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21. 发明授权

US07982322B2 Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same 有权
标题翻译：用于电子部件密封的液体树脂组合物和使用该液体树脂组合物的电子部件装置
公开(公告)号：US07982322B2
公开(公告)日：2011-07-19
申请号：US12444449
申请日：2007-09-28
申请人： Satoru Tsuchida , Shinsuke Hagiwara , Kazuyoshi Tendou
发明人： Satoru Tsuchida , Shinsuke Hagiwara , Kazuyoshi Tendou
IPC分类号： H01L23/29
CPC分类号： H01L23/293 , C08G59/4035 , C08G59/5033 , H01L21/563 , H01L23/295 , H01L2224/73203 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01087 , H01L2924/09701 , H01L2924/1301 , H01L2924/13034 , Y10T428/249994 , Y10T428/25 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by comprising (A) an epoxy resin including a liquid epoxy resin, (B) a hardening agent including a liquid aromatic amine, (C) a hydrazide compound having an average particle diameter of less than 2 μm, and (D) an inorganic filler having an average particle diameter of less than 2 μm.
摘要翻译：本发明提供一种电子部件密封用液体树脂组合物，其在狭窄的间隙中流动性好，无空洞产生，且成形性优异; 以及由此可靠地（耐湿性和耐热冲击性）密封的电子部件装置。电子部件密封用液态树脂组合物的特征在于：（A）包含液体环氧树脂的环氧树脂，（B）包含液体芳族胺的硬化剂，（C）平均粒径小于 2μm，（D）平均粒径小于2μm的无机填料。

22. 发明申请

US20090273070A1 Liquid Resin Composition for Electronic Components and Electronic Component Device 有权
标题翻译：电子元件和电子元器件液体树脂组合物
公开(公告)号：US20090273070A1
公开(公告)日：2009-11-05
申请号：US12096445
申请日：2006-12-08
申请人： Kazuyoshi Tendou , Satoru Tsuchida , Shinsuke Hagiwara
发明人： Kazuyoshi Tendou , Satoru Tsuchida , Shinsuke Hagiwara
IPC分类号： H01L23/29 , H01L23/31 , H01L23/498 , C09D163/00 , C09D163/02 , C09D163/04
CPC分类号： C08G59/063 , C08G59/5033 , C08G59/686 , C08L63/00 , C08L83/04 , H01L23/293 , H01L2924/0002 , H01L2924/09701 , C08L83/00 , H01L2924/00
摘要： The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.
摘要翻译：本发明涉及一种电子部件用液体树脂组合物，其用于电子部件的密封，包括液体环氧树脂，含有液体芳香胺的固化剂和无机填料，并且还包含至少一种选自硬化促进剂，硅氧烷聚合物颗粒和非离子表面活性剂。由此，提供了一种电子部件用液态树脂组合物，其狭窄间隙的流动性优异，无空隙生成，粘合性和低应力特性优异，成形性优异，电子部件装置具有高密度的可靠性（耐湿性，耐热冲击性）。

23. 发明申请

US20080211283A1 Vehicle seat assembly 有权
标题翻译：车座总成
公开(公告)号：US20080211283A1
公开(公告)日：2008-09-04
申请号：US12009256
申请日：2008-01-16
申请人： Ritsuro Okano , Shinsuke Hagiwara , Jun Aoki
发明人： Ritsuro Okano , Shinsuke Hagiwara , Jun Aoki
IPC分类号： B60N2/02
CPC分类号： B60N2/1839 , B60N2/1821 , B60N2/2209 , B60N2/2222
摘要： Disclosed is a vehicle seat assembly having a feature in a seat cushion angle adjustment mechanism of a seat cushion in a simple configuration. A vehicle seat assembly according to an embodiment of the present invention comprises a seat back, a seat cushion coupled to the seat back, and a seat cushion angle adjustment mechanism for adjusting the seat angle of the seat cushion. The seat cushion angle adjustment mechanism comprises a seat cushion frame, a pivotal coupling member to pivotably couple the seat cushion frame to a slider of the seat rail, a guided part provided at a position away from a coupled position of the seat cushion frame to the pivotal coupling member, and a guide member having a guide groove which engages the guided part and guides the movement of the guided part and disposed with an angle between the guide groove and the slide surface of the seat rail set to a specific angle α.
摘要翻译：公开了一种车辆用座椅组件，其以简单的结构具有座垫的坐垫角度调节机构的特征。根据本发明的实施例的车辆座椅组件包括座椅靠背，联接到座椅靠背的座垫以及用于调节座垫的座椅角度的座椅坐垫角度调节机构。座垫角度调节机构包括座垫框架，枢转联接构件，用于可枢转地将座垫框架联接到座椅导轨的滑块;被引导部分设置在远离座垫框架的联接位置的位置处枢转联接构件和引导构件，其具有引导槽，引导槽接合被引导部分并且引导被引导部分的运动并且以导引槽和座椅导轨组件的滑动表面之间的角度设置为特定角度α。

