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21. 发明授权

US09250291B2 System for testing an integrated circuit of a device and its method of use 有权
标题翻译：用于测试设备集成电路的系统及其使用方法
公开(公告)号：US09250291B2
公开(公告)日：2016-02-02
申请号：US13554722
申请日：2012-07-20
申请人： Scott E. Lindsey , Jovan Jovanovic , David S. Hendrickson , Donald P. Richmond, II
发明人： Scott E. Lindsey , Jovan Jovanovic , David S. Hendrickson , Donald P. Richmond, II
IPC分类号： G01R31/20 , G01R31/28 , G01R31/319
CPC分类号： G01R31/2891 , G01R31/287 , G01R31/31908
摘要： A cartridge, including a cartridge frame, formations on the cartridge frame for mounting the cartridge frame in a fixed position to an apparatus frame, a contactor support structure, a contactor interface on the contactor support structure, a plurality of terminals, held by the contactor support structure, for contacting contacts on a device, and a plurality of conductors, held by the contactor support structure, connecting the interface to the terminals.
摘要翻译：包括盒框架的盒，在盒框架上的结构，用于将盒框架固定在固定位置到装置框架，接触器支撑结构，接触器支撑结构上的接触器接口，由接触器保持的多个端子支撑结构，用于接触设备上的触点，以及由接触器支撑结构保持的多个导体，将接口连接到端子。

22. 发明申请

US20110006800A1 SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD OF USE 有权
标题翻译：用于测试设备的集成电路的系统及其使用方法
公开(公告)号：US20110006800A1
公开(公告)日：2011-01-13
申请号：US12885373
申请日：2010-09-17
申请人： Scott E. Lindsey , Jovan Jovanovic , David S. Hendrickson , Donald P. Richmond, II
发明人： Scott E. Lindsey , Jovan Jovanovic , David S. Hendrickson , Donald P. Richmond, II
IPC分类号： G01R31/00 , H01R13/60 , H01R13/62 , H01R4/66
CPC分类号： G01R31/2891 , G01R31/287 , G01R31/31908
摘要： A cartridge, including a cartridge frame, formations on the cartridge frame for mounting the cartridge frame in a fixed position to an apparatus frame, a contactor support structure, a contactor interface on the contactor support structure, a plurality of terminals, held by the contactor support structure, for contacting contacts on a device, and a plurality of conductors, held by the contactor support structure, connecting the interface to the terminals.
摘要翻译：包括盒框架的盒，在盒框架上的结构，用于将盒框架固定在固定位置到装置框架，接触器支撑结构，接触器支撑结构上的接触器接口，由接触器保持的多个端子支撑结构，用于接触设备上的触点，以及由接触器支撑结构保持的多个导体，将接口连接到端子。

23. 发明申请

US20100244866A1 SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD OF USE 有权
标题翻译：用于测试设备的集成电路的系统及其使用方法
公开(公告)号：US20100244866A1
公开(公告)日：2010-09-30
申请号：US12411233
申请日：2009-03-25
申请人： Scott E. Lindsey , Junjye Yeh , Jovan Jovanovic , Seang P. Malathong
发明人： Scott E. Lindsey , Junjye Yeh , Jovan Jovanovic , Seang P. Malathong
IPC分类号： G01R31/28 , H01R24/00 , G01R31/02
CPC分类号： G01R1/0441 , G01R1/0416 , G01R1/0491 , G01R1/06705 , G01R1/07307 , G01R31/2601 , G01R31/2855 , G01R31/2863 , G01R31/2886 , G01R31/2887
摘要： A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.
摘要翻译：描述了一种测试设备的集成电路的方法。允许空气通过流体管线来改变限定在致动器的第一和第二部件之间的体积的尺寸，以相对于设备移动接触器支撑结构，并且将接触器支撑结构上的端子推压到设备上的触点上。当流体管线中的空气压力达到预定值时，空气通过压力释放阀从流体管线自动释放。保持器相对于装置框架移动，以使端子与触头脱离，同时将致动器的第一和第二部件保持在彼此基本上平稳的关系。提供了一种连接装置，其包括具有互补的相互接合结构的第一和第二连接件，其限制接触器基板相对于分配板基板沿切线方向的移动。

