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21. 发明申请

US20060091750A1 MAGNETIC SUSPENSION BEARING WITH DAMPING SYSTEM 失效
标题翻译：带阻尼系统的磁悬浮轴承
公开(公告)号：US20060091750A1
公开(公告)日：2006-05-04
申请号：US10980871
申请日：2004-11-04
申请人： Chien-chang Wang , Pi-cheng Tung , Ren-bin Xiao , Wei-cheng Chen , Chien-sheng Liu , Yu-hsiu Chang , Der-ray Huang
发明人： Chien-chang Wang , Pi-cheng Tung , Ren-bin Xiao , Wei-cheng Chen , Chien-sheng Liu , Yu-hsiu Chang , Der-ray Huang
IPC分类号： H02K7/09
CPC分类号： F16C39/063 , F16C32/0406 , H02K7/09
摘要： A magnetic suspension bearing with damping system includes a stator having a stator magnetic unit mounted on the internal portion of the stator, and a rotor rotatably located at the stator. A rotor magnetic unit installed on the rotor corresponding to the stator magnetic. The rotor further has a yoke having a magnetic driving unit corresponding to the external portion of the stator. A magnetic damping device located has a magnetic unit and an elastic unit, wherein the magnetic unit corresponding to the magnetic driving unit generates magnetic force between them, and the elastic unit coupled below the magnetic unit uses to reduce the vibration of the magnetic unit for maintaining the rotation of the rotor smooth and steady.
摘要翻译：具有阻尼系统的磁悬浮轴承包括具有安装在定子的内部上的定子磁性单元的定子和可旋转地定位在定子上的转子。转子磁性单元安装在与定子磁铁相对应的转子上。转子还具有具有对应于定子的外部的磁性驱动单元的磁轭。位于磁性阻尼装置的磁性单元和弹性单元，其中对应于磁性驱动单元的磁性单元在它们之间产生磁力，并且耦合在磁性单元下方的弹性单元用于减小磁性单元的振动以维持转子的旋转平稳稳定。

22. 发明授权

US07038341B1 Magnetic suspension bearing with damping system 失效
标题翻译：磁悬浮轴承带阻尼系统
公开(公告)号：US07038341B1
公开(公告)日：2006-05-02
申请号：US10980871
申请日：2004-11-04
申请人： Chien-chang Wang , Pi-cheng Tung , Ren-bin Xiao , Wei-cheng Chen , Chien-sheng Liu , Yu-hsiu Chang , Der-ray Huang
发明人： Chien-chang Wang , Pi-cheng Tung , Ren-bin Xiao , Wei-cheng Chen , Chien-sheng Liu , Yu-hsiu Chang , Der-ray Huang
IPC分类号： H02K7/09
CPC分类号： F16C39/063 , F16C32/0406 , H02K7/09
摘要： A magnetic suspension bearing with damping system includes a stator having a stator magnetic unit mounted on the internal portion of the stator, and a rotor rotatably located at the stator. A rotor magnetic unit installed on the rotor corresponding to the stator magnetic. The rotor further has a yoke having a magnetic driving unit corresponding to the external portion of the stator. A magnetic damping device located has a magnetic unit and an elastic unit, wherein the magnetic unit corresponding to the magnetic driving unit generates magnetic force between them, and the elastic unit coupled below the magnetic unit uses to reduce the vibration of the magnetic unit for maintaining the rotation of the rotor smooth and steady.
摘要翻译：具有阻尼系统的磁悬浮轴承包括具有安装在定子的内部上的定子磁性单元的定子和可旋转地定位在定子上的转子。转子磁性单元安装在与定子磁铁相对应的转子上。转子还具有具有对应于定子的外部的磁性驱动单元的磁轭。位于磁性阻尼装置的磁性单元和弹性单元，其中对应于磁性驱动单元的磁性单元在它们之间产生磁力，并且耦合在磁性单元下方的弹性单元用于减小磁性单元的振动以维持转子的旋转平稳稳定。

