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21. 发明申请

US20110218279A1 POLYOLEFIN RESIN COMPOSITION 有权
标题翻译：聚烯烃树脂组合物
公开(公告)号：US20110218279A1
公开(公告)日：2011-09-08
申请号：US13061012
申请日：2009-08-21
申请人： Tsuyoshi Urushihara , Kazukiyo Nomura , Naoto Ueda , Yota Tsuneizumi
发明人： Tsuyoshi Urushihara , Kazukiyo Nomura , Naoto Ueda , Yota Tsuneizumi
IPC分类号： C08K5/527 , C08K5/205 , C08K5/20 , C08K5/24 , C08K5/30
CPC分类号： C08K5/0083 , C08K5/16 , C08L23/02 , C08L23/10
摘要： The present invention provides a polyolefin-based resin composition containing a crystal nucleating agent having a specific structure, which polyolefin-based resin composition has a superior transparency and whose crystallization is facilitated.The polyolefin-based resin composition is characterized by comprising, with respect to 100 parts by mass of a polyolefin-based resin, 0.01 to 1 parts by mass of at least one crystal nucleating agent selected from the group consisting of crystal nucleating agents each having a structure represented by one of the following Formulae (1) to (6):
摘要翻译：本发明提供一种含有具有特定结构的结晶成核剂的聚烯烃系树脂组合物，该聚烯烃类树脂组合物具有优异的透明性并且其结晶化。聚烯烃类树脂组合物的特征在于，相对于100质量份的聚烯烃系树脂，含有0.01〜1质量份的选自以下的结晶成核剂：晶体成核剂，其各自具有由下列公式（1）至（6）之一表示的结构：

22. 发明申请

US20060157740A1 Semiconductor integrated circuit and method of manufacturing the same 失效
标题翻译：半导体集成电路及其制造方法
公开(公告)号：US20060157740A1
公开(公告)日：2006-07-20
申请号：US11333297
申请日：2006-01-18
申请人： Shigeru Nonoyama , Naoto Ueda
发明人： Shigeru Nonoyama , Naoto Ueda
IPC分类号： H01L27/10 , H01L23/52
CPC分类号： H01L27/0207 , H01L23/50 , H01L24/03 , H01L24/05 , H01L24/06 , H01L27/11898 , H01L2224/02166 , H01L2224/05093 , H01L2224/05096 , H01L2224/05552 , H01L2224/05554 , H01L2224/05624 , H01L2224/06051 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor integrated circuit (1) having an integrated circuit region (1a), and a plurality of I/O cells (6) each having an element formation region for external electrical connection from the element formation region. An input/output signal electrode pad (3), a power supply electrode pad (4) and a GND electrode pad (5) are placed on an element formation region of each I/O cell (6).
摘要翻译：一种具有集成电路区域（1a）的半导体集成电路（1）和多个具有用于从元件形成区域进行外部电连接的元件形成区域的I / O单元（6）。输入/输出信号电极焊盘（3），电源电极焊盘（4）和GND电极焊盘（5）放置在每个I / O电池（6）的元件形成区域上。

23. 发明授权

US5724726A Method of making leadframe for lead-on-chip (LOC) semiconductor device 失效
标题翻译：制造引线框架（LOC）半导体器件的方法
公开(公告)号：US5724726A
公开(公告)日：1998-03-10
申请号：US614552
申请日：1996-03-13
申请人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
发明人： Yoshihiro Tomita , Naoto Ueda , Yoshirou Nishinaka , Shunichi Abe , Hideyuki Ichiyama
IPC分类号： H01L21/52 , H01L21/56 , H01L21/60 , H01L23/495 , H01L23/50 , H01R43/00
CPC分类号： H01L24/06 , H01L21/565 , H01L23/49503 , H01L23/4951 , H01L23/49537 , H01L23/49551 , H01L24/32 , H01L24/83 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/2919 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85207 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , Y10T29/49121 , Y10T29/49146 , Y10T29/49172
摘要： A method of making a semiconductor device having a lead-on-chip structure includes bending a die pad extending from an outer frame outwardly from the outer frame. Thereafter, with the die pad in a convenient position, a semiconductor chip is die-bonded to the die pad. Thereafter, the die pad is bent back toward the outer frame so that it is generally parallel to but spaced from the outer frame with leads extending from the outer frame being generally parallel to the semiconductor chip. Electrodes of the semiconductor chip are connected by wire-bonding to the leads extending from the outer frame. After resin molding, the outer frame lying outside the resin package is severed and removed, completing the lead-on-chip semiconductor device.
摘要翻译：制造具有芯片上芯片结构的半导体器件的方法包括从外框架向外弯曲从外框延伸的芯片焊盘。此后，当芯片焊盘处于便利位置时，半导体芯片被芯片焊接到芯片焊盘。此后，芯片焊盘向外框架弯曲，使得它大致平行于外框架，但与外框架大致平行于半导体芯片延伸。半导体芯片的电极通过引线接合连接到从外框延伸的引线。在树脂成型之后，将位于树脂封装外部的外框切断并移除，从而完成了片上半导体器件。

