专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20110116271A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20110116271A1
公开(公告)日：2011-05-19
申请号：US12948521
申请日：2010-11-17
申请人： Shunya Ide , Masanori Sato , Takahiko Nozaki , Takaaki Sakai , Hiroshi Kotani
发明人： Shunya Ide , Masanori Sato , Takahiko Nozaki , Takaaki Sakai , Hiroshi Kotani
IPC分类号： F21V29/00 , B23P17/00
CPC分类号： H01L33/486 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2933/0033 , Y10T29/49993 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/014
摘要： In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed.
摘要翻译：在制造发光元件的情况下，在基板上形成有多个发光元件的LED元件，并且基板被切割，切割时抑制了刮屑的产生，并且破损可以防止生产过程中的基板。在形成与金属基板中形成发光元件部分的区域交叉的狭缝的过程中，可以形成用作树脂储存器的凹槽，以便穿过狭缝。狭缝可以用绝缘材料填充，凹部可以填充树脂，它们都可以固化。可以在用于形成发光元件部分的区域中形成发光元件部分，金属基板可以切割成包括一个或多个发光元件部分的单元，并且可以安装在印刷电路板上，印刷电路板上形成图案。

22. 发明授权

US4921470A Universal joint 失效
标题翻译：万向节
公开(公告)号：US4921470A
公开(公告)日：1990-05-01
申请号：US63957
申请日：1987-06-19
申请人： Hiroshi Kotani , Yoshiyuki Inoue , Yasushi Kadota , Hidekazu Sakakibara , Kazuo Ide , Kanichi Sumida
发明人： Hiroshi Kotani , Yoshiyuki Inoue , Yasushi Kadota , Hidekazu Sakakibara , Kazuo Ide , Kanichi Sumida
IPC分类号： F16D3/46 , F16D3/50
CPC分类号： F16D3/50 , F16D3/46
摘要： A universal joint including an intermediate joint member having a spherical portion as assembled and four ridges formed on the outer surface of the spherical portion and defining four guide furrows therebetween, and two shaft each having one end bifurcating into two arms. The two arms of one of the shafts are fitted in two of the guide furrows positioned symmetrically, and the two arms of the other shaft are fitted in the other two guide furrows positioned symmetrically. The entire joint member comprises two divided half segments arranged in combination axially of the member. Alternatively, the spherical portion comprises two divided half segments arranged in combination axially thereof, one of the spherical half segments being integrally formed with two of the ridges positioned symmetrically and extending to over the outer surface of the other spherical half segment, the other spherical half segment being integrally formed with the other two ridges positioned symmetrically and extending to over the outer surface of said one spherical half segment. In either of these arrangements, an elastic member is provided at the combined portion of the two segments inside the contour of the combined portion for biasing the segments at least circumferentially thereof out of register with each other.
摘要翻译：一种万向接头，包括具有组装球形部分的中间接合部件和形成在球形部分的外表面上的四个脊，并且在其间限定四个引导沟，以及两个轴，每个轴分别具有两个臂。其中一个轴的两个臂被安装在对称定位的两个导向沟中，另一个轴的两个臂装配在对称定位的另外两个导向沟中。整个接头构件包括沿构件的轴向组合布置的两个分开的半段。或者，球形部分包括两个分开的半部分，其组合在其轴向组合，其中一个球形半部分一体地形成有对称定位并延伸到另一个球形半部分的外表面上的两个脊，另一个球形半部与另一个对称地设置并延伸到所述一个球形半段的外表面的另外两个脊部一体地形成。在这些布置中的任一个中，弹性构件设置在组合部分轮廓内部的两个区段的组合部分处，用于至少在周向上将区段彼此偏置偏置。

23. 发明申请

US20120188772A1 LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING THE SAME, AND ILLUMINATING DEVICE 有权
标题翻译：发光装置，其制造方法和照明装置
公开(公告)号：US20120188772A1
公开(公告)日：2012-07-26
申请号：US13356637
申请日：2012-01-23
申请人： Takaaki Sakai , Hiroshi Kotani , Takahiko Nozaki
发明人： Takaaki Sakai , Hiroshi Kotani , Takahiko Nozaki
IPC分类号： F21V13/00 , H01J9/00 , H01J1/62
CPC分类号： H01L33/505 , H01L33/46 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device having an LED element and a resin layer including a convex portion covering the LED element can suppress color unevenness to achieve light emission with uniform color distribution. The light-emitting device can include a substrate, an LED element mounted on the substrate, a resin layer which contains a wavelength conversion material and is formed on the substrate to cover the LED element, the resin layer including a convex portion directly covering the LED element and a flat thin film portion extending around the convex portion, and a reflective portion which is formed over the thin film portion around the convex portion. A diffusion portion can be formed to cover the convex portion of the resin layer.
摘要翻译：具有LED元件和包括覆盖LED元件的凸部的树脂层的发光器件可以抑制颜色不均匀以实现均匀颜色分布的发光。发光装置可以包括基板，安装在基板上的LED元件，包含波长转换材料并形成在基板上以覆盖LED元件的树脂层，树脂层包括直接覆盖LED的凸部元件和围绕所述凸部延伸的平坦薄膜部分，以及在所述凸部周围形成在所述薄膜部分上的反射部分。可以形成扩散部以覆盖树脂层的凸部。

