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21. 发明授权

US08217275B2 Sealing material and mounting method using the sealing material 有权
标题翻译：密封材料和使用密封材料的安装方法
公开(公告)号：US08217275B2
公开(公告)日：2012-07-10
申请号：US12517311
申请日：2007-12-03
申请人： Atsushi Yamaguchi , Hidenori Miyakawa , Kousou Matsuno
发明人： Atsushi Yamaguchi , Hidenori Miyakawa , Kousou Matsuno
IPC分类号： H05K1/00
CPC分类号： H01L21/563 , C08G59/4021 , C08L63/00 , C09K3/10 , C09K2200/0645 , C09K2200/0647 , C09K2200/065 , H01L23/293 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , Y02P20/582 , Y10T29/4913 , Y10T29/49146 , Y10T29/49726 , H01L2924/00
摘要： A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ΔE/ΔT in a range of from 0.5 MPa/° C. to 30 MPa/° C. wherein ΔE/ΔT represents a ratio of change (ΔE) in storage elastic modulus (E) relative to a temperature change (ΔT) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material.
摘要翻译：提供了一种密封材料，其在将电子部件安装在基板上时具有低应力和高可靠性的密封特性，并且在密封之后具有良好的可维修性。密封材料含有热固性树脂组分，其特征在于：在0.5MPa /℃至30MPa /℃的范围内，其中＆Dgr; E /＆Dgr; T表示比例的变化（＆Dgr; E）相对于温度变化（＆Dgr; T）的储存弹性模量（E），当储存弹性模量（E）在包括玻璃化转变点（Tg））固化的密封材料。

22. 发明授权

US08205327B2 Method for manufacturing circuit board on which electronic component is mounted 有权
标题翻译：制造电子部件的电路基板的制造方法
公开(公告)号：US08205327B2
公开(公告)日：2012-06-26
申请号：US12094219
申请日：2006-11-13
申请人： Hidenori Miyakawa , Atsushi Yamaguchi , Kazuhiro Nishikawa , Kunio Hibino
发明人： Hidenori Miyakawa , Atsushi Yamaguchi , Kazuhiro Nishikawa , Kunio Hibino
IPC分类号： H05K3/30
CPC分类号： H05K3/323 , H05K3/321 , Y10T29/49114 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165
摘要： A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.
摘要翻译：一种制造其上安装有电子部件的电路板的方法至少包括以下步骤：（a）将包含分散在其中的导电粒子的液体光聚合性粘合剂供应到印刷电路板的表面上，以形成粘合剂层板表面; （b）用紫外线照射光聚合性粘合剂变成凝胶，以提供粘合剂层的粘附性; 以及（c）从粘合剂层的上表面侧将电子部件压靠在印刷基板的部件安装部上，形成电子部件与部件安装部之间的电连接，在该方法中，可聚合粘合剂是延迟的反应性粘合剂。

23. 发明申请

US20120066170A1 NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM, SOUND-VOLUME PREDICTION APPARATUS, AND SOUND-VOLUME PREDICTION METHOD 有权
标题翻译：非终端计算机可读存储介质，声量预测装置和声量预测方法
公开(公告)号：US20120066170A1
公开(公告)日：2012-03-15
申请号：US13213616
申请日：2011-08-19
申请人： Hiroyuki FURUYA , Atsushi Yamaguchi , Akihiro Otsuka , Akira Ueda
发明人： Hiroyuki FURUYA , Atsushi Yamaguchi , Akihiro Otsuka , Akira Ueda
IPC分类号： G06N5/02
CPC分类号： G10K11/16
摘要： A sound-volume prediction apparatus acquires model information on an electronic device and positional information on an air intake section and/or an air-exhaust section of the electronic device. Furthermore, by using the model information and the positional information, the sound-volume prediction apparatus extends a sound ray that indicates a transmission route of sound generated by a sound source inside the electronic device toward the air-intake section and/or the air-exhaust section from the position of the sound source until the sound ray reaches the outside of the electronic device. The sound-volume prediction apparatus predicts sound transmission characteristics inside the electronic device by using geometric information on the flow path of the extended sound ray.
摘要翻译：音量预测装置获取关于电子装置的模型信息以及电子装置的进气部和排气部的位置信息。此外，通过使用模型信息和位置信息，音量预测装置将指示由电子设备内部的声源产生的声音的传输路线朝向进气部分和/或空气 - 排气部分从声源的位置到声线到达电子设备的外部。音量预测装置通过使用延伸声线的流路上的几何信息来预测电子装置内部的声音传输特性。