24. 发明授权

US5609287A Solder material, junctioning method, junction material, and semiconductor device 失效
标题翻译：焊料，接合方法，接合材料和半导体器件
公开(公告)号：US5609287A
公开(公告)日：1997-03-11
申请号：US335995
申请日：1994-11-08
申请人： Goro Izuta , Shunichi Abe , Yoshirou Nishinaka , Katsuyuki Fukutome , Naoto Ueda , Toshio Takeuchi , Yoshihiro Kashiba , Masaaki Namatame
发明人： Goro Izuta , Shunichi Abe , Yoshirou Nishinaka , Katsuyuki Fukutome , Naoto Ueda , Toshio Takeuchi , Yoshihiro Kashiba , Masaaki Namatame
IPC分类号： B23K35/02 , B23K35/26 , H01L21/60 , H01L21/58
CPC分类号： H01L24/32 , B23K35/0238 , B23K35/268 , H01L24/29 , H01L24/83 , B23K35/262 , H01L2224/04026 , H01L2224/26175 , H01L2224/27013 , H01L2224/29 , H01L2224/29011 , H01L2224/29101 , H01L2224/29111 , H01L2224/29298 , H01L2224/32245 , H01L2224/325 , H01L2224/83051 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/15747 , H01L2924/351
摘要： A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising material-having a lower melting point than the first solder or material which reacts with the first solder to produce an alloy having a lower melting point than the first solder.A junctioning method comprise putting the above-described solder material inserted between two objects to be junctioned to each other; heating the solder material to a temperature higher than the melting point of the second solder or the alloy and lower than the melting point of said first solder thereby to melt the second solder or the alloy; and thereafter cooling or keeping the solder material at a temperature in the vicinity of the melting point thereby to junction the objects to be junctioned to each other. The second solder plate has preferably a thickness less than 5 microns and the first solder plate has preferably a thickness equal to or larger than 30 microns. By this construction, the interval between the objects to be junctioned can be controlled to a predetermined thickness and the stress functioning to the objects can be relaxed as well as there arises no positional deviation between the objects.
摘要翻译：焊料材料包括第一焊料板和第二焊料板，其具有等于或大于1微米的厚度，其设置在包含材料的第一焊料板的两个表面处，所述第一焊料板具有比与第一焊料反应的第一焊料或材料更低的熔点第一焊料以产生熔点低于第一焊料的合金。接合方法包括将插入在两个物体之间的上述焊料材料相互连接; 将焊料材料加热到高于第二焊料或合金的熔点并低于所述第一焊料的熔点的温度，从而熔化第二焊料或合金; 然后将焊料材料冷却或保持在熔点附近的温度，从而将要连接的物体彼此接合。第二焊盘优选具有小于5微米的厚度，并且第一焊料板优选具有等于或大于30微米的厚度。通过这种结构，要连接的物体之间的间隔可以被控制到预定厚度，并且可以放松对物体起作用的应力，并且不会在物体之间产生位置偏差。

25. 发明授权

US08985870B2 Semiconductor laser module and method for manufacturing same 有权
标题翻译：半导体激光器模块及其制造方法
公开(公告)号：US08985870B2
公开(公告)日：2015-03-24
申请号：US13993373
申请日：2012-05-14
申请人： Makoto Ryudo , Naoto Ueda
发明人： Makoto Ryudo , Naoto Ueda
IPC分类号： G02B6/36 , H01S5/026 , G02B6/42
CPC分类号： H01S5/02284 , G02B6/4237 , G02B6/4249 , H01S5/02256 , H01S5/026 , H01S5/4025
摘要： A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section. The support fitting and casing have a second contact section that is in line-contact or surface-contact with the plane section vertical to the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the second contact section.
摘要翻译：半导体激光器模块包括激光二极管阵列，光纤阵列，用于固定光纤阵列的光纤阵列配件，壳体和用于固定光纤阵列配件和外壳的支撑配件。光纤阵列配件和支撑配件具有与平行于激光二极管阵列的发光表面的平面部分线接触或表面接触的第一接触部分，并且被激光焊接并彼此固定在第一接触部分。支撑配件和壳体具有第二接触部分，其与垂直于激光二极管阵列的发光表面的平面部分线接触或表面接触，并且在第二接触处被激光焊接并彼此固定部分。

