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21. 发明授权

US08436371B2 Microscale optoelectronic device packages 有权
标题翻译：微尺度光电器件封装
公开(公告)号：US08436371B2
公开(公告)日：2013-05-07
申请号：US11753483
申请日：2007-05-24
申请人： Nicholas W. Medendorp, Jr. , James Ibbetson
发明人： Nicholas W. Medendorp, Jr. , James Ibbetson
IPC分类号： H01L29/02
CPC分类号： H01L25/167 , H01L33/486 , H01L2224/48227 , H01L2224/48465 , H01L2224/8592 , H01L2924/19107 , H01S5/0206 , H01S5/06825 , H01L2924/00012 , H01L2924/00
摘要： An optoelectronic device article comprises a substrate containing at least one electrically conductive microvia, at least one emitter diode and at least one ESD diode, optionally formed in situ, disposed in or on the substrate, and an electrically conductive path between the foregoing elements. A reflector cavity may be defined in the substrate for receiving the emitter diode(s), with retention elements on the substrate used to retain a lens material. High flux density and high emitter diode spatial density may be attained. Thermal sensors, radiation sensors, and integral heat spreaders comprising one or more protruding fins may be integrated into the article.
摘要翻译：光电子器件制品包括一个衬底，该衬底包含至少一个导电微孔，至少一个发射极二极管和至少一个ESD二极管，可选择地原位地形成在衬底中或衬底上，以及前述元件之间的导电路径。可以在衬底中限定反射器腔，用于接收发射极二极管，衬底上的保持元件用于保持透镜材料。可以获得高通量密度和高发射极二极管空间密度。包括一个或多个突出翅片的热传感器，辐射传感器和整体散热器可以被整合到制品中。

22. 发明申请

US20120280263A1 COMPOSITE HIGH REFLECTIVITY LAYER 有权
标题翻译：复合高反射层
公开(公告)号：US20120280263A1
公开(公告)日：2012-11-08
申请号：US13415626
申请日：2012-03-08
申请人： James Ibbetson , Ting Li , Bernd Keller
发明人： James Ibbetson , Ting Li , Bernd Keller
IPC分类号： H01L33/60 , H01L33/48
CPC分类号： H01L33/46 , G02B19/0028 , G02B19/0061 , H01L33/48 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED or package to improve emission efficiency. One embodiment of a light emitting diode (LED) chip comprises a LED and a composite high reflectivity layer integral to the LED to reflect light emitted from the active region. One embodiment of a LED package comprises a LED mounted on a substrate with an encapsulant over said LED and a composite high reflectivity layer arranged to reflect emitted light. The composite layer comprises a plurality of layers such that at least one of said plurality of layers has an index of refraction lower than the encapsulant and a reflective layer on a side of said plurality of layers opposite the LED. In some embodiments, conductive vias are included through the composite layer to allow an electrical signal to pass through the layer to the LED.
摘要翻译：一种具有与所述LED或封装集成的复合高反射层的高效率发光二极管，以提高发射效率。发光二极管（LED）芯片的一个实施例包括LED和与LED成一体的复合高反射率层以反射从有源区域发射的光。 LED封装的一个实施例包括安装在具有在所述LED上的密封剂的衬底上的LED和布置成反射发射光的复合高反射率层。复合层包括多个层，使得所述多个层中的至少一个层具有低于密封剂的折射率和在与LED相对的所述多个层的一侧上的反射层。在一些实施例中，通过复合层包括导电通孔，以允许电信号通过该层到达LED。

23. 发明授权

US08138000B2 Methods for forming semiconductor light emitting devices and submounts 有权
标题翻译：用于形成半导体发光器件和底座的方法
公开(公告)号：US08138000B2
公开(公告)日：2012-03-20
申请号：US12397555
申请日：2009-03-04
申请人： Bernd Keller , James Ibbetson , Peter Andrews , Gerald H. Negley , Norbert Hiller
发明人： Bernd Keller , James Ibbetson , Peter Andrews , Gerald H. Negley , Norbert Hiller
IPC分类号： H01L21/00
CPC分类号： H01L33/507 , H01L25/167 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.
摘要翻译：半导体发光器件的基座包括其中具有腔室的半导体衬底，其配置为接收发光器件。第一接合焊盘定位在空腔中以耦合到容纳在空腔中的发光器件的第一节点。第二接合焊盘定位在空腔中以耦合到定位在其中的发光器件的第二节点。还提供了包括固体波长转换元件的发光器件及其形成方法。

