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    • 21. 发明申请
    • Low Dielectric Loss Composite Material
    • 低介电损耗复合材料
    • US20080187734A1
    • 2008-08-07
    • US11671698
    • 2007-02-06
    • Brian G. Morin
    • Brian G. Morin
    • D04H1/00
    • H05K1/0366B29C70/506B29K2995/0006C08J5/043C08J2365/00D21H13/40H05K2201/0129H05K2201/0158Y10T428/249924Y10T428/2913Y10T428/2915Y10T428/2931Y10T442/2475Y10T442/3146
    • Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.
    • 公开了可以表现出低的透射能量损失并且也可以是耐温的复合材料。 复合材料包括保持在聚合物基质中的增强纤维。 聚合物基质可以包括无定形聚合物组分。 还公开了形成复合材料的方法。 方法可以包括形成无定形热塑性聚合物纤维,从纤维形成织物,将织物与增强纤维相结合,以及在热和压力下模制由此形成的结构,使得无定型热塑性聚合物流动并形成结合增强纤维的聚合物基体。 复合材料可以由可以包括不同材料的层的多层结构模制,例如由聚芳酰胺,玻璃纤维或碳纤维织物或无纺布形成的层。 复合材料可有利地用于低损耗介电应用中,例如形成电路板基板,天线罩,天线等。
    • 22. 发明授权
    • Low-shrink polypropylene tape fibers comprising high amounts of nucleating agents
    • 包含大量成核剂的低收缩聚丙烯带纤维
    • US06887567B2
    • 2005-05-03
    • US10286622
    • 2002-11-02
    • Brian G. MorinMartin E. CowanJack A. Smith
    • Brian G. MorinMartin E. CowanJack A. Smith
    • D01D5/42D01F1/10D01F6/06D01F6/00
    • D01D5/426B29K2023/12B29K2223/12D01F1/10D01F6/06Y10T428/2913Y10T428/2964Y10T428/2967Y10T442/3976
    • Improvements in preventing heat- and moisture-shrink problems in specific polypropylene tape fibers are provided. Such tape fibers are basically manufactured through the initial production of polypropylene films or tubes which are then slit into very thin, though flat (and having very high cross sectional aspect ratios) tape fibers thereafter. These inventive tape fibers (and thus the initial films and/or tubes) require the presence of relatively high amounts of certain compounds that quickly and effectively provide rigidity to the target polypropylene tape fiber. Generally, these compounds include any structure that nucleates polymer crystals within the target polypropylene after exposure to sufficient heat to melt the initial pelletized polymer and allowing such an oriented polymer to cool. The compounds must nucleate polymer crystals at a higher temperature than the target polypropylene without the nucleating agent during cooling. In such a manner, the “rigidifying” nucleator compounds provide nucleation sites for polypropylene crystal growth. Subsequent to slitting the initial film and/or tube, the fiber is then exposed to sufficient heat to grow the crystalline network, thus holding the fiber in a desired position. The preferred “rigidifying” compounds include dibenzylidene sorbitol based compounds, as well as less preferred compounds, such as [2.2.1]heptane-bicyclodicarboxylic acid, otherwise known as HPN-68, sodium benzoate, certain sodium and lithium phosphate salts [such as sodium 2,2′-methylene-bis-(4,6-di-tert-butylphenyl)phosphate, otherwise known as NA-11]. Specific methods of manufacture of such inventive tape fibers, as well as fabric articles made therefrom, are also encompassed within this invention.