23. 发明申请

US20050140229A1 Magnetic suspension bearing 有权
标题翻译：磁悬浮轴承
公开(公告)号：US20050140229A1
公开(公告)日：2005-06-30
申请号：US11059522
申请日：2005-02-17
申请人： Chien-Chang Wang , Wei-Cheng Chen , Chau-Shin Jang , Chun-Min Chen
发明人： Chien-Chang Wang , Wei-Cheng Chen , Chau-Shin Jang , Chun-Min Chen
IPC分类号： F16C17/08 , F16C39/06 , H02K7/09
CPC分类号： H02K7/09 , F16C17/08 , F16C32/0402 , F16C32/0425 , F16C39/063
摘要： A magnetic suspension bearing located between the spindle and stator of a rotational device includes stator magnetic units mounted on the top side and bottom side of the stator and spindle magnetic units, which are mounted on two ends of the spindle. One end of the spindle has a loading section to support the spindle. The stator magnetic units and the spindle magnetic units generate a repulsive magnetic force to separate the spindle and stator from one another at a selected distance to avoid vibration and noise caused by obliquity and to increase the service life of products.
摘要翻译：位于旋转装置的主轴和定子之间的磁悬浮轴承包括安装在定子和主轴磁性单元的顶侧和底侧上的定子磁性单元，其安装在主轴的两端。主轴的一端具有支撑主轴的装载部分。定子磁性单元和主轴磁性单元产生排斥磁力，以使主轴和定子彼此间隔一定距离，以避免因倾斜引起的振动和噪音，并增加产品的使用寿命。

24. 发明授权

US10152482B2 Method of speeding up access to design databases having large numbers of design units 有权
公开(公告)号：US10152482B2
公开(公告)日：2018-12-11
申请号：US13449334
申请日：2012-04-18
申请人： Yao-Jih Hung , Robert Cameron Doig , Yung Le Wang , Wei-Cheng Chen , Jen-Feng Huang
发明人： Yao-Jih Hung , Robert Cameron Doig , Yung Le Wang , Wei-Cheng Chen , Jen-Feng Huang
IPC分类号： G06F17/30
摘要： A computer-implemented method is disclosed for speeding up database access of electronic design automation (EDA) tool which utilizes a database manager for file access. The EDA tool accesses a plurality of design files, and each of the plurality of design files is associated with one of a plurality of design units for an integrated circuit (IC). The plurality of design files are encapsulated into an archive file which comprises a plurality of data units, wherein each of the data units corresponds to a design file. A request to access a design file will be redirected to access the archive file. The design file is then accessed by accessing the corresponding data unit in the archive file.

25. 发明申请

US20130091098A1 METHOD OF SPEEDING UP ACCESS TO DESIGN DATABASES HAVING LARGE NUMBERS OF DESIGN UNITS 审中-公开
标题翻译：加速设计数据库的方法，具有大量设计单位数
公开(公告)号：US20130091098A1
公开(公告)日：2013-04-11
申请号：US13449334
申请日：2012-04-18
申请人： Yao-Jih Hung , Robert Cameron Doig , Yung Le Wang , Wei-Cheng Chen , Jen-Feng Huang
发明人： Yao-Jih Hung , Robert Cameron Doig , Yung Le Wang , Wei-Cheng Chen , Jen-Feng Huang
IPC分类号： G06F17/30
CPC分类号： G06F17/30091
摘要： A computer-implemented method is disclosed for speeding up database access of electronic design automation (EDA) tool which utilizes a database manager for file access. The EDA tool accesses a plurality of design files, and each of the plurality of design files is associated with one of a plurality of design units for an integrated circuit (IC). The plurality of design files are encapsulated into an archive file which comprises a plurality of data units, wherein each of the data units corresponds to a design file. A request to access a design file will be redirected to access the archive file. The design file is then accessed by accessing the corresponding data unit in the archive file.
摘要翻译：公开了一种计算机实现的方法，用于加速电子设计自动化（EDA）工具的数据库访问，该工具利用数据库管理器进行文件访问。 EDA工具访问多个设计文件，并且多个设计文件中的每一个与集成电路（IC）的多个设计单元中的一个相关联。多个设计文件被封装成包括多个数据单元的归档文件，其中每个数据单元对应于设计文件。访问设计文件的请求将被重定向到访问归档文件。然后通过访问存档文件中的相应数据单元访问设计文件。

