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    • 21. 发明申请
    • PHASE CHANGE MEMORY DEVICES EMPLOYING CELL DIODES AND METHODS OF FABRICATING THE SAME
    • 使用单元的相变存储器件及其制造方法
    • US20080303016A1
    • 2008-12-11
    • US12196137
    • 2008-08-21
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • H01L45/00
    • G11C13/0004G11C2213/72H01L27/2409H01L27/2463H01L45/06H01L45/1233H01L45/1675
    • Phase change memory devices having cell diodes and related methods are provided, where the phase change memory devices include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate, the word lines have a second conductivity type different from the first conductivity type and have substantially flat top surfaces, a plurality of first semiconductor patterns are one-dimensionally arrayed on each word line along a length direction of the word line, the first semiconductor patterns have the first conductivity type or the second conductivity type, second semiconductor patterns having the first conductivity type are stacked on the first semiconductor patterns, an insulating layer is provided on the substrate having the second semiconductor patterns, the insulating layer fills gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns, a plurality of phase change material patterns are two-dimensionally arrayed on the insulating layer, and the phase change material patterns are electrically connected to the second semiconductor patterns, respectively.
    • 提供具有单元二极管和相关方法的相变存储器件,其中相变存储器件包括第一导电类型的半导体衬底和设置在半导体衬底上的多个平行字线,字线具有不同的第二导电类型 从第一导电类型并且具有基本上平坦的顶表面,沿着字线的长度方向在每个字线上一维地排列多个第一半导体图案,第一半导体图案具有第一导电类型或第二导电类型 具有第一导电类型的第二半导体图案堆叠在第一半导体图案上,在具有第二半导体图案的基板上设置绝缘层,绝缘层填充字线之间的间隙区域,第一半导体图案之间的间隙区域和 第二半导体之间的间隙区域 多个相变材料图案被二维排列在绝缘层上,并且相变材料图案分别电连接到第二半导体图案。
    • 22. 发明授权
    • Phase change memory devices employing cell diodes and methods of fabricating the same
    • 使用单元二极管的相变存储器件及其制造方法
    • US07427531B2
    • 2008-09-23
    • US11324112
    • 2005-12-30
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • H01L21/06
    • G11C13/0004G11C2213/72H01L27/2409H01L27/2463H01L45/06H01L45/1233H01L45/1675
    • Phase change memory devices having cell diodes and related methods are provided, where the phase change memory devices include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate, the word lines have a second conductivity type different from the first conductivity type and have substantially flat top surfaces, a plurality of first semiconductor patterns are one-dimensionally arrayed on each word line along a length direction of the word line, the first semiconductor patterns have the first conductivity type or the second conductivity type, second semiconductor patterns having the first conductivity type are stacked on the first semiconductor patterns, an insulating layer is provided on the substrate having the second semiconductor patterns, the insulating layer fills gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns, a plurality of phase change material patterns are two-dimensionally arrayed on the insulating layer, and the phase change material patterns are electrically connected to the second semiconductor patterns, respectively.
    • 提供具有单元二极管和相关方法的相变存储器件,其中相变存储器件包括第一导电类型的半导体衬底和设置在半导体衬底上的多个平行字线,字线具有不同的第二导电类型 从第一导电类型并且具有基本上平坦的顶表面,沿着字线的长度方向在每个字线上一维地排列多个第一半导体图案,第一半导体图案具有第一导电类型或第二导电类型 具有第一导电类型的第二半导体图案堆叠在第一半导体图案上,在具有第二半导体图案的基板上设置绝缘层,绝缘层填充字线之间的间隙区域,第一半导体图案之间的间隙区域和 第二半导体之间的间隙区域 多个相变材料图案被二维排列在绝缘层上,并且相变材料图案分别电连接到第二半导体图案。
    • 25. 发明授权
    • Phase-change memory device and method of writing a phase-change memory device
    • 相变存储器件以及相变存储器件的写入方法
    • US07502251B2
    • 2009-03-10
    • US11502563
    • 2006-08-11
    • Byung-Gil ChoiChoong-Keun KwakDu-Eung KimBeak-Hyung Cho
    • Byung-Gil ChoiChoong-Keun KwakDu-Eung KimBeak-Hyung Cho
    • G11C11/00
    • G11C13/0069G11C13/0004G11C13/0023G11C2013/0078G11C2013/0092
    • A phase-change cell memory device includes a plurality of phase-change memory cells, an address circuit, a write driver, and a write driver control circuit. The phase-change memory cells each include a volume of material that is programmable between amorphous and crystalline states. The address circuit selects at least one of the memory cells, and the write driver generates a reset pulse current to program a memory cell selected by the address circuit into the amorphous state, and a set pulse current to program the memory cell selected by the address circuit into the crystalline state. The write driver control circuit varies at least one of a pulse width and a pulse count of at least one of the reset and set pulse currents according to a load between the write driver and the memory cell selected by the address circuit.
    • 相变单元存储器件包括多个相变存储器单元,地址电路,写入驱动器和写入驱动器控制电路。 相变存储单元各自包括可在非晶态和晶态之间编程的材料体积。 地址电路选择存储单元中的至少一个,并且写入驱动器产生复位脉冲电流以将由地址电路选择的存储单元编程为非晶状态,以及设置脉冲电流以对由地址选择的存储单元进行编程 电路进入结晶状态。 写入驱动器控制电路根据写入驱动器和由地址电路选择的存储器单元之间的负载来改变至少一个复位和设置的脉冲电流的脉冲宽度和脉冲计数中的至少一个。