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21. 发明授权

US07648598B2 Manufacturing method for isothermal evaporation casting process 有权
标题翻译：等温蒸发铸造工艺的制造方法
公开(公告)号：US07648598B2
公开(公告)日：2010-01-19
申请号：US11584847
申请日：2006-10-23
申请人： Sheng-Long Lee , Ten-Fu Wu , Jing-Chie Lin , Che-Wei Hsu , Fu-Kai Hsu , Cheng-En Jiang
发明人： Sheng-Long Lee , Ten-Fu Wu , Jing-Chie Lin , Che-Wei Hsu , Fu-Kai Hsu , Cheng-En Jiang
IPC分类号： C22C19/03 , B22D27/00
CPC分类号： C22C19/007 , C22C3/00 , C22C23/00
摘要： A manufacturing method for an isothermal evaporation casting process is disclosed and to design the manufacturing method for the simple atmospheric casting. The present invention can melt the Mg—Ni alloy with the aspect of totally different melting points thereof, and the other elements can be added during melting simultaneously. Through the Mg—Ni alloy with a suitable weight ratio, the eutectic alloy of Mg/Mg2Ni and high purified γ-phase Mg2Ni can be made. Then adding other elements are to produce the composition of Mg/Ni/M. By way of the manufacturing method of the present invention, the melting equipment is simplified; and, through different manufacturing steps, the purposes of time-saving and low cost are reached; further that, a large amount of the eutectic alloy of Mg/Mg2Ni with different kinds of ratios of Mg, high purified γ-phase Mg2Ni, or the composition of Mg/Ni/M can be obtained.
摘要翻译：公开了一种等温蒸发铸造工艺的制造方法，并设计了简单大气铸造的制造方法。本发明可以熔融Mg-Ni合金，其熔点完全不同，其它元素可以在熔融的同时加入。通过合适重量比的Mg-Ni合金，可以制备Mg / Mg2Ni和高纯γ相Mg2Ni共晶合金。然后添加其他元素是产生Mg / Ni / M的组成。通过本发明的制造方法，简化了熔化设备; 通过不同的制造步骤，实现了节省时间和低成本的目的; 此外，可以获得大量的具有不同种类的Mg，高纯度γ相Mg2Ni比的Mg / Mg2Ni或Mg / Ni / M组成的共晶合金。

22. 发明申请

US20070087587A1 Method for manufacturing circuit board for semiconductor package 审中-公开
标题翻译：半导体封装电路板的制造方法
公开(公告)号：US20070087587A1
公开(公告)日：2007-04-19
申请号：US11543679
申请日：2006-10-04
申请人： Ming Chang , E-Tung Chou , Che-Wei Hsu , Tzu-Sheng Tseng
发明人： Ming Chang , E-Tung Chou , Che-Wei Hsu , Tzu-Sheng Tseng
IPC分类号： H01R12/00
CPC分类号： H05K3/242 , H01L21/4803 , H01L21/481 , H01L23/13 , H01L2924/0002 , H05K3/0044 , H05K2203/0228 , H05K2203/107 , H05K2203/175 , H01L2924/00
摘要： A method for manufacturing a circuit board for a semiconductor package is proposed. The method includes providing a circuit board having a circuit layer formed on at least one surface thereof, wherein the circuit board is defined with at least one predetermined area, the circuit layer includes a plurality of electrically conductive pads and conductive wires for electroplating and being connected with the electrically conductive pads, the conductive wires are formed within the predetermined area, and a metal protecting layer formed to cover the electrically conductive pads and the conductive wires; removing the portion of the metal protecting layer and the conductive wires covered by the portion of the metal protecting layer to electrically disconnect the electrically conductive pads from the conductive wires; and removing the predetermined area to form a through hole in the circuit board. Thus, formation of burrs in the metal protecting layer can be prevented after formation of the through hole.
摘要翻译：提出一种制造半导体封装用电路基板的方法。该方法包括提供具有形成在其至少一个表面上的电路层的电路板，其中电路板被限定有至少一个预定区域，电路层包括多个导电焊盘和用于电镀和连接的导线通过导电焊盘，导电线形成在预定区域内，形成为覆盖导电焊盘和导线的金属保护层; 去除金属保护层的一部分和由金属保护层的部分覆盖的导电线，以使导电焊盘与导电线电断开; 并且移除所述预定区域以在所述电路板中形成通孔。因此，在形成通孔之后可以防止在金属保护层中形成毛刺。