24. 发明授权

US08102622B2 Perpendicular magnetic write head, method of manufacturing the same and method of forming magnetic layer pattern 有权
标题翻译：垂直写磁头，制造方法及形成磁性层图案的方法
公开(公告)号：US08102622B2
公开(公告)日：2012-01-24
申请号：US12318645
申请日：2009-01-05
申请人： Atsushi Yamaguchi , Michitaka Nishiyama , Shin Narushima , Hiromichi Umehara , Makoto Sato , Tatsuhiro Nojima
发明人： Atsushi Yamaguchi , Michitaka Nishiyama , Shin Narushima , Hiromichi Umehara , Makoto Sato , Tatsuhiro Nojima
IPC分类号： G11B5/127
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/3163
摘要： In a perpendicular magnetic write head manufacturing method a magnetic layer is formed on a substrate. On the magnetic layer, first and second nonmagnetic layers are formed with different materials. A mask pattern is formed on the second nonmagnetic layer, and the second nonmagnetic layer in a region not covered with the mask pattern is removed. Thereby, the patterned second nonmagnetic layer is formed while leaving the first nonmagnetic layer. The mask pattern is removed and a milling process is selectively performed on the first nonmagnetic layer and the magnetic layer with the patterned second nonmagnetic layer as a mask to remove all of the first nonmagnetic layer in an exposed region and to dig down the magnetic layer in the exposed region, thereby forming a main magnetic pole layer having an inclined part whose thickness decreases with distance from an edge position of the patterned second nonmagnetic layer.
摘要翻译：在垂直磁性写入头制造方法中，在衬底上形成磁性层。在磁性层上，第一和第二非磁性层由不同的材料形成。在第二非磁性层上形成掩模图案，并且去除未被掩模图案覆盖的区域中的第二非磁性层。由此，形成图案化的第二非磁性层，同时离开第一非磁性层。去除掩模图案，并且在第一非磁性层和具有图案化的第二非磁性层的磁性层上选择性地进行研磨工艺作为掩模，以去除暴露区域中的所有第一非磁性层，并将从而形成具有倾斜部分的主磁极层，该倾斜部分的厚度随着距图案化的第二非磁性层的边缘位置的距离而减小。

25. 发明授权

US08004006B2 Nitride semiconductor light emitting element 有权
标题翻译：氮化物半导体发光元件
公开(公告)号：US08004006B2
公开(公告)日：2011-08-23
申请号：US12084634
申请日：2006-11-07
申请人： Ken Nakahara , Atsushi Yamaguchi
发明人： Ken Nakahara , Atsushi Yamaguchi
IPC分类号： H01L33/00
CPC分类号： H01L33/20 , H01L21/78 , H01L33/0095 , H01L33/44
摘要： Provided are a nitride semiconductor light emitting element which does not suffer a damage on a light emitting region and has a high luminance without deterioration, even though the nitride semiconductor light emitting element is one in which electrodes are disposed opposite to each other and an isolation trench for chip separation and laser lift-off is formed by etching; and a manufacturing method thereof. An n-type nitride semiconductor layer 2 has a step, formed in a position beyond an active layer 3 when viewed from a p side. Up to the position of this step A, a protective insulating film 6 covers a part of the n-type nitride semiconductor layer 2, the active layer 3, a p-type nitride semiconductor layer 4, the side of a p electrode 5 and a part of the top side of the p electrode 5. The use of a structure having a chip side face covered with the protective insulating film 6 prevents the active layer or the like from being exposed to an etching gas for a long time when an isolation trench for chip separation or laser lift-off is formed by etching.
摘要翻译：提供一种氮化物半导体发光元件，即使氮化物半导体发光元件是彼此相对设置的电极和隔离沟槽，也不会对发光区域造成损害并具有高亮度而不劣化通过蚀刻形成芯片分离和激光剥离; 及其制造方法。当从p侧观察时，n型氮化物半导体层2具有形成在超过有源层3的位置的台阶。直到该步骤A的位置，保护绝缘膜6覆盖n型氮化物半导体层2，有源层3，p型氮化物半导体层4，p型电极5的一侧以及部分使用由保护绝缘膜6覆盖的具有芯片侧面的结构使得有源层等长时间暴露于蚀刻气体时，当用于通过蚀刻形成芯片分离或激光剥离。

