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21. 发明授权

US07134194B2 Method of developing an electronic module 失效
标题翻译：开发电子模块的方法
公开(公告)号：US07134194B2
公开(公告)日：2006-11-14
申请号：US10707004
申请日：2003-11-13
申请人： Scott D. Brandenburg , Todd P. Oman , Micheal E. Miller
发明人： Scott D. Brandenburg , Todd P. Oman , Micheal E. Miller
IPC分类号： H05K3/30
CPC分类号： H05K1/147 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/3436 , H05K3/363 , H05K2201/10189 , H05K2201/10303 , H05K2201/10674 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49153 , Y10T29/49158
摘要： An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic module includes a motherboard, a multichip module (MCM) mounted to the motherboard, and a circuit unit connected to the MCM. The circuit unit comprises a flexible substrate, instrumentation circuitry mounted on the flexible substrate, and a connector coupled to the flexible substrate. The flexible substrate has signal lines that electrically communicate with the MCM, the instrumentation circuitry, and the connector. A portion of the flexible substrate is located between the MCM and the motherboard and permits electrical communication therebetween. The instrumentation circuitry does not occupy space on the motherboard.
摘要翻译：一种电子模块和方法，其使得模块的一种形式（例如，发展单元）所需的电路在模块的第二形式（例如，生产单元）中被省略，而不需要模块的额外改变。电子模块包括主板，安装到母板的多芯片模块（MCM）和连接到MCM的电路单元。电路单元包括柔性基板，安装在柔性基板上的仪器电路和耦合到柔性基板的连接器。柔性基板具有与MCM，仪表电路和连接器电连通的信号线。柔性基板的一部分位于MCM和母板之间并且允许它们之间的电连通。仪表电路不占用主板上的空间。

22. 发明授权

US07030317B1 Electronic assembly with stacked integrated circuit die 有权
标题翻译：电子组装与堆叠集成电路模具
公开(公告)号：US07030317B1
公开(公告)日：2006-04-18
申请号：US11105317
申请日：2005-04-13
申请人： Todd P. Oman
发明人： Todd P. Oman
IPC分类号： H01L23/02
CPC分类号： H01L23/36 , H01L21/563 , H01L23/552 , H01L25/074 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An electronic assembly with a plurality of stacked integrated circuit (IC) die includes a base substrate, a first IC die, a second IC die, a signal routing first interconnect and a signal routing second interconnect. The first interconnect is partially positioned between the first and second IC dies. The second interconnect is partially positioned adjacent the first side of the second IC die. The first interconnect couples a first contact of the first IC die to a first trace of the base substrate and a second contact of the second IC die to a second trace of the base substrate. The first and second interconnects, in combination, couple the first contact of the second IC die to the first trace.
摘要翻译：具有多个堆叠集成电路（IC）管芯的电子组件包括基底基板，第一IC芯片，第二IC芯片，信号路由第一互连和信号路由第二互连。第一互连部分地位于第一和第二IC芯片之间。第二互连部分地位于第二IC芯片的第一侧附近。第一互连将第一IC芯片的第一接触耦合到基底基板的第一迹线和第二IC管芯与基底基板的第二迹线的第二接触。组合的第一和第二互连将第二IC芯片的第一接触耦合到第一迹线。

23. 发明授权

US08973989B2 Occupant detection sensor assembly 有权
标题翻译：乘员检测传感器组件
公开(公告)号：US08973989B2
公开(公告)日：2015-03-10
申请号：US13364904
申请日：2012-02-02
申请人： Todd P. Oman , Richard P. Sickon
发明人： Todd P. Oman , Richard P. Sickon
IPC分类号： B60N2/44
CPC分类号： B60N2/44 , B60N2/002 , B60N2/2854 , B60N2/2863 , B60R21/01516 , B60R21/01556
摘要： A sensor system and seat assembly includes a sensor assembly configured to detect a seating force exerted on a portion of a seat cushion of a seat. The sensor assembly includes a base, a force transducer configured to output a signal indicative of the seating force, and a lever pivotably coupled to the base. The lever defines a sensing end configured to be disposed proximate to the portion of the seat cushion such that the seating force operates on the sensing end. The lever also defines an actuating end configured to apply an actuation force to the force transducer. The sensor assembly may comprise a plurality of levers. Each sensing end of each lever may be disposed in a separate location within the portion of the seat cushion. The sensor assembly may be configured to detect a child exerting a seating force on a portion of the seat cushion.
摘要翻译：传感器系统和座椅组件包括被配置为检测施加在座椅的座垫的一部分上的就座力的传感器组件。传感器组件包括基座，力传感器，其构造成输出指示就座力的信号，以及可枢转地联接到基座的杆。杠杆限定感测端，其被配置为靠近座垫的部分设置，使得就座力在感测端上操作。杠杆还限定了构造成向力传感器施加致动力的致动端。传感器组件可以包括多个杆。每个杠杆的每个感测端可以设置在座垫的部分内的分开的位置。传感器组件可以被配置为检测儿童在座垫的一部分上施加就座力。