26. 发明申请

US20120160873A1 DISPENSER FOR ADJUSTING RATIONING LIQUID 审中-公开
标题翻译：调理液体的分配器
公开(公告)号：US20120160873A1
公开(公告)日：2012-06-28
申请号：US12978645
申请日：2010-12-27
申请人： Hui Min Hsu , Chin Tsang Hsu , Hsiang Jen Hsiao , Jong Wu Chen , Wei Shiu Chen , Wei Cheng Chen , Po Han Huang , Ming Hsien Sung , Wei Tsang Lai
发明人： Hui Min Hsu , Chin Tsang Hsu , Hsiang Jen Hsiao , Jong Wu Chen , Wei Shiu Chen , Wei Cheng Chen , Po Han Huang , Ming Hsien Sung , Wei Tsang Lai
IPC分类号： B65D88/54
CPC分类号： B65D83/0038
摘要： A dispenser for adjusting rationing liquid includes a base having a space defined therein. A saddle head is movably sleeved on the base. The saddle head has a pathway defined therein and passing therethrough. The saddle head has a piston movably received in the space. The piston has an outer periphery abutting against an inner periphery of the space. A spring is sleeved on the base. An upper valve set is mounted in the pathway and a lower valve set is mounted in the space in the base.
摘要翻译：用于调节配给液体的分配器包括其中限定有空间的基座。鞍头可移动地套在基座上。鞍头具有限定在其中的通路。鞍头具有可移动地容纳在该空间中的活塞。活塞具有抵靠空间的内周的外周。一个弹簧套在基座上。上部阀组安装在通道中，下部阀组安装在基座的空间中。

27. 发明授权

US08110753B2 Circuit board assembly 有权
标题翻译：电路板组装
公开(公告)号：US08110753B2
公开(公告)日：2012-02-07
申请号：US12081099
申请日：2008-04-10
申请人： Wei-Cheng Chen , Cheng-Chao Liao
发明人： Wei-Cheng Chen , Cheng-Chao Liao
IPC分类号： H05K1/11 , H01R13/58
CPC分类号： H05K3/306 , H05K3/3405 , H05K3/3447 , H05K2201/09063 , H05K2201/10287 , H05K2201/10598 , H05K2201/10757
摘要： A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and second turns, respectively, the circuit board further having an abutting wall that extends between and that terminates at the first and second surfaces and that cooperates with the second surface to define a third turn; and an electric wire having a fixed end that is soldered to the circuit board, extending through the first through-hole, and passing over the first, second and third turns of the circuit board so as to form an inflection region between the first and second turns.
摘要翻译：电路板组件包括：具有相对的第一和第二表面的电路板，并形成有由孔限定壁限定的第一通孔，该第一通孔在第一和第二表面之间延伸并终止于第一和第二表面，并且与第一和第二表面配合表面分别限定第一和第二匝，电路板还具有在第一和第二表面之间延伸并且终止于第一和第二表面的邻接壁，并且与第二表面配合以限定第三匝; 以及电线，其固定端焊接到所述电路板，延伸穿过所述第一通孔，并且越过所述电路板的所述第一，第二和第三匝，以在所述第一和第二通孔之间形成拐点区域轮到