26. 发明授权

US08910939B2 Sheet carrying device and image forming apparatus 有权
标题翻译：纸张承载装置和图像形成装置
公开(公告)号：US08910939B2
公开(公告)日：2014-12-16
申请号：US13780030
申请日：2013-02-28
申请人： Makoto Nakura , Naoto Ueda , Koichi Kudo , Shingo Takai
发明人： Makoto Nakura , Naoto Ueda , Koichi Kudo , Shingo Takai
IPC分类号： B65H5/02 , B41J13/00 , G03G15/00
CPC分类号： B41J13/0009 , G03G15/1615 , G03G15/6529 , G03G15/6561 , G03G21/1647 , G03G2221/1657
摘要： A disclosed sheet carrying device includes a first carrying unit that includes a first rotary body, a first driving unit outputting a driving force at a first peripheral speed, a one-way clutch transmitting the driving force only in a sheet carrying direction, and a second rotary body driven by the first rotary body via the sheet; and a second carrying unit including a third rotary body rotating at a second peripheral speed being the first peripheral speed or more, a fourth rotary body carrying the sheet with the third rotary body, a second driving unit outputting a driving force for driving the fourth rotary body at a third peripheral speed being the second peripheral speed or more, and a torque limiter having a slip torque smaller than a sheet carrying torque and cutting off the driving force while the sheet is interposed between the third and fourth rotary bodies.
摘要翻译：公开的片材承载装置包括第一承载单元，其包括第一旋转体，以第一圆周速度输出驱动力的第一驱动单元，仅在片材传送方向上传递驱动力的单向离合器，由第一旋转体经由片材驱动的旋转体; 以及第二承载单元，其包括以第一圆周速度以上的第二圆周速度旋转的第三旋转体，具有第三旋转体的第四旋转体，第二驱动单元，其输出用于驱动第四旋转体的驱动力第三圆周速度为第二圆周速度以上的扭矩限制器，以及转矩限制器，其具有小于输送力矩的滑动转矩，并且在片材插入在第三和第四旋转体之间时切断驱动力。

27. 发明授权

US08670694B2 Gear drive apparatus, driving device including gear drive apparatus, and image forming device including gear drive apparatus 有权
标题翻译：齿轮传动装置，包括齿轮传动装置的驱动装置和包括齿轮传动装置的图像形成装置
公开(公告)号：US08670694B2
公开(公告)日：2014-03-11
申请号：US13253108
申请日：2011-10-05
申请人： Makoto Nakura , Masaru Kawamoto , Naoto Ueda , Hirofumi Ohkushi
发明人： Makoto Nakura , Masaru Kawamoto , Naoto Ueda , Hirofumi Ohkushi
IPC分类号： G03G15/00
CPC分类号： G03G15/00 , F16H57/0456 , F16H57/0495 , G03G15/757
摘要： A gear drive apparatus includes a gear train including a plurality of gears, and a holding unit accommodating the gear train and a lubricant to be supplied to tooth flanks of each of the plurality of gears, the holding unit including an inlet opening from which the lubricant is poured. The lubricant from the inlet opening is supplied to an engagement area where two gears of the plurality of gears are engaged with each other, or to a tooth flank area of one of the two gears at an upstream part from the engagement area along a rotational direction of the one of the two gears.
摘要翻译：齿轮传动装置包括齿轮系，该齿轮系包括多个齿轮，以及容纳齿轮系的保持单元和供给到多个齿轮中的每个齿轮的齿面的润滑剂，该保持单元包括一个入口，倒了来自入口的润滑剂被供给到多个齿轮中的两个齿轮彼此接合的接合区域，或者在沿着旋转方向的接合区域的上游部分处的两个齿轮中的一个的齿面区域的两个齿轮之一。

28. 发明授权

US08652363B1 Compound, near-infrared absorber, and synthetic resin composition containing same 有权
标题翻译：化合物，近红外吸收剂和含有它们的合成树脂组合物
公开(公告)号：US08652363B1
公开(公告)日：2014-02-18
申请号：US14006884
申请日：2012-04-09
申请人： Naoto Ueda , Kazukiyo Nomura
发明人： Naoto Ueda , Kazukiyo Nomura
IPC分类号： F21V9/04 , F21V9/06 , G02B5/22 , G02B5/26 , C07D401/00
CPC分类号： G02B1/04 , C07D471/04 , C07F5/02 , G02B5/208 , G02B5/223
摘要： The present invention provides a novel boron compound that has a maximum absorption wavelength in the near-infrared light range and has low absorption in the visible ray range, and thus is excellent as a near-infrared absorber, and a near-infrared absorber and a near-infrared absorbing synthetic resin composition using the compound. The present invention specifically provides a boron compound represented by the following general formula (1), preferably a boron compound wherein R1 to R16 in the general formula (1) each represent a hydrogen atom or an alkyl group, and a near-infrared absorbing synthetic resin composition containing the boron compound as a near-infrared absorber In the above-mentioned general formula (1), R1 to R16 each represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, an amino group, an alkyl group having 1 to 20 carbon atoms optionally having substituents, or the like.
摘要翻译：本发明提供了一种在近红外光范围内具有最大吸收波长并且在可见光范围内具有低吸收性的新型硼化合物，因此作为近红外吸收剂和近红外吸收剂以及使用该化合物的近红外吸收合成树脂组合物。本发明具体提供由以下通式（1）表示的硼化合物，优选其中通式（1）中的R 1至R 16各自表示氢原子或烷基的硼化合物和近红外吸收合成的含有硼化合物作为近红外吸收剂的树脂组合物在上述通式（1）中，R 1〜R 16各自表示氢原子，卤素原子，硝基，氰基，氨基，烷基具有1-20个碳原子的任选具有取代基的基团等。