24. 发明授权

US07821123B2 LED array cooling system 有权
标题翻译： LED阵列散热系统
公开(公告)号：US07821123B2
公开(公告)日：2010-10-26
申请号：US11225288
申请日：2005-09-13
申请人： Todd P. Oman
发明人： Todd P. Oman
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H01L33/648 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： A LED array cooling system including a LED array and a substrate attached to the LED array wherein the LED array includes a plurality of walls that at least in part define a plurality of passages through the LED array.
摘要翻译：一种LED阵列冷却系统，其包括LED阵列和附接到所述LED阵列的基板，其中所述LED阵列包括至少部分地限定穿过所述LED阵列的多个通道的多个壁。

25. 发明授权

US07659615B2 High power package with dual-sided heat sinking 有权
标题翻译：大功率封装，双面散热
公开(公告)号：US07659615B2
公开(公告)日：2010-02-09
申请号：US11799916
申请日：2007-05-03
申请人： Todd P. Oman
发明人： Todd P. Oman
IPC分类号： H01L23/34 , H01L23/15
CPC分类号： H01L23/3128 , H01L23/367 , H01L23/3675 , H01L23/49833 , H01L24/32 , H01L24/33 , H01L2224/291 , H01L2224/32227 , H01L2224/33181 , H01L2924/30107 , H01L2924/3025 , H01L2924/014
摘要： An assembly includes a semiconductor die disposed between an upper substrate and a lower substrate. A circuit board that defines a through hole is spaced axially below the upper substrate to define a gap between the upper substrate and the circuit board. An upper heat sink is thermally connected to the upper substrate by an upper thermal interface material to transfer heat in a first dissipation path to the upper heat sink. A lower heat sink is thermally connected to the lower substrate by a lower thermal interface material to transfer heat in a second dissipation path to the lower heat sink. A plurality of first interconnectors are disposed in the gap to solder the upper substrate to the circuit board. The assembly is distinguished by a plurality of second interconnectors that are disposed between the upper substrate and the lower substrate to position the lower substrate in the through hole of the circuit board.
摘要翻译：组件包括设置在上基板和下基板之间的半导体管芯。限定通孔的电路板在上基板的下方轴向间隔开，以限定上基板和电路板之间的间隙。上部散热器通过上部热界面材料热连接到上部基板，以将第一散热路径中的热量传递到上部散热器。较低的散热器通过较低的热界面材料热连接到下基板，以将第二散热路径中的热量传递到下散热器。多个第一互连器设置在间隙中以将上基板焊接到电路板。该组件的特征在于，设置在上基板和下基板之间的多个第二互连器，以将下基板定位在电路板的通孔中。

26. 发明授权

US07537965B2 Manufacturing method for a leadless multi-chip electronic module 失效
标题翻译：无铅多芯片电子模块的制造方法
公开(公告)号：US07537965B2
公开(公告)日：2009-05-26
申请号：US11471869
申请日：2006-06-21
申请人： Todd P. Oman
发明人： Todd P. Oman
IPC分类号： H01L21/00
CPC分类号： H01L23/3107 , H01L21/4832 , H01L23/49541 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A leadless multi-chip electronic module with leadframe bond pads is manufactured in a manner to place small signal bond pads in a central region of the module for significantly increased reliability of solder joints between such bond pads and a substrate of the module. A linear array of parallel leadframe elements disposed in a central region of the module and bridging first and second larger IC leadframe bond pads are converted into signal bond pads by a pair of partial bottom-side saw cuts. The saw cuts run parallel to and adjacent the first and second IC bond pads to electrically isolate the leadframe elements from the IC bond pads and other bond pads. The partial saw cuts are made following encapsulation and preferably before leadframe singulation.
摘要翻译：制造具有引线框接合焊盘的无引线多芯片电子模块，以便将小信号接合焊盘放置在模块的中心区域中，以显着增加这种焊盘与模块的基板之间的焊点的可靠性。布置在模块的中心区域并桥接第一和第二较大的IC引线框接合焊盘的并联引线框架元件的线性阵列通过一对局部底侧锯切转换成信号焊盘。锯切平行于第一和第二IC接合焊盘并与之相邻，以将引线框架元件与IC接合焊盘和其它接合焊盘电隔离。部分锯切是在封装之后并且优选地在引线框架切割之前制成的。