24. 发明申请

US20110133236A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20110133236A1
公开(公告)日：2011-06-09
申请号：US12960281
申请日：2010-12-03
申请人： Takahiko Nozaki , Hiroshi Kotani
发明人： Takahiko Nozaki , Hiroshi Kotani
IPC分类号： H01L33/58 , H01L33/64 , H01L33/60 , H01L33/00
CPC分类号： H01L33/644 , H01L33/50 , H01L33/60 , H01L33/641 , H01L33/642 , H01L2924/0002 , H01L2933/0075 , H01L2924/00
摘要： A light emitting device that can radiate heat generated by a semiconductor light emitting element and/or a resin layer at not only a position directly under the light emitting element, but also a position remote from such a position with respect to the main plane direction is provided. In the light emitting device, a light emitting element is carried on a substrate, and a resin covers the light emitting element. An anisotropic heat conduction material showing a heat conductivity for the substrate main plane direction larger than that for the substrate thickness direction is carried on the substrate. A side of the anisotropic heat conduction material contacts with the resin. Thereby, the anisotropic heat conduction material can receive heat of the resin, conduct it along the main plane direction, and radiate it to the substrate at a position remote from the light emitting element and/or the resin. As the anisotropic heat conduction material, for example, one or more laminated layers of graphite in the form of sheet are used.
摘要翻译：可以在不仅在发光元件正下方的位置而且能够相对于主平面方向远离这种位置的位置辐射由半导体发光元件和/或树脂层产生的热的发光器件，提供。在发光装置中，发光元件承载在基板上，树脂覆盖发光元件。在基板上承载表现出比基板厚度方向大的基板主面方向的导热性的各向异性导热材料。各向异性热传导材料的一面与树脂接触。由此，各向异性热传导材料可以接收树脂的热量，沿着主平面方向导电，并在远离发光元件和/或树脂的位置将其辐射到基板。作为各向异性热传导材料，例如可以使用片状的一层以上的石墨层叠体。

25. 发明授权

US6114750A Surface mount TO-220 package and process for the manufacture thereof 失效
标题翻译：表面贴装TO-220封装及其制造方法
公开(公告)号：US6114750A
公开(公告)日：2000-09-05
申请号：US940230
申请日：1997-09-30
申请人： Hisao Udagawa , Hiroshi Kotani
发明人： Hisao Udagawa , Hiroshi Kotani
IPC分类号： H01L23/28 , H01L23/31 , H01L23/48 , H01L23/495
CPC分类号： H01L24/48 , H01L23/3121 , H01L23/49562 , H01L24/97 , H01L2224/05599 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/30107 , H01L2924/3011
摘要： A surface mount TO-220 package includes leads which are bent within the molded housing and formed prior to molding the housing around the lead frame. A single gauge of frame material is used for both the leads and the main pad area. The bends reduce the height of the package and reduce mechanical stresses in the molded housing.
摘要翻译：表面安装的TO-220封装包括在模制壳体内弯曲并且在围绕引线框架模制壳体之前形成的引线。引脚和主焊盘区域均使用单个框架材料。弯曲减小了包装的高度并降低了模制外壳中的机械应力。

26. 发明授权

US4834658A Universal joint 失效
标题翻译：万向节
公开(公告)号：US4834658A
公开(公告)日：1989-05-30
申请号：US221078
申请日：1988-07-19
申请人： Hiroshi Kotani , Susumu Serizawa
发明人： Hiroshi Kotani , Susumu Serizawa
IPC分类号： F16D3/46 , H01R35/04
CPC分类号： F16D3/46 , H01R35/04
摘要： A universal joint including a ball joint member of synthetic resin having four ridges formed on the outer surface of a ball portion and four guide furrows formed between the ridges when the joint member is in an assembled state, and two metal yokes each having two bifurcated arms at one end, the two arms of one of the yokes being fitted in two symmetrically positioned guide furrows of the ball joint member, the two arms of the other yoke being fitted in the other two symmetrically positioned guide furrows of the ball joint member. The ball joint member is divided into a half segment toward one of the yokes and a half segment toward the other yoke, a spring member being provided in a cavity formed in the opposed faces of the half segments for biasing the half segments away from each other, an electrically conductive member being held between the two half segments and projecting into the guide furrows in pressing contact with the arms of the two yokes.
摘要翻译：一种万向接头，其特征在于，在所述接合部件处于组装状态时，具有形成在球部外表面上的四个凸脊的合成树脂球形接头部件和形成在所述凸部之间的四个引导沟，以及两个分别具有两个分叉臂在一端，一个轭的两个臂装配在球形接头构件的两个对称定位的引导沟中，另一个轭的两个臂装配在球接头构件的另外两个对称定位的引导沟中。球形接头构件被分成朝向一个轭架的一半部分和朝向另一个轭架的一半部分，弹簧部件设置在形成在半部分的相对面中的空腔中，用于将两个部分彼此偏置导电构件被保持在两个半段之间并且与两个轭的臂压接在一起而突出到引导沟中。