    • 提供了防止特定聚丙烯带纤维中的热收缩和水分收缩问题的改进。 这种带状纤维基本上通过初始生产聚丙烯膜或管制成,然后将其切割成非常薄的(但具有非常高的截面长宽比)的带状纤维。 这些本发明的带状纤维(和因此初始膜和/或管)需要相对高量的某些化合物的存在,其快速且有效地为目标聚丙烯带纤维提供刚性。 通常,这些化合物包括在暴露于足够的热量以熔化初始颗粒聚合物并允许这种取向聚合物冷却之后使目标聚丙烯中的聚合物晶体成核的任何结构。 在冷却期间,化合物必须在比没有成核剂的目标聚丙烯更高的温度下使聚合物晶体成核。 以这种方式,“硬化”成核剂化合物提供聚丙烯晶体生长的成核位点。 在切割初始膜和/或管之后,然后将纤维暴露于足够的热量以生长结晶网络,从而将纤维保持在期望的位置。 优选的“硬化”化合物包括二亚苄基山梨醇基化合物,以及较不优选的化合物,例如[2.2.1]庚烷 - 双环二羧酸,另外称为HPN-68,苯甲酸钠,某些钠和磷酸锂盐[例如 2,2'-亚甲基 - 双 - (4,6-二叔丁基苯基)磷酸钠,另外称为NA-11]。 制造这种本发明的带状纤维的具体方法以及由其制成的织物制品也包括在本发明内。
    • 23. 发明授权
    • Textile/rubber composites
    • 纺织/橡胶复合材料
    • US06497954B1
    • 2002-12-24
    • US09561267
    • 2000-04-28
    • Brian G. MorinDany Felix Maria MichielsBrenda D. Wentz
    • Brian G. MorinDany Felix Maria MichielsBrenda D. Wentz
    • D02G300
    • B32B38/0008B32B38/162B32B2305/18B32B2319/00C08J5/06C08J2321/00D06M10/08Y10S156/91Y10T428/2933
    • This invention relates to a method of promoting the adhesion of textiles to rubber compounds through a vinyl compound plasma pre-treatment procedure and a subsequent application of resorcinol-formaldehyde latex (RFL) to the textile surface. The inventive method encompasses a process through which free radicals of compounds comprising strong carbon-carbon bonds form a film over textile films and then covalently bonded to the resin component of the RFL. Such a method thus produces an extremely strong and versatile adhesive that facilitates adhesion between rubber compounds and heretofore unusable or difficult-to-use textiles. The resultant textile/rubber composites are utilized as reinforcements within such materials as automobile tires, fan belts, conveyor belts, and the like. Such materials and composites are also contemplated within this invention.
    • 本发明涉及通过乙烯基化合物等离子体预处理方法和随后将间苯二酚 - 甲醛胶乳(RFL)应用于织物表面来促进纺织品对橡胶化合物的粘附的方法。 本发明的方法包括一种方法,通过该方法,包含强碳 - 碳键的化合物的自由基在织物膜上形成膜,然后共价键合到RFL的树脂组分。 因此,这样一种方法产生了一种非常坚固和通用的粘合剂,其有助于橡胶化合物之间的粘合和迄今为止不可用或难以使用的纺织品之间的粘合。 所得的纺织品/橡胶复合材料用作汽车轮胎,风扇皮带,传送带等材料中的增强材料。 这些材料和复合材料也在本发明中。
    • 30. 发明授权
    • Low dielectric loss composite material
    • 低介电损耗复合材料
    • US07648758B2
    • 2010-01-19
    • US11671698
    • 2007-02-06
    • Brian G. Morin
    • Brian G. Morin
    • D02G3/00D04H1/00
    • H05K1/0366B29C70/506B29K2995/0006C08J5/043C08J2365/00D21H13/40H05K2201/0129H05K2201/0158Y10T428/249924Y10T428/2913Y10T428/2915Y10T428/2931Y10T442/2475Y10T442/3146
    • Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.
    • 公开了可以表现出低的透射能量损失并且也可以是耐温的复合材料。 复合材料包括保持在聚合物基质中的增强纤维。 聚合物基质可以包括无定形聚合物组分。 还公开了形成复合材料的方法。 方法可以包括形成无定形热塑性聚合物纤维,从纤维形成织物,将织物与增强纤维相结合,以及在热和压力下模制由此形成的结构,使得无定型热塑性聚合物流动并形成结合增强纤维的聚合物基体。 复合材料可以由可以包括不同材料的层的多层结构模制,例如由聚芳酰胺,玻璃纤维或碳纤维织物或无纺布形成的层。 复合材料可有利地用于低损耗介电应用中,例如形成电路板基板,天线罩,天线等。