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    • 22. 发明授权
    • Nonvolatile memory device and method of manufacturing the same
    • 非易失性存储器件及其制造方法
    • US08129705B2
    • 2012-03-06
    • US12434633
    • 2009-05-02
    • Masaharu KinoshitaYoshitaka SasagoNorikatsu Takaura
    • Masaharu KinoshitaYoshitaka SasagoNorikatsu Takaura
    • H01L45/00
    • H01L45/144G11C11/5678G11C13/0004G11C2213/72H01L27/2409H01L27/2481H01L45/06H01L45/1233H01L45/1293H01L45/1675Y10S438/90
    • Provided is a nonvolatile memory device including a phase-change memory configured with cross-point memory cells in which memory elements formed of a phase-change material and selection elements formed with a diode are combined. A memory cell is configured with a memory element formed of a phase-change material and a selection element formed with a diode having a stacked structure of a first polycrystalline silicon film, a second polycrystalline silicon film, and a third polycrystalline silicon film. The memory cells are arranged at intersection points of a plurality of first metal wirings extending along a first direction with a plurality of third metal wirings extending along a second direction orthogonal to the first direction. An interlayer film is formed between adjacent selection elements and between adjacent memory elements, and voids are formed in the interlayer film provided between the adjacent memory elements.
    • 本发明提供一种非易失性存储装置,其包括:配置有交叉点存储单元的相变存储器,其中由相变材料形成的存储元件和由二极管形成的选择元件组合。 存储单元配置有由相变材料形成的存储元件和由具有第一多晶硅膜,第二多晶硅膜和第三多晶硅膜的堆叠结构的二极管形成的选择元件。 存储单元布置在沿着第一方向延伸的多个第一金属布线的交点和沿着与第一方向正交的第二方向延伸的多个第三金属布线。 在相邻的选择元件之间和相邻的存储元件之间形成中间膜,并且在设置在相邻的存储元件之间的层间膜中形成空隙。
    • 28. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08730717B2
    • 2014-05-20
    • US13104005
    • 2011-05-09
    • Satoru HanzawaYoshitaka Sasago
    • Satoru HanzawaYoshitaka Sasago
    • G11C11/00
    • G11C13/003G11C13/0004G11C13/0026G11C13/0028G11C2213/71G11C2213/72G11C2213/75G11C2213/78H01L27/2454H01L27/2472H01L27/2481H01L45/06H01L45/124H01L45/144
    • A semiconductor device has multiple memory cell groups arranged at intersections between multiple word lines and multiple bit lines intersecting the word lines. The memory cell groups each have first and second memory cells connected in series. Each of the first and the second memory cells has a select transistor and a resistive storage device connected in parallel. The gate electrode of the select transistor in the first memory cell is connected with a first gate line, and the gate electrode of the select transistor in the second memory cell is connected to a second gate line. A first circuit block for driving the word lines (word driver group WDBK) is arranged between a second circuit block for driving the first and second gate lines (phase-change-type chain cell control circuit PCCCTL) and multiple memory cell groups (memory cell array MA).
    • 半导体器件具有布置在多个字线和与字线相交的多个位线之间的交叉处的多个存储单元组。 存储单元组各自具有串联连接的第一和第二存储器单元。 第一和第二存储单元中的每一个具有并联连接的选择晶体管和电阻存储器件。 第一存储单元中的选择晶体管的栅电极与第一栅极线连接,第二存储单元中的选择晶体管的栅电极连接到第二栅极线。 用于驱动字线的第一电路块(字驱动器组WDBK)被布置在用于驱动第一和第二栅极线(相变型链单元控制电路PCCCTL)的第二电路块和多个存储单元组 阵列MA)。