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    • 22. 发明申请
    • System And Method For Attaching Liquid Cooling Apparatus To A Chassis
    • 将液体冷却装置连接到底盘的系统和方法
    • US20110019364A1
    • 2011-01-27
    • US12508289
    • 2009-07-23
    • Tom J. Searby
    • Tom J. Searby
    • H05K7/20B23P11/00
    • G06F1/20G06F1/181H01L23/473H01L2924/0002Y10T29/49826H01L2924/00
    • A system for attaching liquid cooling apparatus includes a fan, a chassis and a grill. The chassis is configured to house electronic components in an interior volume and has an air flow opening large enough to receive the fan. The grill is configured to be fastened to the fan and to the chassis such that, when the grill is so fastened, the fan is disposed at least partially in the interior volume and the grill substantially covers the air flow opening. At least one recess is formed either in the chassis or the grill such that a coolant conduit may be inserted into the recess when the grill is not fastened to the chassis and the coolant conduit is confined within the recess when the grill is fastened to the chassis.
    • 用于安装液体冷却装置的系统包括风扇,底盘和格栅。 底盘被配置为将电子部件容纳在内部容积中并且具有足够大的空气流动开口以接收风扇。 格栅被构造成紧固到风扇和底盘,使得当格栅被如此紧固时,风扇至少部分地设置在内部空间中,并且格栅基本上覆盖空气流动开口。 在底盘或格栅中形成至少一个凹槽,使得当格栅未紧固到底盘时,冷却剂导管可以插入凹槽中,并且当格栅固定在底盘上时冷却剂导管被限制在凹槽内 。
    • 25. 发明授权
    • Duct for cooling multiple components in a processor-based device
    • 用于冷却基于处理器的设备中的多个组件的管道
    • US07215543B2
    • 2007-05-08
    • US11230711
    • 2005-09-20
    • Porter ArbogastRobert L. CraneMichael P. ElandSteven E. HanzlikArlen L. RoesnerErick J. TuttleTom J. Searby
    • Porter ArbogastRobert L. CraneMichael P. ElandSteven E. HanzlikArlen L. RoesnerErick J. TuttleTom J. Searby
    • H05K7/20
    • H01L23/467G06F1/20H01L2924/0002H01L2924/00
    • A duct for cooling multiple components in a processor-based device. The duct has an inlet cooling duct section for a cooling airflow focused toward a processor region. The duct also has at least one exit cooling duct section for the cooling airflow extending from the inlet cooling duct section and focused toward a component region, wherein the cooling airflow is successively transportable through the processor region followed by the component region. A processor-based system having a focused cooling duct. The focused cooling duct comprises an inlet cooling duct section for a cooling airflow having a fan receptacle, and a plurality of exit cooling duct sections for the cooling airflow extending from the inlet cooling duct section and focused toward component regions, wherein the cooling airflow is successively transportable through the inlet cooling duct section followed by the plurality of exit cooling duct sections. The processor-based system also comprises a plurality of components disposed in the component regions.
    • 用于冷却基于处理器的设备中的多个组件的管道。 管道具有用于朝着处理器区域聚焦的冷却气流的入口冷却管道部分。 管道还具有至少一个出口冷却管道部分,用于从入口冷却管道部分延伸并且朝向部件区域聚焦的冷却气流,其中冷却气流可依次传送通过处理器区域,随后是部件区域。 基于处理器的系统具有聚焦的冷却管道。 聚焦冷却管道包括用于具有风扇容器的冷却气流的入口冷却管道部分和用于从入口冷却管道部分延伸并朝向部件区域聚焦的冷却气流的多个出口冷却管道部分,其中冷却气流相继 可通过入口冷却管道部分运送,随后是多个出口冷却管段。 基于处理器的系统还包括设置在组件区域中的多个组件。