23. 发明申请

US20120181824A1 SEAT ADJUSTING MODULE 有权
标题翻译：座椅调节模块
公开(公告)号：US20120181824A1
公开(公告)日：2012-07-19
申请号：US13006444
申请日：2011-01-14
申请人： Che-Wei Hsu , Hui-Yuan Su
发明人： Che-Wei Hsu , Hui-Yuan Su
IPC分类号： B62J1/00
CPC分类号： B62J1/08
摘要： A seat adjusting module suitable to connect the saddle including at least a seat rail and a seat tube of a bicycle is provided, wherein the module includes a base assembled to an end of the seat tube, a clamp unit including two clamp elements and a fastening unit including two fasteners. The first clamp element has at least a first clamp portion and a shaft portion matched to the base at a first or a second position so as to rotate relatively to the base on a first or a second rotation axis. The second clamp element has at least a second clamp portion, which with the first clamp portion together clamps the seat rail. The two fasteners together fasten the two clamp elements to the base so that the first and second clamp portions together clamp tightly the seat rail.
摘要翻译：提供了一种适于连接包括至少座椅导轨和自行车的座管的鞍座的座椅调节模块，其中所述模块包括组装到所述座管的一端的基座，包括两个夹紧元件和紧固件单元包括两个紧固件。第一夹紧元件至少具有第一夹持部分和在第一或第二位置处与基部匹配的轴部分，以便在第一或第二旋转轴线上相对于基部旋转。第二夹紧元件具有至少第二夹紧部分，其中第一夹紧部分一起夹持座椅导轨。两个紧固件一起将两个夹紧元件紧固到基座，使得第一和第二夹紧部分一起紧紧地夹紧座椅导轨。

24. 发明申请

US20110031606A1 PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP 审中-公开
标题翻译：具有嵌入式半导体芯片的封装基板
公开(公告)号：US20110031606A1
公开(公告)日：2011-02-10
申请号：US12852052
申请日：2010-08-06
申请人： Yen-Ju Chen , Che-Wei Hsu , Kan-Jung Chia
发明人： Yen-Ju Chen , Che-Wei Hsu , Kan-Jung Chia
IPC分类号： H01L23/48 , H01L23/08
CPC分类号： H05K1/185 , H01L23/3121 , H01L23/5389 , H01L24/03 , H01L24/06 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/24227 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/3011 , H05K1/036 , H05K1/0366 , H05K3/4602 , H05K3/4605 , H05K3/4608 , H05K2201/10674
摘要： A packaging substrate includes: a core board having opposite first and second surfaces and a cavity penetrating therethrough; a semiconductor chip disposed in the cavity and having an active surface with electrode pads and an opposite inactive surface; a first reinforcing dielectric layer containing a reinforcing material disposed on the first surface and the active surface and filling the gap between the chip and the cavity; a second reinforcing dielectric layer containing a reinforcing material disposed on the second surface and the inactive surface and filling the gap between the chip and the cavity; and first and second wiring layers disposed on the first and second reinforcing dielectric layers respectively and the first wiring layer electrically connecting to the electrode pads. The first and second reinforcing dielectric layers enhance the support force of the entire structure to thereby prevent delamination of the wiring layers from the dielectric layers and increase product yield and reliability.
摘要翻译：包装基板包括：具有相对的第一和第二表面的芯板和穿透其中的空腔; 半导体芯片，其设置在所述空腔中并具有具有电极焊盘和相对的无效表面的有源表面; 第一增强介质层，其包含设置在所述第一表面和所述有源表面上并且填充所述芯片和所述空腔之间的间隙的增强材料; 第二增强介质层，其包含设置在所述第二表面和所述非活性表面上并且填充所述芯片和所述空腔之间的间隙的增强材料; 以及分别设置在第一和第二增强电介质层上的第一和第二布线层，以及电连接到电极焊盘的第一布线层。第一和第二增强介电层增强了整个结构的支撑力，从而防止了布线层与电介质层的分层，从而提高了产品的产量和可靠性。

