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    • 29. 发明授权
    • Low dielectric loss composite material
    • 低介电损耗复合材料
    • US07648758B2
    • 2010-01-19
    • US11671698
    • 2007-02-06
    • Brian G. Morin
    • Brian G. Morin
    • D02G3/00D04H1/00
    • H05K1/0366B29C70/506B29K2995/0006C08J5/043C08J2365/00D21H13/40H05K2201/0129H05K2201/0158Y10T428/249924Y10T428/2913Y10T428/2915Y10T428/2931Y10T442/2475Y10T442/3146
    • Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.
    • 公开了可以表现出低的透射能量损失并且也可以是耐温的复合材料。 复合材料包括保持在聚合物基质中的增强纤维。 聚合物基质可以包括无定形聚合物组分。 还公开了形成复合材料的方法。 方法可以包括形成无定形热塑性聚合物纤维,从纤维形成织物,将织物与增强纤维相结合,以及在热和压力下模制由此形成的结构,使得无定型热塑性聚合物流动并形成结合增强纤维的聚合物基体。 复合材料可以由可以包括不同材料的层的多层结构模制,例如由聚芳酰胺,玻璃纤维或碳纤维织物或无纺布形成的层。 复合材料可有利地用于低损耗介电应用中,例如形成电路板基板,天线罩,天线等。