28. 发明申请

US20110108315A1 PROCESS FOR FABRICATING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE 有权
标题翻译：制造电路基板的方法和电路基板
公开(公告)号：US20110108315A1
公开(公告)日：2011-05-12
申请号：US12835085
申请日：2010-07-13
申请人： CHEN-YUEH KUNG , Wei-Cheng Chen
发明人： CHEN-YUEH KUNG , Wei-Cheng Chen
IPC分类号： H05K1/11 , H01B5/14 , B29C35/08
CPC分类号： H05K3/4007 , H05K3/0035 , H05K3/108 , H05K3/421 , H05K2201/0367 , H05K2201/0376 , H05K2201/09436 , H05K2201/09545 , H05K2203/308 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： A process for fabricating a circuit substrate is provided. A patterned conductive layer having an inner pad is provided on a base layer, a dielectric layer is disposed on the base layer and covers the patterned conductive layer, and a covering layer is disposed on the dielectric layer. A part of the covering layer is removed by dry etching to form a first opening. A part of the dielectric layer exposed by the first opening is removed to form a dielectric opening exposing a part of the inner pad. A patterned mask having a second opening to expose a part of the inner pad is formed on the covering layer. A conductive structure including a conductive block filling the dielectric opening, an outer pad filling the first opening and a surplus layer filling the second opening is formed. Finally, the patterned mask, surplus layer and covering layer are removed.
摘要翻译：提供了一种用于制造电路基板的工艺。具有内垫的图案化导电层设置在基底层上，电介质层设置在基底层上并覆盖图案化导电层，并且覆盖层设置在电介质层上。通过干蚀刻去除覆盖层的一部分以形成第一开口。去除由第一开口暴露的电介质层的一部分，以形成暴露一部分内垫的电介质开口。在覆盖层上形成具有第二开口以露出内部衬垫的一部分的图案化掩模。形成包括填充电介质开口的导电块，填充第一开口的外垫和填充第二开口的剩余层的导电结构。最后，去除图案化掩模，多余层和覆盖层。

29. 发明申请

US20100155939A1 CIRCUIT BOARD AND FABRICATION METHOD THEREOF AND CHIP PACKAGE STRUCTURE 有权
标题翻译：电路板及其制造方法及芯片封装结构
公开(公告)号：US20100155939A1
公开(公告)日：2010-06-24
申请号：US12432367
申请日：2009-04-29
申请人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
发明人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
IPC分类号： H01L23/498 , H05K1/09 , C25D5/02
CPC分类号： H05K3/242 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16225 , H01L2224/81193 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/243 , H05K3/28 , H05K3/4007 , H05K3/4602 , H05K2201/0352 , H05K2201/0367 , H05K2201/09481 , H05K2201/09536 , H05K2201/09627 , H05K2203/054 , H05K2203/0723 , H01L2224/05099
摘要： A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed.
摘要翻译：提供了电路板的制造方法。提供了一种衬底，顶部焊盘，电连接顶部焊盘以及顶部和基底阻焊层的基座。顶部和底座分别设置在基板的两个相对的表面上。具有部分露出顶部焊盘的第一开口和具有部分暴露基板的第二开口的基底阻焊层的顶部阻焊层分别设置在两个表面上。形成覆盖基底阻焊层和基座的导体层。在导电层上形成具有第三开口的电镀抗蚀剂层。通过第三开口将电流施加到导电层，用于在顶部焊盘上电镀预凸块。然后除去电镀抗蚀剂层和导电层。

30. 发明申请

US20090255721A1 Circuit board assembly 有权
标题翻译：电路板组装
公开(公告)号：US20090255721A1
公开(公告)日：2009-10-15
申请号：US12081099
申请日：2008-04-10
申请人： Wei-Cheng Chen , Cheng-Chao Liao
发明人： Wei-Cheng Chen , Cheng-Chao Liao
IPC分类号： H05K1/11
CPC分类号： H05K3/306 , H05K3/3405 , H05K3/3447 , H05K2201/09063 , H05K2201/10287 , H05K2201/10598 , H05K2201/10757
摘要： A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and second turns, respectively, the circuit board further having an abutting wall that extends between and that terminates at the first and second surfaces and that cooperates with the second surface to define a third turn; and an electric wire having a fixed end that is soldered to the circuit board, extending through the first through-hole, and passing over the first, second and third turns of the circuit board so as to form an inflection region between the first and second turns.
摘要翻译：电路板组件包括：具有相对的第一和第二表面的电路板，并形成有由孔限定壁限定的第一通孔，该第一通孔在第一和第二表面之间延伸并终止于第一和第二表面，并且与第一和第二表面配合表面分别限定第一和第二匝，电路板还具有在第一和第二表面之间延伸并且终止于第一和第二表面的邻接壁，并且与第二表面配合以限定第三匝; 以及电线，其固定端焊接到所述电路板，延伸穿过所述第一通孔，并且越过所述电路板的所述第一，第二和第三匝，以在所述第一和第二通孔之间形成拐点区域轮到

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