27. 发明授权

US08757826B2 Light-emitting device, method for producing the same, and illuminating device 有权
标题翻译：发光装置及其制造方法以及照明装置
公开(公告)号：US08757826B2
公开(公告)日：2014-06-24
申请号：US13356637
申请日：2012-01-23
申请人： Takaaki Sakai , Hiroshi Kotani , Takahiko Nozaki
发明人： Takaaki Sakai , Hiroshi Kotani , Takahiko Nozaki
IPC分类号： F21V9/16 , F21V7/00
CPC分类号： H01L33/505 , H01L33/46 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device having an LED element and a resin layer including a convex portion covering the LED element can suppress color unevenness to achieve light emission with uniform color distribution. The light-emitting device can include a substrate, an LED element mounted on the substrate, a resin layer which contains a wavelength conversion material and is formed on the substrate to cover the LED element, the resin layer including a convex portion directly covering the LED element and a flat thin film portion extending around the convex portion, and a reflective portion which is formed over the thin film portion around the convex portion. A diffusion portion can be formed to cover the convex portion of the resin layer.
摘要翻译：具有LED元件和包括覆盖LED元件的凸部的树脂层的发光器件可以抑制颜色不均匀以实现均匀颜色分布的发光。发光装置可以包括基板，安装在基板上的LED元件，包含波长转换材料并形成在基板上以覆盖LED元件的树脂层，树脂层包括直接覆盖LED的凸部元件和围绕所述凸部延伸的平坦薄膜部分，以及在所述凸部周围形成在所述薄膜部分上的反射部分。可以形成扩散部以覆盖树脂层的凸部。

28. 发明授权

US08746932B2 Light emitting device and method for manufacturing the same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08746932B2
公开(公告)日：2014-06-10
申请号：US12948521
申请日：2010-11-17
申请人： Shunya Ide , Masanori Sato , Takahiko Nozaki , Takaaki Sakai , Hiroshi Kotani
发明人： Shunya Ide , Masanori Sato , Takahiko Nozaki , Takaaki Sakai , Hiroshi Kotani
IPC分类号： F21V7/00
CPC分类号： H01L33/486 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2933/0033 , Y10T29/49993 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/014
摘要： In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed.
摘要翻译：在制造发光元件的情况下，在基板上形成有多个发光元件的LED元件，并且基板被切割，切割时抑制了刮屑的产生，并且破损可以防止生产过程中的基板。在形成与金属基板中形成发光元件部分的区域交叉的狭缝的过程中，可以形成用作树脂储存器的凹槽，以便穿过狭缝。狭缝可以用绝缘材料填充，凹部可以填充树脂，它们都可以固化。可以在用于形成发光元件部分的区域中形成发光元件部分，金属基板可以切割成包括一个或多个发光元件部分的单元，并且可以安装在印刷电路板上，印刷电路板上形成图案。

29. 发明授权

US08373177B2 Light emitting diode (LED) light source and manufacturing method for the same 有权
标题翻译：发光二极管（LED）的光源及其制造方法相同
公开(公告)号：US08373177B2
公开(公告)日：2013-02-12
申请号：US12903200
申请日：2010-10-12
申请人： Hiroshi Kotani , Takahiko Nozaki
发明人： Hiroshi Kotani , Takahiko Nozaki
IPC分类号： H01L27/15 , H01L29/267 , H01L29/40 , H01L21/00
CPC分类号： H01L25/0753 , H01L33/50 , H01L2224/16225 , H01L2224/48091 , H01L2924/19107 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
摘要： An LED light source can include protection members to protect bonding wires. The LED can include a substrate including electrode patterns, a sub mount substrate located on the substrate, at least one flip LED chip mounted on the sub mount substrate and a phosphor rein covering the LED chip. The bonding wires can connect each of the electrode patterns to conductor patterns connecting to electrodes of the LED chip. The protection members can be located so as to surround both sides of the bonding wires. In addition, because each height of the protection members is higher than each maximum height of the bonding wires and is lower than a height of the phosphor resin, the protection members can protect the bonding wires from external pressure while the light flux is not reduced. Thus, the disclosed subject matter can provide a reliable LED light source having a favorable light distribution.
摘要翻译： LED光源可以包括用于保护接合线的保护构件。 LED可以包括包括电极图案的基板，位于基板上的子安装基板，安装在副安装基板上的至少一个翻盖LED芯片和覆盖LED芯片的荧光体束。接合线可以将每个电极图案连接到连接到LED芯片的电极的导体图案。保护构件可以被定位成围绕接合线的两侧。此外，由于保护构件的高度高于接合线的每个最大高度，并且低于荧光体树脂的高度，所以保护构件可以在不减少光束的同时保护接合线免受外部压力。因此，所公开的主题可以提供具有良好的光分布的可靠的LED光源。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式