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    • 24. 发明授权
    • Flexible row redundancy system
    • 灵活的行冗余系统
    • US07774660B2
    • 2010-08-10
    • US12131307
    • 2008-06-02
    • Louis L. HsuGregory J. FredemanRajiv V. JoshiToshiaki Kirihata
    • Louis L. HsuGregory J. FredemanRajiv V. JoshiToshiaki Kirihata
    • G11C29/00
    • G11C29/808
    • A row redundancy system is provided for replacing faulty wordlines of a memory array having a plurality of banks. The row redundancy system includes a remote fuse bay storing at least one faulty address corresponding to a faulty wordline of the memory array; a row fuse array for storing row fuse information corresponding to at least one bank of the memory array; and a copy logic module for copying at least one faulty address stored in the remote fuse bay into the row fuse array; wherein the copy logic module is programmed to copy the at least one faulty address into the row fuse information stored in the row fuse array corresponding to a predetermined number of banks in accordance with a selectable repair field size.
    • 提供了一种用于替换具有多个存储体的存储器阵列的有缺陷的字线的行冗余系统。 行冗余系统包括存储与存储器阵列的故障字线相对应的至少一个故障地址的远程熔丝架; 用于存储对应于所述存储器阵列的至少一个组的行熔丝信息的行熔丝阵列; 以及复制逻辑模块,用于将存储在所述远程保险丝盒中的至少一个故障地址复制到所述行保险丝阵列中; 其中所述复制逻辑模块被编程为根据可选择的修复字段大小将所述至少一个故障地址复制到对应于预定数量的存储体的行熔丝阵列中的行熔丝信息。
    • 28. 发明授权
    • Structure and system-on-chip integration of a two-transistor and two-capacitor memory cell for trench technology
    • 用于沟槽技术的双晶体管和双电容器存储单元的结构和片上系统集成
    • US06845033B2
    • 2005-01-18
    • US10248954
    • 2003-03-05
    • Toshiaki KirihataJohn W. Golz
    • Toshiaki KirihataJohn W. Golz
    • H01L27/108G11C11/24G11C11/401G11C11/404H01L21/8242
    • G11C11/404H01L27/108H01L27/10829
    • A two-port dynamic random access memory (DRAM) cell consisting of two transistors and two trench capacitors (2T and 2C DRAM cell) connecting two one transistor and one capacitor DRAM cell (1T DRAM cell) is described. The mask data and cross-section of the 2T 2C DRAM and 1T DRAM cells are fully compatible to each other except for the diffusion connection that couples two storage nodes of the two 1T DRAM cells. This allows a one-port memory cell with 1T and 1C DRAM cell and a two-port memory cell with 2T and 2C DRAM cell to be fully integrated, forming a true system-on chip architecture. Alternatively, by halving the capacitor, the random access write cycle time is further reduced, while still maintaining the data retention time. The deep trench process time is also reduced by reducing by one-half the trench depth.
    • 描述了连接两个晶体管和一个电容器DRAM单元(1T DRAM单元)的两个晶体管和两个沟槽电容器(2T和2C DRAM单元)组成的双端口动态随机存取存储器(DRAM)单元。 除了连接两个1T DRAM单元的两个存储节点的扩散连接之外,2T 2C DRAM和1T DRAM单元的掩模数据和横截面彼此完全兼容。 这允许具有1T和1C DRAM单元的单端口存储器单元和具有2T和2C DRAM单元的双端口存储器单元被完全集成,形成真正的片上系统体系结构。 或者,通过将电容器减半,随机存取写周期时间进一步降低,同时仍然保持数据保留时间。 深沟槽加工时间也减少了沟槽深度的一半。