25. 发明申请

US20080190244A1 Method of fabricating metal compound through smelting with vaporization purification 审中-公开
标题翻译：用蒸发净化法冶炼金属化合物的方法
公开(公告)号：US20080190244A1
公开(公告)日：2008-08-14
申请号：US11790882
申请日：2007-04-27
申请人： Sheng-Long Lee , Jing-Chie Lin , Tien-Fu Wu , Che-Wei Hsu , Cheng-En Jiang , Jen-Hao Liu , Chun-Yu Lin , Yu-Chin Kao
发明人： Sheng-Long Lee , Jing-Chie Lin , Tien-Fu Wu , Che-Wei Hsu , Cheng-En Jiang , Jen-Hao Liu , Chun-Yu Lin , Yu-Chin Kao
IPC分类号： C22B9/05
CPC分类号： C22B9/02 , C22B9/006 , C22B26/22 , Y02P10/234
摘要： The present invention provides a method for mass producing any metal alloy. After melting a metal mixture, a mixture of heating, soaking and/or cooling is processed to obtain the alloy even with a trace element added. The metal alloy made by the present invention thus has a high purity and a low cost.
摘要翻译：本发明提供一种批量生产任何金属合金的方法。在熔融金属混合物后，加热，均热和/或冷却的混合物即使加入微量元素即可得到合金。因此，由本发明制成的金属合金具有高纯度和低成本。

26. 发明授权

US07399399B2 Method for manufacturing semiconductor package substrate 有权
标题翻译：半导体封装基板的制造方法
公开(公告)号：US07399399B2
公开(公告)日：2008-07-15
申请号：US11523337
申请日：2006-09-18
申请人： E-Tung Chou , Che-Wei Hsu , Tzu-Sheng Tseng
发明人： E-Tung Chou , Che-Wei Hsu , Tzu-Sheng Tseng
IPC分类号： C25D5/02
CPC分类号： H05K3/243 , H01L21/4878 , H01L23/13 , H01L2924/0002 , H05K1/117 , H05K3/0044 , H05K3/0052 , H05K2203/0361 , H05K2203/0542 , H05K2203/0574 , H05K2203/0577 , Y10T29/49155 , Y10T29/49156 , H01L2924/00
摘要： A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads distributed on the periphery of the free area. A metal protecting layer is plated on the electrically connecting pads by non-plating line. The free area is removed, to form a cavity penetrating the circuit board. The present invention prevents burrs which may otherwise form on the periphery of a cavity, to increase the yield and throughput.
摘要翻译：提出了半导体封装的制造方法。提供了在其至少一个表面上具有电路层的电路板。电路板具有至少一个自由区域，并且电路层具有分布在自由区域的周边上的多个电连接焊盘。金属保护层通过非电镀线电镀在电连接焊盘上。去除自由区域，形成贯穿电路板的腔体。本发明可以防止在空腔周边形成的毛刺，从而提高产量和产量。

27. 发明申请

US20080093046A1 Manufacturing method for isothermal evaporation casting process 有权
标题翻译：等温蒸发铸造工艺的制造方法
公开(公告)号：US20080093046A1
公开(公告)日：2008-04-24
申请号：US11584847
申请日：2006-10-23
申请人： Sheng-Long Lee , Ten-Fu Wu , Jing-Chie Lin , Che-Wei Hsu , Fu-Kai Hsu , Cheng-En Jiang
发明人： Sheng-Long Lee , Ten-Fu Wu , Jing-Chie Lin , Che-Wei Hsu , Fu-Kai Hsu , Cheng-En Jiang
IPC分类号： B22D27/00 , C22C19/03
CPC分类号： C22C19/007 , C22C3/00 , C22C23/00
摘要： A manufacturing method for an isothermal evaporation casting process is disclosed and to design the manufacturing method for the simple atmospheric casting. The present invention can melt the Mg—Ni alloy with the aspect of totally different melting points thereof, and the other elements can be added during melting simultaneously. Through the Mg—Ni alloy with a suitable weight ratio, the eutectic alloy of Mg/Mg2Ni and high purified γ-phase Mg2Ni can be made. Then adding other elements are to produce the composition of Mg/Ni/M. By way of the manufacturing method of the present invention, the melting equipment is simplified; and, through different manufacturing steps, the purposes of time-saving and low cost are reached; further that, a large amount of the eutectic alloy of Mg/Mg2Ni with different kinds of ratios of Mg, high purified γ-phase Mg2Ni, or the composition of Mg/Ni/M can be obtained.
摘要翻译：公开了一种等温蒸发铸造工艺的制造方法，并设计了简单大气铸造的制造方法。本发明可以熔融Mg-Ni合金，其熔点完全不同，其它元素可以在熔融的同时加入。通过具有合适重量比的Mg-Ni合金，可以制备Mg / Mg 2 Ni和高纯度γ相Mg 2 Ni的共晶合金。然后添加其他元素是产生Mg / Ni / M的组成。通过本发明的制造方法，简化了熔化设备; 通过不同的制造步骤，实现了节省时间和低成本的目的; 此外，大量Mg / Mg 2 Ni的共晶合金与Mg，高纯度γ相Mg 2 Ni的比例不同，或组合物的Mg / Ni / M。