29. 发明申请

US20140027685A1 NOVEL COMPOUND, NEAR-INFRARED ABSORBER, AND SYNTHETIC RESIN COMPOSITION CONTAINING SAME 有权
标题翻译：新型化合物，近红外吸收剂和含有其的合成树脂组合物
公开(公告)号：US20140027685A1
公开(公告)日：2014-01-30
申请号：US14006884
申请日：2012-04-09
申请人： Naoto Ueda , Kazukiyo Nomura
发明人： Naoto Ueda , Kazukiyo Nomura
IPC分类号： G02B1/04
CPC分类号： G02B1/04 , C07D471/04 , C07F5/02 , G02B5/208 , G02B5/223
摘要： The present invention provides a novel boron compound that has a maximum absorption wavelength in the near-infrared light range and has low absorption in the visible ray range, and thus is excellent as a near-infrared absorber, and a near-infrared absorber and a near-infrared absorbing synthetic resin composition using the compound. The present invention specifically provides a boron compound represented by the following general formula (1), preferably a boron compound wherein R1 to R16 in the general formula (1) each represent a hydrogen atom or an alkyl group, and a near-infrared absorbing synthetic resin composition containing the boron compound as a near-infrared absorber. In the above-mentioned general formula (1), R1 to R16 each represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, an amino group, an alkyl group having 1 to 20 carbon atoms optionally having substituents, or the like.
摘要翻译：本发明提供了一种在近红外光范围内具有最大吸收波长并且在可见光范围内具有低吸收性的新型硼化合物，因此作为近红外吸收剂和近红外吸收剂以及使用该化合物的近红外吸收合成树脂组合物。本发明具体提供由以下通式（1）表示的硼化合物，优选其中通式（1）中的R 1至R 16各自表示氢原子或烷基的硼化合物和近红外吸收合成的含有硼化合物作为近红外吸收剂的树脂组合物。在上述通式（1）中，R 1〜R 16各自表示氢原子，卤素原子，硝基，氰基，氨基，任选具有取代基的碳原子数1〜20的烷基，或类似。

30. 发明授权

US08608164B2 Sheet conveying apparatus and image forming apparatus 有权
标题翻译：片材输送装置和成像装置
公开(公告)号：US08608164B2
公开(公告)日：2013-12-17
申请号：US13590480
申请日：2012-08-21
申请人： Shingo Takai , Makoto Nakura , Naoto Ueda , Satoshi Ueda , Akira Kobashi , Koichi Kudo
发明人： Shingo Takai , Makoto Nakura , Naoto Ueda , Satoshi Ueda , Akira Kobashi , Koichi Kudo
IPC分类号： B65H7/02
CPC分类号： B65H5/023 , B65H5/38 , B65H7/14 , B65H85/00 , B65H2301/342 , B65H2301/51212 , B65H2404/143 , B65H2404/611 , B65H2511/11 , B65H2511/33 , B65H2513/53 , B65H2553/51 , B65H2553/82 , B65H2701/1311 , B65H2701/1313 , G03G15/6561 , B65H2220/01 , B65H2220/03
摘要： A sheet conveying apparatus including: a sheet conveying unit; an upstream side guiding member that forms an upstream side conveying route of a sheet; a downstream side guiding member that forms a downstream side conveying route of the sheet; an upstream side detection unit; and a downstream side detection unit, wherein a detection position of the sheet for the upstream side detection unit is set between the sheet conveying unit and a position where the sheet is in contact with the upstream side guiding member, and a detection position of the sheet for the downstream side detection unit is set between the sheet conveying unit and a position where the sheet is in contact with the downstream side guiding member.
摘要翻译：一种片材输送装置，包括：片材输送单元; 形成片材的上游侧输送路径的上游侧引导构件; 形成片材的下游侧输送路径的下游侧引导构件; 上游侧检测单元; 以及下游侧检测单元，其中，用于上游侧检测单元的片材的检测位置被设置在片材输送单元和片材与上游侧引导构件接触的位置之间，片材的检测位置下游侧检测单元被设置在片材输送单元和片材与下游侧引导构件接触的位置之间。

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