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21. 发明授权

US5625201A Multiwavelength LED devices and methods of fabrication 失效
标题翻译：多波长LED器件和制造方法
公开(公告)号：US5625201A
公开(公告)日：1997-04-29
申请号：US354193
申请日：1994-12-12
申请人： Paige M. Holm , Benjamin W. Gable
发明人： Paige M. Holm , Benjamin W. Gable
IPC分类号： H01L27/15 , H01L33/00
CPC分类号： H01L27/15 , H01L33/0016
摘要： A multiwavelength LED device including a first LED constructed to emit light of a first wavelength and a second LED constructed to emit light of a second wavelength, different than the first wavelength. The first and second LEDs are stacked vertically on a substrate and positioned to both emit light in the same direction. One of the LEDs is transparent to light emitted by the other of the LEDs so that light from both LEDs is emitted through a single aperture and can be mixed in intensity to produce a variety of wavelengths. The LEDs are individually addressable.
摘要翻译：一种多波长LED器件，包括被构造为发射第一波长的光的第一LED和被构造为发射不同于第一波长的第二波长的光的第二LED。第一和第二LED垂直地堆叠在基板上并且被定位成在相同方向上发光。其中一个LED对于另一个LED发出的光是透明的，使得来自两个LED的光通过单个孔发射并且可以强度混合以产生各种波长。 LED可单独寻址。

22. 发明授权

US5612231A Method of fabricating an electro-optic integrated circuit having light emitting diodes 失效
标题翻译：制造具有发光二极管的电光集成电路的方法
公开(公告)号：US5612231A
公开(公告)日：1997-03-18
申请号：US513655
申请日：1995-08-10
申请人： Paige M. Holm , George W. Rhyne , Thomas J. Walczak
发明人： Paige M. Holm , George W. Rhyne , Thomas J. Walczak
IPC分类号： H01L33/00 , H01L27/15 , H01L21/265
CPC分类号： H01L27/156 , Y10S257/921
摘要： An electro-optic integrated circuit including an addressable array of light emitting devices, a column decoder and a plurality of address lines formed on the substrate. There are n=2{integer[log(m)/log(2)]+1}, where m equals the number of columns, address lines each including an external connection pad. The decoder includes a switching circuit connected to each column for activating the column and a plurality of sets of diodes connected to the address lines and the switching circuits so that each set of diodes has a unique code produced by a combination of diodes in that set and the address lines to which the diodes in that set are connected.
摘要翻译：一种电光集成电路，包括可寻址的发光器件阵列，列解码器和形成在衬底上的多个地址线。有n = 2 {整数[log（m）/ log（2）] + 1}，其中m等于列数，地址线各包括一个外部连接焊盘。解码器包括连接到每列用于激活列的开关电路和连接到地址线和开关电路的多组二极管，使得每组二极管具有由该组中的二极管的组合产生的唯一代码，以及该组中的二极管连接到的地址线。

23. 发明授权

US5583349A Full color light emitting diode display 失效
标题翻译：全彩色发光二极管显示
公开(公告)号：US5583349A
公开(公告)日：1996-12-10
申请号：US552154
申请日：1995-11-02
申请人： Michael P. Norman , Paige M. Holm
发明人： Michael P. Norman , Paige M. Holm
IPC分类号： H01L25/075 , H01L27/32 , H01L33/00 , H01L51/50
CPC分类号： H01L27/3225 , H01L25/0753 , H01L33/0025 , H01L51/5012 , H01L25/0756 , H01L27/3209 , H01L2924/0002
摘要： A full color light emitting diode display (310) utilizes semiconductor light emitting diodes (313) to produce red light and organic light emitting diodes (312) to produce blue light. Green light is produced by either semiconductor light emitting diodes (313) or by organic light emitting diodes (331). An array of semiconductor light emitting diodes is formed on a semiconductor substrate (322) and an array of organic light emitting diodes is also formed on semiconductor substrate (322) adjacent to the array of semiconductor light emitting diodes. The array of organic light emitting diodes cooperates with the array of semiconductor light emitting diodes to form an array of multi-wavelength pixels of the full color light emitting diode display (310).
摘要翻译：全彩色发光二极管显示器（310）利用半导体发光二极管（313）产生红光和有机发光二极管（312）以产生蓝光。绿色光由半导体发光二极管（313）或有机发光二极管（331）产生。半导体发光二极管阵列形成在半导体衬底（322）上，并且有机发光二极管阵列也形成在与半导体发光二极管阵列相邻的半导体衬底（322）上。有机发光二极管阵列与半导体发光二极管阵列配合，以形成全彩色发光二极管显示器（310）的多波长像素阵列。