26. 发明授权

US08000063B2 Magneto-resistive element, thin film magnetic head, magnetic head device, and magnetic recording/reproducing apparatus 有权
标题翻译：磁阻元件，薄膜磁头，磁头装置和磁记录/重放装置
公开(公告)号：US08000063B2
公开(公告)日：2011-08-16
申请号：US11623493
申请日：2007-01-16
申请人： Atsushi Yamaguchi , Kei Hirata , Satoshi Miura , Yoshihiro Tsuchiya , Kiyoshi Noguchi
发明人： Atsushi Yamaguchi , Kei Hirata , Satoshi Miura , Yoshihiro Tsuchiya , Kiyoshi Noguchi
IPC分类号： G11B5/39
CPC分类号： G11B5/3967 , G11B5/11 , G11B5/3912
摘要： A magneto-resistive element includes a lower magnetic shield film and a magneto-resistive film disposed above the lower magnetic shield film. The lower magnetic shield film includes a lower shield layer and an upper shield layer. The upper shield layer is amorphous or microcrystalline, made of a NiFe or CoFe composition containing B or P, and deposited on the lower shield layer. The lower shield layer is a magnetic conductive layer which is amorphous or microcrystalline with a crystal grain size equal to or less than 20 nm.
摘要翻译：磁阻元件包括下磁屏蔽膜和设置在下磁屏蔽膜上方的磁阻膜。下磁屏蔽膜包括下屏蔽层和上屏蔽层。上屏蔽层是无定形或微晶的，由含有B或P的NiFe或CoFe组合物制成并沉积在下屏蔽层上。下屏蔽层是晶体尺寸等于或小于20nm的非晶或微晶的导电层。

27. 发明申请

US20110142614A1 COUNTER-ROTATING AXIAL FLOW FAN 有权
标题翻译：逆转轴流风扇
公开(公告)号：US20110142614A1
公开(公告)日：2011-06-16
申请号：US12967196
申请日：2010-12-14
申请人： Chisachi Kato , Atsushi Yamaguchi , Akira Ueda , Kazuhiro Nitta , Akihiro Otsuka , Tadashi Katsui , Masahiro Suzuki , Yoshihiko Aizawa , Honami Oosawa
发明人： Chisachi Kato , Atsushi Yamaguchi , Akira Ueda , Kazuhiro Nitta , Akihiro Otsuka , Tadashi Katsui , Masahiro Suzuki , Yoshihiko Aizawa , Honami Oosawa
IPC分类号： F04D29/52 , F04D19/02
CPC分类号： F04D29/663 , F04D19/002 , F04D19/007 , F04D19/024 , F04D29/526 , F04D29/542 , F04D29/547 , F04D29/667 , F04D29/681
摘要： A counter-rotating axial flow fan with reduced noise at the target operating point achieved without modifying a front impeller, a rear impeller, or a middle stationary portion is provided. An annular rib including a projecting surface for generating turbulent flow is formed on an inner wall portion of a casing at a position off from the middle stationary portion to a side of the rear impeller, the projecting surface extending radially inwardly of the inner wall portion and extending continuously in the circumferential direction of the inner wall portion. A fluid striking the projecting surface for generating turbulent flow is partially disturbed to form a turbulent flow before entering an area in which the rear impeller is provided. The turbulent flow suppresses flow separation of a fluid flowing along the surfaces of rear blades of the rear impeller from the surfaces of the rear blades.
摘要翻译：提供了在不改变前叶轮，后叶轮或中间静止部分的情况下实现在目标操作点处具有降低的噪声的反向旋转轴流风扇。在从中间静止部分到后部叶轮的一侧的位置处，在壳体的内壁部分上形成包括用于产生湍流的突出表面的环形肋，所述突出表面沿着内壁部分的径向向内延伸，在内壁部的圆周方向上连续延伸。撞击突出表面以产生湍流的流体在进入其中设置后叶轮的区域之前部分地被扰动以形成湍流。湍流抑制沿着后叶片的后叶的表面流动的流体与后叶片的表面的流动分离。

