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    • 21. 发明授权
    • Method for manufacturing multilayer chip capacitor
    • 多层片式电容器制造方法
    • US07644480B2
    • 2010-01-12
    • US11822189
    • 2007-07-03
    • Hyoung Ho KimHyo Soon ShinHo Sung Choo
    • Hyoung Ho KimHyo Soon ShinHo Sung Choo
    • H01G4/005
    • H01G4/232H01G4/012Y10T29/413Y10T29/417Y10T29/435
    • A method for manufacturing a multilayer chip capacitor includes: forming screen patterns on mother green sheets such that a widthwise margin is not formed on the mother green sheets, the screen patterns are spaced apart from each other in the width direction and the longitudinal direction, and a width of each screen pattern is greater than a spacing between the adjacent screen patterns; forming internal electrode patterns on the mother green sheets; forming a stack of the mother green sheets; forming a capacitor body having internal electrodes by cutting the stack of the mother green sheets along cutting lines arranged in the width direction and the longitudinal direction; forming chip-protecting side members on both sides of the capacitor body such that the chip-protecting side members contact both sides of the internal electrodes, respectively; and forming a pair of terminal electrodes on the outer surface of the capacitor body.
    • 一种多层片式电容器的制造方法,其特征在于,在母版本上形成屏幕图案,使得母版未形成宽度方向的边缘,屏幕图案在宽度方向和长度方向上彼此间隔开, 每个屏幕图案的宽度大于相邻屏幕图案之间的间距; 在母板上形成内部电极图案; 形成一堆母亲的生页; 通过沿着宽度方向和长度方向布置的切割线切割母版本的叠层来形成具有内部电极的电容器体; 在电容器主体的两侧形成芯片保护侧部件,使得芯片保护侧部件分别接触内部电极的两侧; 以及在电容器主体的外表面上形成一对端子电极。