27. 发明授权

US07118940B1 Method of fabricating an electronic package having underfill standoff 失效
标题翻译：制造具有底部填充间隔的电子封装的方法
公开(公告)号：US07118940B1
公开(公告)日：2006-10-10
申请号：US11198444
申请日：2005-08-05
申请人： Bruce A. Myers , David W. Ihms , Todd P. Oman
发明人： Bruce A. Myers , David W. Ihms , Todd P. Oman
IPC分类号： H01L21/48 , H01L23/48 , B23K31/02
CPC分类号： H01L21/563 , H01L24/29 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/10165 , H01L2224/73203 , H01L2224/81024 , H01L2224/81136 , H01L2224/8114 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2224/83102 , H01L2224/83192 , H01L2224/83194 , H01L2224/92125 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/305 , H05K2201/10674 , H05K2201/10977 , H05K2201/2036 , Y02P70/613 , H01L2924/3512 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic package having a controlled standoff height between a surface mount device and a circuit board. The electronic package includes a circuit board having a substrate and circuitry including mounting pads and a surface mount device having circuitry and contact terminals. Solder joints connect the contact terminals of the surface mount device to the mounting pads on the circuit board. A dielectric underfill is disposed between the circuit board and the surface mount device, and a plurality of standoff members are disposed in the underfill material to provide a separation distance between the circuit board and the surface mount device.
摘要翻译：一种在表面安装器件和电路板之间具有受控的间隔高度的电子封装。电子封装包括具有基板的电路板和包括安装焊盘的电路和具有电路和接触端子的表面安装装置。焊接点将表面安装器件的接触端子连接到电路板上的安装焊盘。在电路板和表面安装器件之间设置电介质底部填充物，并且在底部填充材料中设置多个支撑构件以提供电路板和表面安装器件之间的间隔距离。

28. 发明授权

US07064963B2 Multi-substrate circuit assembly 有权
标题翻译：多基板电路组件
公开(公告)号：US07064963B2
公开(公告)日：2006-06-20
申请号：US10708935
申请日：2004-04-01
申请人： Todd P. Oman , Thomas A. Degenkolb
发明人： Todd P. Oman , Thomas A. Degenkolb
IPC分类号： H05K1/11 , H05K1/03 , H05K1/00 , B32B3/00
CPC分类号： H01L25/162 , H01L23/367 , H01L23/49833 , H01L2224/73204 , H01L2224/73253 , H05K1/0203 , H05K1/0306 , H05K1/142 , H05K3/3421 , H05K3/3447 , H05K2201/0187 , H05K2201/1034 , H05K2201/10977 , Y10T428/24917
摘要： Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a first surface thereof and a periphery defining a lateral surface surrounding the first surface. The organic substrate also comprises a first surface and a periphery defining a lateral surface surrounding the first surface. A portion of the lateral surface of the organic substrate is adjacent a portion of the lateral surface of the ceramic substrate so as to define an interface therebetween. At least one conductor common to both the ceramic and organic substrates and bridging the interface therebetween serves to physically connect the ceramic and organic substrates together.
摘要翻译：通过使用包括陶瓷衬底和有机衬底的电路组件来热管理大功率IC器件。陶瓷基板在其第一表面上具有至少一个电路元件，限定围绕第一表面的侧表面的周边。有机基底还包括限定围绕第一表面的侧表面的第一表面和外围。有机衬底的侧表面的一部分与陶瓷衬底的侧表面的一部分相邻，从而在其间形成界面。陶瓷和有机衬底共同的至少一个导体和桥接它们之间的界面用于将陶瓷和有机衬底物理连接在一起。

29. 发明授权

US06873043B2 Electronic assembly having electrically-isolated heat-conductive structure 有权
标题翻译：具有电隔离导热结构的电子组件
公开(公告)号：US06873043B2
公开(公告)日：2005-03-29
申请号：US10385106
申请日：2003-03-10
申请人： Todd P. Oman
发明人： Todd P. Oman
IPC分类号： H01L21/56 , H01L23/433 , H01L23/36
CPC分类号： H01L21/563 , H01L23/433 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/131 , H01L2224/73204 , H01L2224/73253 , H01L2224/81193 , H01L2224/81815 , H01L2924/0001 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/3025 , H01L2924/00 , H01L2924/014 , H01L2224/13099 , H01L2224/0401
摘要： An electronic assembly equipped with a heat-conductive structure, and to a method of conducting heat from a circuit device within such an assembly. The heat-conductive structure comprises an interconnect layer, a contact layer, and an electrically insulating layer between the interconnect and contact layers. The interconnect layer contacts circuit elements on the topside of the device, and comprises extensions that contact conductors on the substrate to which the device is attached. The interconnect and contact layers are both formed of thermally and electrically conductive materials, such that the heat-conductive structure electrically interconnects the topside of the device with the substrate and thermally interconnects the topside with a heat sink placed in contact with the contact layer. Because of the presence of the insulating layer, the heat sink does not interfere with the electrical connections provided by the interconnect layer.
摘要翻译：一种装配有导热结构的电子组件，以及一种从这种组件内的电路装置传导热量的方法。导热结构包括互连层，接触层和互连层和接触层之间的电绝缘层。互连层接触器件顶部的电路元件，并且包括与该器件所附接的衬底上的导体接触的延伸部。互连层和接触层都由导热材料和导电材料形成，使得导热结构将器件的顶侧与衬底电互连，并将顶层与与接触层接触放置的散热片热连接。由于绝缘层的存在，散热器不会干扰由互连层提供的电连接。

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