24. 发明授权

US5483085A Electro-optic integrated circuit with diode decoder 失效
标题翻译：带二极管解码器的电光集成电路
公开(公告)号：US5483085A
公开(公告)日：1996-01-09
申请号：US239626
申请日：1994-05-09
申请人： Paige M. Holm , George W. Rhyne , Thomas J. Walczak
发明人： Paige M. Holm , George W. Rhyne , Thomas J. Walczak
IPC分类号： H01L33/00 , H01L27/15
CPC分类号： H01L27/156 , Y10S257/921
摘要： An electro-optic integrated circuit including an addressable array of light emitting devices, a column decoder and a plurality of address lines formed on the substrate. There are address lines each including an external connection pad. The decoder includes a switching circuit connected to each column for activating the column and a plurality of sets of diodes connected to the address lines and the switching circuits so that each set of diodes has a unique code produced by a combination of diodes in that set .and the address lines to which the diodes in that set are connected.
摘要翻译：一种电光集成电路，包括可寻址的发光器件阵列，列解码器和形成在衬底上的多个地址线。每个地址线都包括一个外部连接板。解码器包括连接到每列用于激活列的开关电路和连接到地址线和开关电路的多组二极管，使得每组二极管具有由该组中的二极管的组合产生的唯一代码。以及该组中的二极管连接到的地址线。

25. 发明授权

US09040355B2 Sensor package and method of forming same 有权
标题翻译：传感器封装及其形成方法
公开(公告)号：US09040355B2
公开(公告)日：2015-05-26
申请号：US13546902
申请日：2012-07-11
申请人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
发明人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
IPC分类号： H01L21/00 , B81B7/00 , B81C1/00
CPC分类号： B81B7/0006 , B81B7/0077 , B81B2201/02 , B81C1/0023 , H01L2224/48091 , H01L2224/48464 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36), and providing a controller wafer (82) having control circuitry (42) at one side (38) and bonding perimeters (46) on an opposing side (40). The bonding perimeters (46) of the controller wafer (82) are bonded to corresponding bonding perimeters (36) of the sensor wafer (74) to form a stacked wafer structure (48) in which the control circuitry (42) faces outwardly. The controller wafer (82) is sawn to reveal bond pads (32) on the sensor wafer (74) which are wire bonded to corresponding bond pads (44) formed on the same side (38) of the wafer (82) as the control circuitry (42). The structure (48) is encapsulated in packaging material (62) and is singulated to produce the sensor packages (20).
摘要翻译：形成传感器封装（20）的方法（70）需要提供传感器晶片（74），传感器晶片（74）具有形成在位于通过接合周边（36）所描绘的区域（34）内的侧面（26）上的传感器（30），并且提供控制器具有在一侧（38）处的控制电路（42）和在相对侧（40）上的接合周边（46）的晶片（82）。控制器晶片（82）的接合周边（46）被接合到传感器晶片（74）的对应的接合周边（36），以形成其中控制电路（42）面向外的堆叠的晶片结构（48）。锯切控制器晶片（82）以露出传感器晶片（74）上的接合焊盘（32），该接合焊盘引线键合到形成在晶片（82）的同一侧（38）上的对应接合焊盘（44）电路（42）。结构（48）被封装在包装材料（62）中，并被分割以产生传感器封装（20）。

