over a semiconductor substrate. First and second layers are formed over the block, and over a region of the substrate proximate the block. The first and second layers are removed from over the block while leaving portions of the first and second layers over the region proximate the block. At least some of the first layer is removed from under the second layer to form a channel over the region proximate the block. A material, such as a soft magnetic material, is provided within the channel. The invention also includes semiconductor constructions.
    • 本发明包括形成诸如MRAM结构的半导体结构的方法。 在半导体衬底上形成块。 第一层和第二层形成在块上方,并且在靠近块的衬底的区域上方形成。 将第一层和第二层从块上方移除,同时将第一层和第二层的部分留在靠近块的区域上。 从第二层下面移除第一层中的至少一些,以在靠近块的区域上形成通道。 在通道内提供诸如软磁材料的材料。 本发明还包括半导体结构。
    • 26. 发明授权
    • System and method for reducing shorting in memory cells
    • 用于减少存储器单元短路的系统和方法
    • US07112454B2
    • 2006-09-26
    • US10684967
    • 2003-10-14
    • Joel A. DrewesJames G. Deak
    • Joel A. DrewesJames G. Deak
    • H01L21/70G11C11/15
    • H01L27/222H01L43/08H01L43/12
    • An MRAM device includes an array of magnetic memory cells having an upper conductive layer and a lower conductive layer separated by a barrier layer. To reduce the likelihood of electrical shorting across the barrier layers of the memory cells, spacers can be formed around the upper conductive layer and, after the layers of the magnetic memory cells have been etched, the memory cells can be oxidized to transform any conductive particles that are deposited along the sidewalls of the memory cells as byproducts of the etching process into nonconductive particles. Alternatively, the lower conductive layer can be repeatedly subjected to partial oxidation and partial etching steps such that only nonconductive particles can be thrown up along the sidewalls of the memory cells as byproducts of the etching process.
    • MRAM器件包括具有由阻挡层隔开的上导电层和下导电层的磁存储单元的阵列。 为了减少跨越存储器单元的阻挡层的电短路的可能性,可以在上导电层周围形成间隔物,并且在已经蚀刻了磁存储单元的层之后,可以将存储单元氧化以转换任何导电颗粒 沿着存储器单元的侧壁沉积作为蚀刻工艺的副产物而形成非导电颗粒。 或者,下导电层可以重复进行部分氧化和部分蚀刻步骤,使得只有非导电颗粒可以作为蚀刻工艺的副产物沿着存储器单元的侧壁被抛出。