24. 发明申请

US20110316577A1 SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD OF USE 有权
标题翻译：用于测试设备的集成电路的系统及其使用方法
公开(公告)号：US20110316577A1
公开(公告)日：2011-12-29
申请号：US13223319
申请日：2011-09-01
申请人： Scott E. Lindsey , Junyje Yeh , Jovan Jovanovic , Seang P. Malathong
发明人： Scott E. Lindsey , Junyje Yeh , Jovan Jovanovic , Seang P. Malathong
IPC分类号： G01R31/00
CPC分类号： G01R1/0441 , G01R1/0416 , G01R1/0491 , G01R1/06705 , G01R1/07307 , G01R31/2601 , G01R31/2855 , G01R31/2863 , G01R31/2886 , G01R31/2887
摘要： A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.
摘要翻译：描述了一种测试设备的集成电路的方法。允许空气通过流体管线来改变限定在致动器的第一和第二部件之间的体积的尺寸，以相对于设备移动接触器支撑结构，并且将接触器支撑结构上的端子推压到设备上的触点上。当流体管线中的空气压力达到预定值时，空气通过压力释放阀从流体管线自动释放。保持器相对于装置框架移动，以使端子与触头脱离，同时将致动器的第一和第二部件保持在彼此基本上平稳的关系。提供了一种连接装置，其包括具有互补的相互接合结构的第一和第二连接件，其限制接触器基板相对于分配板基板沿切线方向的移动。

25. 发明授权

US08030957B2 System for testing an integrated circuit of a device and its method of use 有权
标题翻译：用于测试设备集成电路的系统及其使用方法
公开(公告)号：US08030957B2
公开(公告)日：2011-10-04
申请号：US12411233
申请日：2009-03-25
申请人： Scott E. Lindsey , Junyje Yeh , Jovan Jovanovic , Seang P. Malathong
发明人： Scott E. Lindsey , Junyje Yeh , Jovan Jovanovic , Seang P. Malathong
IPC分类号： G01R1/067 , G01R31/20
CPC分类号： G01R1/0441 , G01R1/0416 , G01R1/0491 , G01R1/06705 , G01R1/07307 , G01R31/2601 , G01R31/2855 , G01R31/2863 , G01R31/2886 , G01R31/2887
摘要： A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.
摘要翻译：描述了一种测试设备的集成电路的方法。允许空气通过流体管线来改变限定在致动器的第一和第二部件之间的体积的尺寸，以相对于设备移动接触器支撑结构，并且将接触器支撑结构上的端子推压到设备上的触点上。当流体管线中的空气压力达到预定值时，空气通过压力释放阀从流体管线自动释放。保持器相对于装置框架移动，以使端子与触头脱离，同时将致动器的第一和第二部件保持在彼此基本上平稳的关系。提供了一种连接装置，其包括具有互补的相互接合结构的第一和第二连接件，其限制接触器基板相对于分配板基板沿切线方向的移动。

26. 发明授权

US08947116B2 System for testing an integrated circuit of a device and its method of use 有权
标题翻译：用于测试设备集成电路的系统及其使用方法
公开(公告)号：US08947116B2
公开(公告)日：2015-02-03
申请号：US13223319
申请日：2011-09-01
申请人： Scott E. Lindsey , Junyje Yeh , Jovan Jovanovic , Seang P. Malathong
发明人： Scott E. Lindsey , Junyje Yeh , Jovan Jovanovic , Seang P. Malathong
IPC分类号： G01R31/00 , G01R31/28
CPC分类号： G01R1/0441 , G01R1/0416 , G01R1/0491 , G01R1/06705 , G01R1/07307 , G01R31/2601 , G01R31/2855 , G01R31/2863 , G01R31/2886 , G01R31/2887
摘要： A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.
摘要翻译：描述了一种测试设备的集成电路的方法。允许空气通过流体管线来改变限定在致动器的第一和第二部件之间的体积的尺寸，以相对于设备移动接触器支撑结构，并且将接触器支撑结构上的端子推压到设备上的触点上。当流体管线中的空气压力达到预定值时，空气通过压力释放阀从流体管线自动释放。保持器相对于装置框架移动，以使端子与触头脱离，同时将致动器的第一和第二部件保持在彼此基本上平稳的关系。提供了一种连接装置，其包括具有互补的相互接合结构的第一和第二连接件，其限制接触器基板相对于分配板基板沿切线方向的移动。