26. 发明申请

US20140124958A1 SENSOR PACKAGING METHOD AND SENSOR PACKAGES 有权
标题翻译：传感器包装方法和传感器包装
公开(公告)号：US20140124958A1
公开(公告)日：2014-05-08
申请号：US14151305
申请日：2014-01-09
申请人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
发明人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
IPC分类号： H01L23/528
CPC分类号： H01L23/528 , B81C1/0023 , B81C1/00238 , B81C2201/019 , B81C2203/0792 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method (80) entails providing (82) a structure (117), providing (100) a controller element (102, 24), and bonding (116) the controller element to an outer surface (52, 64) of the structure. The structure includes a sensor wafer (92) and a cap wafer (94) Inner surfaces (34, 36) of the wafers (92, 94) are coupled together, with sensors (30) interposed between the wafers. One wafer (94, 92) includes a substrate portion (40, 76) with bond pads (42) formed on its inner surface (34, 36). The other wafer (94, 92) conceals the substrate portion (40, 76). After bonding, methodology (80) entails forming (120) conductive elements (60) on the element (102, 24), removing (126) material sections (96, 98, 107) from the wafers to expose the bond pads, forming (130) electrical interconnects (56), applying (134) packaging material (64), and singulating (138) to produce sensor packages (20, 70).
摘要翻译：方法（80）需要提供（82）结构（117），提供（100）控制器元件（102,24），并将控制器元件（116）结合（116）到结构的外表面（52,64）。该结构包括传感器晶片（92）和盖晶片（94）晶片（92,94）的内表面（34,36）被耦合在一起，传感器（30）插入晶片之间。一个晶片（94,92）包括具有形成在其内表面（34,36）上的接合焊盘（42）的衬底部分（40,76）。另一个晶片（94,92）隐藏基板部分（40,76）。在结合之后，方法学（80）需要在元件（102,24）上形成（120）导电元件（60），从晶片去除（126）材料部分（96,98,107）以暴露接合焊盘，形成 130）电互连（56），施加（134）包装材料（64）和单分离（138）以产生传感器封装（20,70）。

27. 发明申请

US20140061948A1 SENSOR PACKAGING METHOD AND SENSOR PACKAGES 有权
标题翻译：传感器包装方法和传感器包装
公开(公告)号：US20140061948A1
公开(公告)日：2014-03-06
申请号：US13597824
申请日：2012-08-29
申请人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
发明人： Philip H. Bowles , Paige M. Holm , Stephen R. Hooper , Raymond M. Roop
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L23/528 , B81C1/0023 , B81C1/00238 , B81C2201/019 , B81C2203/0792 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A method (80) entails providing (82) a structure (117), providing (100) a controller element (102, 24), and bonding (116) the controller element to an outer surface (52, 64) of the structure (117). The structure includes a sensor wafer (92) and a cap wafer (94). Inner surfaces (34, 36) of the wafers (92, 94) are coupled together, with sensors (30) interposed between the wafers (92, 94). One wafer (94, 92) includes a substrate portion (40, 76) with bond pads (42) formed on its inner surface (34, 36). The other wafer (94, 92) conceals the substrate portion (40, 76). After bonding, methodology (80) entails forming (120) conductive elements (60) on the element (102, 24), removing (126) material sections (96, 98, 107) from the wafers (92, 94, 102) to expose the bond pads (42), forming (130) electrical interconnects (56), applying (134) packaging material (64), and singulating (138) to produce sensor packages (20, 70).
摘要翻译：方法（80）需要提供（82）结构（117），提供（100）控制器元件（102,24），并且将所述控制器元件（116）结合（116）到所述结构的外表面（52,64） 117）。该结构包括传感器晶片（92）和盖晶片（94）。晶片（92,94）的内表面（34,36）被耦合在一起，传感器（30）置于晶片（92,94）之间。一个晶片（94,92）包括具有形成在其内表面（34,36）上的接合焊盘（42）的衬底部分（40,76）。另一个晶片（94,92）隐藏基板部分（40,76）。在键合之后，方法（80）需要在元件（102,24）上形成（120）导电元件（60），将材料部分（96,98,107）从晶片（92,94,107）移除到露出接合焊盘（42），形成（130）电互连（56），施加（134）包装材料（64）和单分离（138）以产生传感器封装（20,70）。