24. 发明授权

US07187072B2 Fabrication process of semiconductor package and semiconductor package 失效
标题翻译：半导体封装和半导体封装的制造工艺
公开(公告)号：US07187072B2
公开(公告)日：2007-03-06
申请号：US10705706
申请日：2003-11-10
申请人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
发明人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
IPC分类号： H01L21/00
CPC分类号： H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/0002
摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
摘要翻译：提供了半导体封装基板，可以满足向半导体集成度高的趋势。将镍层电镀在电镀铜箔上以形成布线图案。将LSI芯片安装在铜箔上，通过引线接合连接LSI芯片和布线图案的端子，然后用半导体密封环氧树脂密封。只有铜箔用碱蚀刻剂溶解掉才能暴露镍。对于具有低铜溶力的镍剥离器，去除镍层以露出布线图案。涂覆阻焊剂，并且以使连接端子部分露出的方式形成图案。将焊球放置在布线图案的露出部分，然后熔合。布线图案通过焊球与外部印刷电路板连接。

25. 发明授权

US06329492B1 Phenyl, naphthyl or fluorene cyclopentyl epoxy resins 失效
标题翻译：苯基，萘基或芴环戊基环氧树脂
公开(公告)号：US06329492B1
公开(公告)日：2001-12-11
申请号：US09319487
申请日：1999-08-13
申请人： Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Akihiro Kobayashi , Hideki Yokoyama
发明人： Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Akihiro Kobayashi , Hideki Yokoyama
IPC分类号： C08G5906
CPC分类号： C08G59/3218 , C07C39/17 , C07C2601/08 , C08G59/24 , C08L63/00 , H01L23/293 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1301 , H01L2924/00014 , H01L2924/00
摘要： This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorptive, high adhesion and rich fluidity, which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.
摘要翻译：本发明提供一种适合作为电子器件的封装材料的化合物，其具有高Tg，低吸水性，高粘附性和较高的流动性，其为由式（I）表示的环戊烯化合物及其由式（I）表示的中间体环戊烯基化合物 III）。在该式中，m为0以上，Ar 1和Ar 2分别为酚残基，萘酚残基或芴衍生物残基，各自含有羟基或缩水甘油氧基。

26. 发明授权

US5962139A Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer 失效
标题翻译：环氧树脂半导体密封剂和有机聚合物接枝硅氧烷聚合物
公开(公告)号：US5962139A
公开(公告)日：1999-10-05
申请号：US15213
申请日：1998-01-29
申请人： Shinsuke Hagiwara , Hiroyuki Saitoh , Hiroki Sashima , Peter Huber , Bernward Deubzer , Michael Geck
发明人： Shinsuke Hagiwara , Hiroyuki Saitoh , Hiroki Sashima , Peter Huber , Bernward Deubzer , Michael Geck
IPC分类号： C08G59/20 , C08G59/62 , C08L63/00 , H01L23/29 , H01L23/31 , B32B27/04 , B32B27/38 , C08L63/04
CPC分类号： H01L23/296 , C08L63/00 , H01L2924/0002 , Y10S428/901 , Y10S525/902 , Y10T428/31511 , Y10T428/31522
摘要： An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is an epoxy resin molding material for sealing electronic parts.
摘要翻译：包含环氧树脂，酚醛树脂和具有由固体硅氧烷芯和有机聚合物壳构成的核 - 壳结构的粉末增塑剂的环氧树脂成型材料是用于密封电子部件的环氧树脂模制材料。

27. 发明授权

US5449480A Method of producing boards for printed wiring 失效
标题翻译：生产印刷线路板的方法
公开(公告)号：US5449480A
公开(公告)日：1995-09-12
申请号：US45786
申请日：1993-04-14
申请人： Hiroyuki Kuriya , Shinsuke Hagiwara
发明人： Hiroyuki Kuriya , Shinsuke Hagiwara
IPC分类号： B29C45/00 , B29C45/14 , B29C67/24 , B29C70/60 , C04B35/634 , H01B3/40 , H05K1/03 , H05K1/05 , H05K1/16 , H05K3/00 , H05K3/02 , H05K3/46
CPC分类号： H05K3/4652 , B29C45/0013 , B29C45/14467 , B29C67/243 , B29C70/606 , C04B35/63476 , H01B3/40 , H05K1/0373 , H05K1/056 , H05K3/0014 , H05K3/46 , B29C2045/14532 , B29K2063/00 , B29K2503/04 , B29K2503/06 , H05K1/0306 , H05K1/036 , H05K1/162 , H05K2201/0209 , H05K2201/09118 , H05K2203/1327 , H05K3/025 , H05K3/4644
摘要： A method of producing a board for printed wiring comprising disposing a metal foil in a plate-shape cavity of a mold so that the metal foil is in contact with at least one internal side of the cavity, injecting a molding material comprising an epoxy resin, a hardening agent and a powdery inorganic filler into the cavity and curing the epoxy resin, the molding material containing 50 to 90% by volume of the powdery inorganic filler based on the total of the molding material.
摘要翻译：一种印刷布线板的制造方法，其特征在于，将金属箔设置在模具的板状空腔内，使得金属箔与空腔的至少一个内侧接触，注入包含环氧树脂的成型材料，硬化剂和粉末状无机填料加入到空腔中并固化环氧树脂，该成型材料基于成型材料的总量含有50至90体积％的粉末状无机填料。

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