24. 发明申请

US20120049214A1 Monolithic Multi-Junction Light Emitting Devices Including Multiple Groups of Light Emitting Diodes 审中-公开
标题翻译：包括多组发光二极管的单片多功能发光器件
公开(公告)号：US20120049214A1
公开(公告)日：2012-03-01
申请号：US13190108
申请日：2011-07-25
申请人： Theodore D. Lowes , James Ibbetson , Sten Helkman , Tao Tong
发明人： Theodore D. Lowes , James Ibbetson , Sten Helkman , Tao Tong
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , H01L33/0079 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A packaged light emitting diode (LED) includes a submount, a monolithic multi-junction LED on the submount, and an encapsulant material on the monolithic multi-junction LED. The monolithic multi-junction LED includes a substrate, a plurality of sub-LEDs on the submount, a plurality of conductive metal interconnects coupled to the sub-LEDs and connecting the sub-LEDs in a predetermined arrangement including an anode contact and a cathode contact, and an electrostatic discharge protection circuit in the substrate and coupled in parallel with the arrangement of sub-LEDs.
摘要翻译：封装的发光二极管（LED）包括底座，底座上的单片多结LED以及单片多结LED上的密封剂材料。单片多结LED包括基板，在底座上的多个子LED，耦合到子LED的多个导电金属互连件并以包括阳极接触件和阴极接触件的预定布置连接子LED 以及基板中的静电放电保护电路，并且与子LED的布置并联连接。

25. 发明授权

US07863635B2 Semiconductor light emitting devices with applied wavelength conversion materials 有权
标题翻译：具有应用波长转换材料的半导体发光器件
公开(公告)号：US07863635B2
公开(公告)日：2011-01-04
申请号：US11835044
申请日：2007-08-07
申请人： Peter S. Andrews , Ronan P. Le Toquin , James Ibbetson
发明人： Peter S. Andrews , Ronan P. Le Toquin , James Ibbetson
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/20 , H01L33/504 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor structure includes an active region configured to emit light upon the application of a voltage thereto, a window layer configured to receive the light emitted by the active region, and a plurality of discrete phosphor-containing regions on the window layer and configured to receive light emitted by the active region and to convert at least a portion of the received light to a different wavelength than a wavelength of light emitted by the active region. Methods of forming a semiconductor structure including an active region configured to emit light and a window layer include forming a plurality of discrete phosphor-containing regions on the window layer.
摘要翻译：半导体结构包括被配置为在施加电压时发光的有源区，被配置为接收由有源区发射的光的窗口层和窗口层上的多个离散的含磷光体的区域，并且被配置为接收由有源区发射的光并将至少一部分接收的光转换成与由有源区发射的光的波长不同的波长。形成包括被配置为发光的有源区域和窗口层的半导体结构的方法包括在窗口层上形成多个离散的含磷光体区域。

26. 发明申请

US20100283077A1 LIGHT EMITTING DIODES INCLUDING OPTICALLY MATCHED SUBSTRATES 有权
标题翻译：发光二极管，包括光学匹配的基板
公开(公告)号：US20100283077A1
公开(公告)日：2010-11-11
申请号：US12835366
申请日：2010-07-13
申请人： David B. Slater, JR. , Robert C. Glass , Charles M. Swoboda , Bernd Keller , James Ibbetson , Brian Thibeault , Eric J. Tarsa
发明人： David B. Slater, JR. , Robert C. Glass , Charles M. Swoboda , Bernd Keller , James Ibbetson , Brian Thibeault , Eric J. Tarsa
IPC分类号： H01L33/46 , H01L33/62
CPC分类号： H01L33/20 , H01L33/10 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/32014 , H01L2224/48091 , H01L2224/73265 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： Light emitting diodes include a diode region comprising a gallium nitride-based n-type layer, an active region and a gallium nitride-based p-type layer. A substrate is provided on the gallium nitride-based n-type layer and optically matched to the diode region. The substrate has a first face remote from the gallium nitride-based n-type layer, a second face adjacent the gallium nitride-based n-type layer and a sidewall therebetween. At least a portion of the sidewall is beveled, so as to extend oblique to the first and second faces. A reflector may be provided on the gallium nitride-based p-type layer opposite the substrate. Moreover, the diode region may be wider than the second face of the substrate and may include a mesa remote from the first face that is narrower than the first face and the second face.
摘要翻译：发光二极管包括包含氮化镓基n型层，有源区和氮化镓基p型层的二极管区。在氮化镓基n型层上提供衬底，并与二极管区域光学匹配。衬底具有远离氮化镓基n型层的第一面，与氮化镓基n型层相邻的第二面和其间的侧壁。侧壁的至少一部分是斜面的，以便倾斜地延伸到第一和第二面。可以在与衬底相对的氮化镓基p型层上设置反射器。此外，二极管区域可以比衬底的第二面宽，并且可以包括从第一面远离第一面和第二面的台面。