28. 发明授权

US06596616B1 Method for forming serrated contact opening in the semiconductor device 失效
标题翻译：在半导体器件中形成锯齿形接触开口的方法
公开(公告)号：US06596616B1
公开(公告)日：2003-07-22
申请号：US10126795
申请日：2002-04-19
申请人： Paige M. Holm , Olin L. Hartin , H. Philip Li
发明人： Paige M. Holm , Olin L. Hartin , H. Philip Li
IPC分类号： H01L2144
CPC分类号： H01L29/66848 , H01L21/28575 , H01L21/76802 , H01L29/41725 , H01L29/456 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for decreasing contact resistance between a ohmic contact (120) and a semiconductor material (106) are disclosed. Increased contact resistance, which occurs as a result of encroachment of the ohmic contact (120) into the semiconductor material (106) is compensated for by notching edges of the ohmic contact (1210) to increase the effective surface area between abutting surfaces of the ohmic contact (120) and semiconductor material (106). The increase in surface area increases the effective transfer length of the contact, which correspondingly reduces contact resistance and improves device performance.
摘要翻译：公开了一种降低欧姆接触（120）和半导体材料（106）之间的接触电阻的方法和装置。由于欧姆接触（120）侵入半导体材料（106）而导致的增加的接触电阻通过欧姆接触（1210）的切口边缘来补偿，以增加欧姆接触（120）的邻接表面之间的有效表面积触点（120）和半导体材料（106）。表面积的增加增加了接触件的有效传递长度，从而相应地降低了接触电阻并提高了器件性能。

29. 发明授权

US5780321A LED display packaging with substrate removal and method of fabrication 失效
标题翻译： LED显示包装与基板去除及其制造方法
公开(公告)号：US5780321A
公开(公告)日：1998-07-14
申请号：US699263
申请日：1996-08-19
申请人： Chan-Long Shieh , Hsing-Chung Lee , Paige M. Holm
发明人： Chan-Long Shieh , Hsing-Chung Lee , Paige M. Holm
IPC分类号： H01L21/60 , G09F9/33 , H01L25/16 , H01L27/15 , H01L33/00 , H01L21/00
CPC分类号： H01L27/156 , H01L25/162 , H01L25/167 , H01L2924/0002
摘要： A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.
摘要翻译：一种发光二极管显示器封装以及制造在衬底上包括发光二极管阵列的发光二极管（LED）显示器封装的方法，所述发光二极管阵列具有布置成显示位于所述LED阵列器件的最上表面上的连接焊盘的行和列连接焊盘，具有连接到最上表面的连接焊盘的单独的硅驱动器装置，其被定位成在正确地注册时协同地与LED器件的那些耦合，使用标准C5 DCA将LED装置倒装芯片凸块结合到驱动器装置，底部填充层位于 LED设备和驱动器设备定义的空间。 LED显示器和驱动器件封装件随后选择性地去除了最初形成LED阵列的衬底。从LED显示装置发射的光通过LED装置的剩余的铟 - 镓 - 铝 - 磷化物（InGaAlP）外延层发射。

30. 发明授权

US5621225A Light emitting diode display package 失效
标题翻译：发光二极管显示封装
公开(公告)号：US5621225A
公开(公告)日：1997-04-15
申请号：US599434
申请日：1996-01-18
申请人： Chan-Long Shieh , Hsing-Chung Lee , Paige M. Holm
发明人： Chan-Long Shieh , Hsing-Chung Lee , Paige M. Holm
IPC分类号： H01L21/60 , G09F9/33 , H01L25/16 , H01L27/15 , H01L33/00 , H01L23/48
CPC分类号： H01L27/156 , H01L25/162 , H01L25/167 , H01L2924/0002
摘要： A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.
摘要翻译：一种发光二极管显示器封装以及制造在衬底上包括发光二极管阵列的发光二极管（LED）显示器封装的方法，所述发光二极管阵列具有布置成显示位于所述LED阵列器件的最上表面上的连接焊盘的行和列连接焊盘，具有连接到最上表面的连接焊盘的单独的硅驱动器器件，其被定位成在正确地注册时协同地与LED器件的LED器件匹配，使用标准C5 DCA将LED器件倒装芯片凸块结合到驱动器器件，底部填充层位于 LED设备和驱动器设备定义的空间。 LED显示器和驱动器件封装件随后选择性地去除了最初形成LED阵列的衬底。从LED显示装置发射的光通过LED装置的剩余的铟 - 镓 - 铝 - 磷化物（InGaAlP）外延层发射。

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