会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 21. 发明申请
    • Image Splitting in Optical Inspection Systems
    • 光学检测系统中的图像分割
    • US20080137074A1
    • 2008-06-12
    • US11944684
    • 2007-11-26
    • Dov FurmanRoy KanerOri GonenDaniel MandelikEran TalShai Silberstein
    • Dov FurmanRoy KanerOri GonenDaniel MandelikEran TalShai Silberstein
    • G01N21/00G01J4/00
    • G01N21/95607G01N21/21G01N2021/95615G01N2201/068
    • In an optical inspection tool, an image of an object under inspection, such as a semiconductor wafer, may be obtained using imaging optics defining a focal plane. Light comprising the image can be split into portions that are detected using multiple detectors which each register a portion of the image. The image of the object at the focal plane can be split into two, three, or more parts by polarization-based beam splitters and/or lenses positioned tangent to the focal plane. The splitting apparatus may comprise a pair of arrays of half-cylinder lenses comprising a convex side and a flat side. The arrays can be positioned with the cylinder axes perpendicular to one another and the flat sides facing each other. Thus, the pair of arrays can divide incoming light into a plurality of rectangular portions without introducing non-uniformities which would occur if several spherical lenses are configured for use in a rectangular array.
    • 在光学检查工具中,可以使用限定焦平面的成像光学元件来获得被检查物体(诸如半导体晶片)的图像。 包括图像的光可以被分割成使用多个检测器检测的部分,每个检测器记录图像的一部分。 在焦平面处的物体的图像可以通过基于偏振的分束器和/或与焦平面相切的透镜分离成两个,三个或更多个部分。 分割装置可以包括一对半柱透镜,其包括凸面和平坦侧。 阵列可以被定位成使得圆柱轴线彼此垂直并且平坦的面朝向彼此。 因此,一对阵列可以将入射光分成多个矩形部分,而不会引入不均匀性,如果若干球形透镜配置为用于矩形阵列,则会发生不均匀性。
    • 22. 发明申请
    • Wafer Inspection Using Short-Pulsed Continuous Broadband Illumination
    • 使用短脉冲连续宽带照明的晶圆检查
    • US20070273945A1
    • 2007-11-29
    • US11684191
    • 2007-03-09
    • Dov FurmanShai Silberstein
    • Dov FurmanShai Silberstein
    • G06E3/00G01N21/25G02F2/02
    • G01N21/9501G01N21/8806G01N21/95607G01N21/95623G01N2021/479G01N2021/8825G01N2201/0697H01L22/12
    • An inspection system may be configured to inspect objects, such as semiconductor wafers, using narrow-pulse broadband illumination. The illumination may be obtained in some embodiments using a laser configured to emit light into a material having a spectral broadening effect. The inspection system can include various filters which may be selectively placed in the illumination and/or imaging path in order to tune the spectrum of light impinging on the wafer and the light that is detected. The filters may include selectable filters, fixed filters, and filters whose characteristics can be adjusted in-place. In some embodiments, filters may be used to match the illumination/detection spectra of different tools. Additionally, the broadband illumination may be tuned between inspections and/or during inspections for best results. The system may support Fourier filtering whereby light, related to repetitive features of the object and in one or more wavelength sub-bands of the illumination, may be filtered.
    • 检查系统可以被配置为使用窄脉冲宽带照明来检查诸如半导体晶片的物体。 在一些实施例中可以使用被配置为将光发射到具有光谱增宽效应的材料的激光器来获得照明。 检查系统可以包括可以选择性地放置在照明和/或成像路径中的各种滤光器,以便调节照射在晶片上的光的光谱和被检测的光。 滤波器可以包括可选择的滤波器,固定滤波器和滤波器,其特性可以在原地调节。 在一些实施例中,可以使用滤波器来匹配不同工具的照明/检测光谱。 此外,可以在检查之间和/或在检查期间调整宽带照明以获得最佳结果。 该系统可以支持傅立叶滤波,由此可以对与物体的重复特征和照明的一个或多个波长子带中的光进行过滤相关的光。
    • 29. 发明授权
    • Optical inspection tools featuring parallel post-inspection analysis
    • 光学检测工具具有并行后检查分析
    • US08135207B2
    • 2012-03-13
    • US12145701
    • 2008-06-25
    • Shai SilbersteinTsafrir Avni
    • Shai SilbersteinTsafrir Avni
    • G06K9/00G01N21/88
    • G06K9/03G01N21/9501G06T7/0006G06T2207/30148
    • An optical inspection tool can automatically perform analysis/operations after the tool has generated data identifying defects (e.g. a defect list) from an inspection run of an object such as a semiconductor wafer. The tool can decouple post-inspection tasks from performing inspection runs so that one or more post-inspection tasks are performed on defect data from a previous inspection run while another inspection run is in progress. This can significantly improve the throughput of the tool when multiple inspections are performed, since the inspection run time effectively is shortened to include only the time the tool is actually used to acquire defect data. One or more post-inspection tasks can be performed, including, but not limited to, merging inspection runs, removing duplicate defects, removing straight-line false alarms, and characterizing defects.
    • 光学检查工具可以在工具从诸如半导体晶片的对象的检查运行中产生识别缺陷(例如,缺陷列表)的数据之后,自动执行分析/操作。 该工具可以将检查后任务与执行检查运行脱钩,以便在进行另一次检查运行时,对先前检查运行中的缺陷数据执行一个或多个检查后任务。 这可以显着提高多次检查时刀具的生产量,因为检查运行时间有效缩短,仅包括工具实际用于获取缺陷数据的时间。 可以执行一个或多个后检查任务,包括但不限于合并检查运行,删除重复缺陷,去除直线虚警和表征缺陷。
    • 30. 发明授权
    • Optical inspection tool featuring multiple speed modes
    • 具有多种速度模式的光学检测工具
    • US08098372B2
    • 2012-01-17
    • US11781454
    • 2007-07-23
    • Giora EitanShai Silberstein
    • Giora EitanShai Silberstein
    • G01N21/00
    • H04N5/232G01N21/9501G01N21/95607G01N2021/8825
    • An optical inspection tool can feature a double-speed and other modes whereby the inspection rate is increased by using pixel binning. For instance, the tool may include an array of pixels provided by one or more detectors. Some or all of the pixels in one or more of the detectors may be binned according to inspection requirements. Based on the reduction in effective pixels due to the binning, in some embodiments, the rate of imaging and scanning rate of the wafer (or other object) can be increased. Different portions of the array may be binned differently to provide for increased throughput during inspections; for instance, the binning arrangement across an array can be correlated to the features that will be imaged using the array.
    • 光学检查工具可以具有双倍速度和其他模式,从而通过使用像素分档来提高检查率。 例如,工具可以包括由一个或多个检测器提供的像素阵列。 一个或多个检测器中的一些或全部像素可以根据检查要求进行装箱。 基于合并的有效像素的减少,在一些实施例中,可以增加晶片(或其他物体)的成像速率和扫描速率。 阵列的不同部分可以不同地装箱以提供检查期间增加的吞吐量; 例如,跨阵列的合并排列可以与将使用阵列成像的特征相关联。