27. 外观设计

USD630166S1 Connector 有权
公开(公告)号：USD630166S1
公开(公告)日：2011-01-04
申请号：US29327294
申请日：2008-11-03
申请人： Scott E. Lindsey , Jovan Jovanovic , David S. Hendrickson
设计人： Scott E. Lindsey , Jovan Jovanovic , David S. Hendrickson

28. 外观设计

USD629760S1 Interface on an electronics connector 有权
标题翻译：电子连接器上的接口
公开(公告)号：USD629760S1
公开(公告)日：2010-12-28
申请号：US29327293
申请日：2008-11-03
申请人： Scott E. Lindsey , Jovan Jovanovic , David S. Hendrickson
设计人： Scott E. Lindsey , Jovan Jovanovic , David S. Hendrickson

29. 发明授权

US5629630A Semiconductor wafer contact system and method for contacting a semiconductor wafer 失效
标题翻译：用于接触半导体晶片的半导体晶片接触系统和方法
公开(公告)号：US5629630A
公开(公告)日：1997-05-13
申请号：US395127
申请日：1995-02-27
申请人： Patrick F. Thompson , William M. Williams , Scott E. Lindsey , Barbara Vasquez
发明人： Patrick F. Thompson , William M. Williams , Scott E. Lindsey , Barbara Vasquez
IPC分类号： G01R1/06 , G01R1/073 , G01R31/28 , H01L21/66
CPC分类号： G01R1/07314 , G01R31/2831
摘要： A semiconductor wafer contact system includes a base substrate (13) which has an array of raised supports (18). The array of raised supports (18) are distributed in a pattern corresponding to the pattern of electrical contacts (12) on the semiconductor wafer (10), to be contacted. In between the base substrate (13) and the wafer to be contacted (10) is a flexible circuit layer (14) including an array of electrical contacts (15) having the same pattern as the contacts (12) of the wafer and the raised supports (18). The raised supports (18) provide focused and localized force, pressing the membrane test contacts (15) against the wafer electrical contacts (12).
摘要翻译：半导体晶片接触系统包括具有升高的支撑件（18）阵列的基底（13）。凸起支撑件（18）的阵列以对应于半导体晶片（10）上的电触点（12）的图案的图案分布，以被接触。在基底基板（13）和待接触晶片（10）之间的是柔性电路层（14），其包括具有与晶片的触点（12）相同图案的电触头阵列（15），并且凸起支持（18）。凸起的支撑件（18）提供聚焦和局部的力，将膜测试触点（15）压在晶片电触头（12）上。

30. 发明授权

US07131848B2 Helical microelectronic contact and method for fabricating same 失效
标题翻译：螺旋微电子接触及其制造方法
公开(公告)号：US07131848B2
公开(公告)日：2006-11-07
申请号：US11237091
申请日：2005-09-27
申请人： Scott E. Lindsey , Charles A. Miller , David M. Royster , Stuart W. Wenzel
发明人： Scott E. Lindsey , Charles A. Miller , David M. Royster , Stuart W. Wenzel
IPC分类号： H01R12/00
CPC分类号： G01R1/06733 , G01R1/06711 , G01R1/06744 , G01R31/2884 , H01L21/4853 , H01L23/49811 , H01L2224/16 , H01L2924/00014 , H01R4/4863 , H01R12/57 , H01R13/035 , H01R13/2421 , H01R13/33 , H01R43/16 , H05K3/326 , H05K3/4007 , H05K3/4092 , H05K2201/0133 , H05K2201/0367 , H05K2201/10265 , H05K2203/308 , H01L2224/0401
摘要： A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.
摘要翻译：公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。迹线从器件的端子以柔性衬垫的线圈图案延伸到其端部区域，形成螺旋线。柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。在替代实施例中，去除垫以留下独立的螺旋接触。

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