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21. 发明授权

US08381994B2 Data storage device, stacking method thereof, and data storage device assembly 有权
标题翻译：数据存储装置，其堆叠方法和数据存储装置组件
公开(公告)号：US08381994B2
公开(公告)日：2013-02-26
申请号：US13025172
申请日：2011-02-11
申请人： Cheng-Chieh Hsieh
发明人： Cheng-Chieh Hsieh
IPC分类号： G06K19/06
CPC分类号： H05K5/0278 , H05K5/026 , Y10T29/49069
摘要： A data storage device, a stacking method thereof, and a data storage device assembly are provided. The data storage device assembly includes a first data storage device and a second data storage device respectively having a body, a magnetic element, and a storage device. Each body has a first containing space and a second containing space. Each magnetic element is disposed in the corresponding first containing space. At least one of the magnetic elements of the first and the second data storage device is a magnet. Each storage device is disposed in the corresponding second containing space and includes an electrical connector terminal, a memory chip, and a memory controller with no crystal oscillator. The magnetic elements of the first and the second data storage device attract each other so that the body of the first data storage device is stacked on the body of the second data storage device.
摘要翻译：提供了数据存储装置，其堆叠方法和数据存储装置组件。数据存储装置组件包括分别具有主体，磁性元件和存储装置的第一数据存储装置和第二数据存储装置。每个主体具有第一容纳空间和第二容纳空间。每个磁性元件设置在相应的第一容纳空间中。第一和第二数据存储装置的至少一个磁性元件是磁体。每个存储装置设置在对应的第二容纳空间中，并且包括电连接器端子，存储芯片和不具有晶体振荡器的存储器控制器。第一和第二数据存储装置的磁性元件彼此吸引，使得第一数据存储装置的主体堆叠在第二数据存储装置的主体上。

22. 发明授权

US08557631B2 Interposer wafer bonding method and apparatus 有权
标题翻译：内插晶圆接合方法和装置
公开(公告)号：US08557631B2
公开(公告)日：2013-10-15
申请号：US13308742
申请日：2011-12-01
申请人： Chen-Hua Yu , Chien-Chia Chiu , Cheng-Chieh Hsieh
发明人： Chen-Hua Yu , Chien-Chia Chiu , Cheng-Chieh Hsieh
IPC分类号： H01L21/00
CPC分类号： H01L24/75 , H01L23/544 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/97 , H01L2224/04105 , H01L2224/11002 , H01L2224/12105 , H01L2224/13024 , H01L2224/131 , H01L2224/73267 , H01L2224/757 , H01L2224/75743 , H01L2224/7598 , H01L2224/81002 , H01L2224/81132 , H01L2224/81143 , H01L2224/81191 , H01L2224/95146 , H01L2224/96 , H01L2224/97 , H01L2924/10253 , H01L2224/81 , H01L2924/00012 , H01L2224/11 , H01L2924/014 , H01L2924/00
摘要： The present disclosure relates to a method for fast and precise alignment and mounting of a top die onto an interposer wafer. The method is performed by applying a hydrophobic self assembled monolayer to a carrier wafer in a pattern defining a top die placement region correlating to an arrangement of a top die on an interposer wafer. A liquid is provided into the top die placement region and a top die is placed into contact with the liquid. The surface tension of the liquid automatically aligns the top die by generating a force causing the top die to overlap with the top die placement region. The liquid is then eliminated and the top die is affixed to the carrier wafer. The carrier wafer is bonded to the interposer wafer, bringing the top die into contact with an interposer.
摘要翻译：本公开涉及一种用于将顶模快速且精确地对准和安装到插入器晶片上的方法。该方法通过将疏水性自组装单层以限定与插入物晶片上的顶模的布置相关的顶模放置区的图案施加于载体晶片来进行。将液体提供到顶部模具放置区域中，并且顶部模具被放置成与液体接触。液体的表面张力通过产生导致顶模与顶模放置区重叠的力自动对准顶模。然后消除液体，并将顶模固定到载体晶片上。载体晶片结合到插入器晶片，使顶模与插入件接触。

23. 发明授权

US08482922B2 Microfins for cooling an ultramobile device 有权
标题翻译：用于冷却超移动装置的微烯烃
公开(公告)号：US08482922B2
公开(公告)日：2013-07-09
申请号：US13189389
申请日：2011-07-22
申请人： Zhihua Li , Cheng-Chieh Hsieh , Jack Hu , Hakan Erturk , George Chen
发明人： Zhihua Li , Cheng-Chieh Hsieh , Jack Hu , Hakan Erturk , George Chen
IPC分类号： H05K7/20 , B21D53/02
CPC分类号： H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
摘要翻译：本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。

24. 发明申请

US20120145796A1 DATA STORAGE DEVICE, STACKING METHOD THEREOF, AND DATA STORAGE DEVICE ASSEMBLY 有权
标题翻译：数据存储设备，其堆叠方法和数据存储设备组件
公开(公告)号：US20120145796A1
公开(公告)日：2012-06-14
申请号：US13025172
申请日：2011-02-11
申请人： Cheng-Chieh Hsieh
发明人： Cheng-Chieh Hsieh
IPC分类号： G06K19/077 , H05K13/00
CPC分类号： H05K5/0278 , H05K5/026 , Y10T29/49069
摘要： A data storage device, a stacking method thereof, and a data storage device assembly are provided. The data storage device assembly includes a first data storage device and a second data storage device respectively having a body, a magnetic element, and a storage device. Each body has a first containing space and a second containing space. Each magnetic element is disposed in the corresponding first containing space. At least one of the magnetic elements of the first and the second data storage device is a magnet. Each storage device is disposed in the corresponding second containing space and includes an electrical connector terminal, a memory chip, and a memory controller with no crystal oscillator. The magnetic elements of the first and the second data storage device attract each other so that the body of the first data storage device is stacked on the body of the second data storage device.
摘要翻译：提供了数据存储装置，其堆叠方法和数据存储装置组件。数据存储装置组件包括分别具有主体，磁性元件和存储装置的第一数据存储装置和第二数据存储装置。每个主体具有第一容纳空间和第二容纳空间。每个磁性元件设置在相应的第一容纳空间中。第一和第二数据存储装置的至少一个磁性元件是磁体。每个存储装置设置在对应的第二容纳空间中，并且包括电连接器端子，存储芯片和不具有晶体振荡器的存储器控制器。第一和第二数据存储装置的磁性元件彼此吸引，使得第一数据存储装置的主体堆叠在第二数据存储装置的主体上。

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