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21. 发明授权

US07818878B2 Integrated circuit device mounting with folded substrate and interposer 有权
标题翻译：集成电路器件安装与折叠的基板和插入
公开(公告)号：US07818878B2
公开(公告)日：2010-10-26
申请号：US12042222
申请日：2008-03-04
申请人： Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
发明人： Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
IPC分类号： H05K3/30
CPC分类号： H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/141 , H05K1/147 , H05K1/189 , H05K7/1061 , H05K2201/056 , H05K2201/10378 , H05K2201/10734 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49144 , Y10T29/49146 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
摘要翻译：在一个实施例中，组装包装堆叠包括第一集成电路封装和第二集成电路封装，所述第一集成电路封装使用中介层和围绕插入件折叠的衬底机械地和电连接。描述和要求保护其他实施例。

22. 发明申请

US20090212091A1 Braided Solder 有权
标题翻译：编织焊
公开(公告)号：US20090212091A1
公开(公告)日：2009-08-27
申请号：US12038809
申请日：2008-02-27
申请人： Siuyoung Yao , Brian Taggart
发明人： Siuyoung Yao , Brian Taggart
IPC分类号： B23K1/00 , B23K35/02
CPC分类号： B23K1/00 , B23K3/063 , B23K35/0227 , B23K35/262 , B23K35/3006 , B23K35/362 , B23K35/365 , Y10T428/12222
摘要： Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present. In accordance with one soldering technique, a method of soldering is accomplished by melting a plurality of braided solder strands to join a plurality of metallic surfaces together.
摘要翻译：公开了改进的焊料和焊接方法。根据一种技术，使用具有编织在一起的多个单独的线股的焊料。根据另一种技术，编织焊料包括单个焊丝股线中相同的焊料组成和线规。根据另一种技术，编织焊料包括用于各个焊丝线中的至少两种不同的焊料组合物。根据另一技术，编织焊料包括在单独的焊丝股线中使用的至少两种不同的线规。根据另一种技术，编织焊料包括至少一根线股，其中主表面涂覆有贵金属的薄层。根据另一种技术，编织焊料包括至少一根线束，其中存在焊剂材料。根据一种焊接技术，焊接方法是通过熔化多个编织的焊料线来将多个金属表面结合在一起来实现的。

23. 发明申请

US20060202057A1 Fertilizer Distribution Apparatus 审中-公开
标题翻译：肥料分配装置
公开(公告)号：US20060202057A1
公开(公告)日：2006-09-14
申请号：US10906774
申请日：2005-03-06
申请人： Brian Taggart , Ryan Dohse
发明人： Brian Taggart , Ryan Dohse
IPC分类号： B05B7/26
CPC分类号： A01C23/042
摘要： A multi-purpose fertilizer distribution apparatus is described that can be incorporated into a new or existing underground irrigation system that facilitates the distribution of either liquid or solid fertilizer in the form of tablets or pellets. A main canister is adapted with an air sealed removable lid to allow access to replenish the fertilizer. The main canister has an integrated rod to hold specially designed fertilizer tablets and utilizes standard connectors to connect the apparatus to both the fluid source line of the irrigation system and the output line. The main canister permits connectors with integrated filters to be attached to permit easy connection between the apparatus and the irrigation system piping. The entire apparatus may be buried in the ground and is accessible at ground level for replenishment of fertilizer.
摘要翻译：描述了一种多用途肥料分配设备，其可以并入到新的或现有的地下灌溉系统中，其有利于片剂或小丸形式的液体或固体肥料的分配。主罐适用于空气密封的可拆卸盖子，以允许进入补充肥料。主罐具有集成的杆，用于容纳专门设计的肥料片，并使用标准连接器将设备连接到灌溉系统的液体源线和输出线。主罐允许具有集成过滤器的连接器被连接以允许装置和灌溉系统管道之间的容易连接。整个设备可能被埋在地下，并可在地面进入补充肥料。

24. 发明申请

US20090272745A1 Disposable Substance Dispensing Apparatus 审中-公开
标题翻译：一次性物质分配装置
公开(公告)号：US20090272745A1
公开(公告)日：2009-11-05
申请号：US12114682
申请日：2008-05-02
申请人： Ryan Dohse , Brian Taggart
发明人： Ryan Dohse , Brian Taggart
IPC分类号： B65D17/40 , B65D21/00 , B65D17/42 , B65D8/00
CPC分类号： B65D21/0205 , B65D71/0085 , B65D71/50
摘要： A disposable substance dispensing apparatus comprises a plurality of disposable substance dispensing containers coupled together in the shape of a fruit. Each of the containers is in the shape of a slice of fruit and has a fillable chamber accessed by a port through one of the outer walls of the container. A packaging material extends around each of the containers to hold the dispensing apparatus in the shape of a fruit. Each of the containers may individually be removed from the apparatus. The port of each container may be accessed by a single use tear-off or twist-off impermeable cap.
摘要翻译：一次性物质分配装置包括以水果形式连接在一起的多个一次性物质分配容器。每个容器都是一片水果的形状，并且具有通过容器的一个外壁通过端口进入的可填充室。包装材料围绕每个容器延伸以将分配装置保持为水果的形状。每个容器可以单独地从设备中取出。每个容器的端口可以通过一次使用的撕下或不透水的盖子进行访问。

25. 发明授权

US07358444B2 Folded substrate with interposer package for integrated circuit devices 有权
标题翻译：用于集成电路器件的带有插入器封装的折叠式衬底
公开(公告)号：US07358444B2
公开(公告)日：2008-04-15
申请号：US10964790
申请日：2004-10-13
申请人： Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
发明人： Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
IPC分类号： H05K1/00
CPC分类号： H01L23/5387 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/141 , H05K1/147 , H05K1/189 , H05K7/1061 , H05K2201/056 , H05K2201/10378 , H05K2201/10734 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49144 , Y10T29/49146 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
摘要翻译：在一个实施例中，组装包装堆叠包括第一集成电路封装和第二集成电路封装，所述第一集成电路封装使用中介层和围绕插入件折叠的衬底机械地和电连接。描述和要求保护其他实施例。

26. 发明授权

US07304373B2 Power distribution within a folded flex package method and apparatus 有权
标题翻译：折叠式柔性包装方法和装置内的功率分配
公开(公告)号：US07304373B2
公开(公告)日：2007-12-04
申请号：US10977908
申请日：2004-10-28
申请人： Brian Taggart , Robert M. Nickerson , Ronald L. Spreitzer
发明人： Brian Taggart , Robert M. Nickerson , Ronald L. Spreitzer
IPC分类号： H01L23/02
CPC分类号： H01L23/50 , H01L23/5387 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06579 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01077 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routing pattern of collector voltage signals.
摘要翻译：一种装置包括折叠的柔性基底。存储芯片连接到折叠的柔性基板的第一侧。逻辑裸片连接到折叠的柔性基板的第二侧。源电压信号的跟踪路由模式与集电极电压信号的跟踪路由模式相同。

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