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    • 21. 发明申请
    • Method of manufacturing flash memory device
    • 制造闪存设备的方法
    • US20050106813A1
    • 2005-05-19
    • US10745165
    • 2003-12-23
    • Seong LeeSang KwakSang Park
    • Seong LeeSang KwakSang Park
    • H01L21/76H01L21/336H01L21/461H01L21/8234H01L21/8247H01L27/08H01L27/088H01L27/10H01L27/105H01L27/115H01L29/788H01L29/792
    • H01L27/115H01L27/105H01L27/11526H01L27/11546
    • Provided is a method of manufacturing a flash memory device. In a flash memory device using a self-aligned shallow trench isolation scheme, a buffer oxide layer is formed between a first polysilicon layer and a nitride layer. After a polishing process for forming a field oxide film is performed, a buffer oxide layer is used as an etch-prevention layer in the process of stripping the nitride layer and the buffer oxide layer is stripped in a cleaning process before a second polysilicon layer is deposited. It is thus possible not only to prevent phosphorous ions contained in an H3PO4 solution used in the process of stripping the nitride layer from diffusing into the grain boundary of the first polysilicon layer, but also to reduce the time when the first polysilicon layer is exposed to a HF cleaner used in the cleaning process before the second polysilicon layer is deposited. Therefore, the present invention has effects that it can enhance the properties of a gate oxide layer and a gate electrode by minimizing an attack of a fluorine radical contained in the HF cleaner against the first polysilicon layer.
    • 提供一种制造闪速存储器件的方法。 在使用自对准浅沟槽隔离方案的闪存器件中,在第一多晶硅层和氮化物层之间形成缓冲氧化物层。 在进行用于形成场氧化膜的抛光工艺之后,在剥离氮化物层的过程中使用缓冲氧化物层作为防蚀层,并且在第二多晶硅层为第二多晶硅层之前在清洁过程中剥离缓冲氧化物层 存放 因此,不仅可以防止在剥离氮化物层的过程中使用的H 3 PO 4·4溶液中所含的磷离子扩散到第一 而且在第二多晶硅层沉积之前也减少了第一多晶硅层暴露于清洁工艺中使用的HF清洁剂的时间。 因此,本发明具有通过使包含在HF清洁器中的氟自由基相对于第一多晶硅层的侵蚀最小化来提高栅极氧化物层和栅电极的性质的效果。
    • 26. 发明申请
    • Nitride semiconductor light emitting device
    • 氮化物半导体发光器件
    • US20070114540A1
    • 2007-05-24
    • US11600870
    • 2006-11-17
    • Seong LeeKyeong MinSoo KimMin Kim
    • Seong LeeKyeong MinSoo KimMin Kim
    • H01L33/00
    • H01L33/08H01L33/06H01L33/32
    • Disclosed herein is a nitride semiconductor light emitting device, which comprises plural active layers emitting light of different wavelengths. The device comprises p-type and n-type nitride layers, and a plurality of active layers sequentially stacked between the p-type and n-type nitride layers to emit light having different wavelengths. The active layers comprise at least a first active layer to emit a first wavelength light, and a second active layer to emit a second wavelength light, of which wavelength is longer than that of the first wavelength light. Both the first and second active layers are composed of at least one quantum well layer and a quantum barrier layer alternately arranged, and the first active layer is disposed closer to the p-type nitride layer than the second active layer. The number of quantum well layers of the first active layer is less than that of the second active layer.
    • 本文公开了一种氮化物半导体发光器件,其包括发射不同波长的光的多个有源层。 该器件包括p型和n型氮化物层,以及顺序堆叠在p型和n型氮化物层之间以发射具有不同波长的光的多个有源层。 有源层至少包括发射第一波长光的第一有源层和发射波长比第一波长光长的第二波长光的第二有源层。 第一和第二有源层都由交替布置的至少一个量子阱层和量子势垒层构成,并且第一有源层设置成比第二有源层更靠近p型氮化物层。 第一有源层的量子阱层的数量小于第二有源层的量子阱层的数量。
    • 28. 发明申请
    • Transistor using impact ionization and method of manufacturing the same
    • 使用冲击电离的晶体管及其制造方法
    • US20060125041A1
    • 2006-06-15
    • US11296152
    • 2005-12-06
    • Jong YangIn BaekKi ImChang AhnWon ChoSeong Lee
    • Jong YangIn BaekKi ImChang AhnWon ChoSeong Lee
    • H01L27/095
    • H01L29/66659H01L21/26586H01L21/28052H01L21/28202H01L29/495H01L29/518H01L29/665H01L29/66643H01L29/7835H01L29/7839
    • A transistor using impact ionization and a method of manufacturing the same are provided. A gate dielectric layer, a gate, and first and second spacers are formed on a semiconductor substrate. A first impurity layer is formed spaced from the first spacer and a second impurity layer is formed expanding and overlapping with the second spacer therebelow, by performing slant ion-implantation on the semiconductor substrate using the gate and the first and second spacers as a mask. A source and a drain are formed on the semiconductor substrate to be self-aligned with the first and second spacers, respectively, thereby defining an ionization region between the source and the drain in the semiconductor substrate. The source includes a first silicide layer to form a schottky junction with the ionization region. The drain includes a portion of the second impurity layer overlapping with the second spacer and a second silicide layer which is aligned with the second spacer to form an ohmic contact with the second impurity layer.
    • 提供了使用冲击电离的晶体管及其制造方法。 栅极电介质层,栅极以及第一和第二间隔物形成在半导体衬底上。 第一杂质层与第一间隔物隔开形成,并且通过使用栅极和第一和第二间隔物作为掩模在半导体衬底上进行倾斜离子注入,形成第二杂质层与其间的第二间隔物膨胀和重叠。 源极和漏极分别形成在半导体衬底上以与第一和第二间隔物自对准,由此在半导体衬底中的源极和漏极之间限定电离区域。 源包括与电离区形成肖特基结的第一硅化物层。 漏极包括与第二间隔物重叠的第二杂质层的一部分和与第二间隔物对准的第二硅化物层以与第二杂质层形成欧姆接触。