28. 发明申请

US20110095423A1 SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD 有权
标题翻译：半导体器件安装结构及其制造方法
公开(公告)号：US20110095423A1
公开(公告)日：2011-04-28
申请号：US13000391
申请日：2009-10-27
申请人： Naomichi Ohashi , Shigeaki Sakatani , Arata Kishi , Atsushi Yamaguchi , Hidenori Miyakawa
发明人： Naomichi Ohashi , Shigeaki Sakatani , Arata Kishi , Atsushi Yamaguchi , Hidenori Miyakawa
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L23/49894 , H01L21/563 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/10126 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13566 , H01L2224/16058 , H01L2224/16225 , H01L2224/73203 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3452 , H05K3/3463 , H05K3/3484 , H05K2201/10977 , H05K2201/10992 , Y02P70/613 , H01L2924/01083 , H01L2924/00014 , H01L2924/0105
摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.
摘要翻译：半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块和第二电极之间的多个接合部件第二电极，经由凸块将第一电极与第二电极电连接;以及多个加强树脂部件，分别位于接合部件周围，以至少覆盖接合部件和接合部件与凸块之间的接合区域。相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。

29. 发明授权

US07905318B2 Storage box for electronic apparatus 有权
公开(公告)号：US07905318B2
公开(公告)日：2011-03-15
申请号：US12081498
申请日：2008-04-16
申请人： Atsushi Yamaguchi , Junichi Ishimine , Masahiro Suzuki , Tadashi Katsui , Shin-ichirou Kouno , Akira Takahashi , Akihiro Watanabe , Tomohiro Okazaki
发明人： Atsushi Yamaguchi , Junichi Ishimine , Masahiro Suzuki , Tadashi Katsui , Shin-ichirou Kouno , Akira Takahashi , Akihiro Watanabe , Tomohiro Okazaki
IPC分类号： A47B81/06 , E04F17/04 , F02K1/08 , G10K11/04 , H05K3/30 , H05K5/00 , H05K7/20
摘要： A box-shaped enclosure of a storage box includes a deadening wall or walls defining a storage space between first and second planes. The storage space is open at the first and second planes. A deadening wall member extends along the first plane. An auxiliary box-shaped enclosure is connected to the box-shaped enclosure so as to close the first plane of the box-shaped enclosure. The auxiliary box-shaped enclosure defines an auxiliary space isolated from the storage space with a deadening wall member. The storage space is connected to the fresh air through the ventilation opening and the auxiliary space. The deadening wall or walls of the box-shaped enclosure and the deadening wall member serve to prevent the leakage of the operating sound.

30. 发明申请

US20100224398A1 MOUNTING STRUCTURE 有权
标题翻译：安装结构
公开(公告)号：US20100224398A1
公开(公告)日：2010-09-09
申请号：US12738430
申请日：2008-10-16
申请人： Koso Matsuno , Atsushi Yamaguchi , Shigeaki Sakatani , Hidenori Miyakawa , Mikiya Ueda
发明人： Koso Matsuno , Atsushi Yamaguchi , Shigeaki Sakatani , Hidenori Miyakawa , Mikiya Ueda
IPC分类号： H05K1/18
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3121 , H01L24/16 , H01L25/0655 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2924/01004 , H01L2924/01019 , H01L2924/15311 , H01L2924/15313 , H05K1/0224 , H05K3/28 , H05K3/3452 , H05K2201/0969 , H05K2201/0989 , H05K2201/10977
摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.
摘要翻译：为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。底部填充树脂几乎不扩展到半导体元件外部的区域。

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