28. 发明申请

US20080056457A1 Mobile communication device and method of receiving voice on conference mode 审中-公开
标题翻译：移动通信设备和在会议模式下接收语音的方法
公开(公告)号：US20080056457A1
公开(公告)日：2008-03-06
申请号：US11646250
申请日：2006-12-28
申请人： Che-Wei Hsu
发明人： Che-Wei Hsu
IPC分类号： H04M1/64
CPC分类号： H04M1/6008 , H04M1/72522
摘要： A mobile communication device includes a position setting module, a voice receiving module and a beamforming module. The position setting module sets a group of position parameters, and the voice receiving module receives a voice to generate at least one voice datum. The beamforming module adaptively adjusts a gain of the voice datum according to the position parameters so as to obtain a beamforming voice datum.
摘要翻译：移动通信设备包括位置设置模块，语音接收模块和波束形成模块。位置设定模块设置一组位置参数，并且语音接收模块接收语音以生成至少一个声音数据。波束成形模块根据位置参数自适应地调整声音数据的增益，以获得波束成形语音数据。

29. 发明申请

US20080055418A1 Portable terminal apparatus 审中-公开
标题翻译：便携式终端设备
公开(公告)号：US20080055418A1
公开(公告)日：2008-03-06
申请号：US11647291
申请日：2006-12-29
申请人： Che-Wei Hsu
发明人： Che-Wei Hsu
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04M1/66 , H04N5/2257
摘要： A portable terminal apparatus includes a main body, a power key and a digital camera module. The power key is disposed on and exposed from the main body. The power key is pervious to light. The digital camera module is disposed inside the main body and has a lens device facing the power key.
摘要翻译：便携式终端装置包括主体，电源键和数字照相机模块。电源键设置在主体上并从主体露出。电源键是透光的。数码相机模块设置在主体内部，并且具有面向电源键的透镜装置。

30. 发明授权

US07956559B2 Motor driving device 失效
标题翻译：电机驱动装置
公开(公告)号：US07956559B2
公开(公告)日：2011-06-07
申请号：US12361229
申请日：2009-01-28
申请人： Che-Wei Hsu , Chi-Lin Hsu
发明人： Che-Wei Hsu , Chi-Lin Hsu
IPC分类号： H02P1/00
CPC分类号： H02P6/085 , H02P6/26
摘要： The invention discloses a motor driving device for generating at least one driving signal according to a clock signal corresponding to the output signal of a hall sensor. The motor driving device also controls rotation of a motor via at least one driving signal, wherein the at least one driving signal includes a first driving signal and a second driving signal and the motor driving device controls the rotation of the motor according to the first driving signal and the second driving signal.
摘要翻译：本发明公开了一种电动机驱动装置，用于根据对应于霍尔传感器的输出信号的时钟信号产生至少一个驱动信号。马达驱动装置还通过至少一个驱动信号来控制马达的旋转，其中至少一个驱动信号包括第一驱动信号和第二驱动信号，马达驱动装置根据第一驱动来控制马达的旋转信号和第二驱动信号。

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