27. 发明授权

US07821023B2 Solid state lighting component 有权
标题翻译：固态照明组件
公开(公告)号：US07821023B2
公开(公告)日：2010-10-26
申请号：US12154691
申请日：2008-05-23
申请人： Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
发明人： Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/181 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
摘要翻译：一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

28. 发明授权

US07326583B2 Methods for packaging of a semiconductor light emitting device 有权
标题翻译：包装半导体发光器件的方法
公开(公告)号：US07326583B2
公开(公告)日：2008-02-05
申请号：US11044779
申请日：2005-01-27
申请人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
发明人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
IPC分类号： H01L21/00
CPC分类号： H01L33/58 , H01L33/52
摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.
摘要翻译：将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。反射腔中的密封材料固化。还提供了用于其的封装的半导体发光器件和反射器。

29. 发明授权

US07279346B2 Method for packaging a light emitting device by one dispense then cure step followed by another 有权
标题翻译：通过一次分配来包装发光装置的方法然后固化步骤，然后是另一个
公开(公告)号：US07279346B2
公开(公告)日：2007-10-09
申请号：US11044126
申请日：2005-01-27
申请人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
发明人： Peter Andrews , Thomas G. Coleman , James Ibbetson , Michael Leung , Gerald H. Negley , Eric Tarsa
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/52 , H01L33/60 , H01L2924/181 , H01L2924/00012
摘要： Methods of packaging a semiconductor light emitting device positioned in a reflective cavity are provided. A first quantity of encapsulant material is dispensed into the reflective cavity including the light emitting device therein and the first quantity of encapsulant in the reflective cavity is cured. A second quantity of encapsulant material is dispensed onto the cured first quantity of encapsulant material. A lens is positioned in the reflective cavity on the dispensed second quantity of encapsulant material. The dispensed second quantity of encapsulant material is cured to attach the lens in the reflective cavity.
摘要翻译：提供了封装位于反射腔中的半导体发光器件的方法。第一量的密封剂材料被分配到包括其中的发光器件的反射腔中，并且反射腔中的第一量的密封剂被固化。将第二数量的密封剂材料分配到固化的第一量的密封剂材料上。透镜位于所分配的第二数量的密封剂材料的反射腔中。所分配的第二数量的密封剂材料被固化以将透镜附着在反射腔中。

30. 发明申请

US20060278882A1 Power lamp package 有权
标题翻译：电源灯包装
公开(公告)号：US20060278882A1
公开(公告)日：2006-12-14
申请号：US11149998
申请日：2005-06-10
申请人： Michael Leung , James Ibbetson
发明人： Michael Leung , James Ibbetson
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： Adhesive-free assembly of the substrate and reflector components of a semiconductor die package is achieved by injection molding the reflector onto a surface of the substrate or by molding the reflector separate from the substrate and securing it in place on the substrate through deformation of a portion of the reflector. The reflector may be made reflective either by molding the reflector using a light scattering material or through the addition of a reflective element, such as a piece of foil material that is secured to the reflector. A variety of interchangeable reflective elements having different surface shapes, and thus different light reflecting properties, may be made.
摘要翻译：半导体管芯封装的衬底和反射器部件的无粘合剂组装通过将反射器注射到衬底的表面上或通过将反射器与衬底分离成模并将其固定在衬底上的适当位置来实现，的反射器。反射器可以通过使用光散射材料模制反射器或通过添加反射元件（例如固定到反射器的箔片材料）来制成。可以制造具有不同表面形状，因此具有不同光反射特性的各种可互换的反射元件。

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