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21. 发明授权

US06553297B2 Integrated vehicle control system 有权
标题翻译：综合车辆控制系统
公开(公告)号：US06553297B2
公开(公告)日：2003-04-22
申请号：US09907501
申请日：2001-07-18
申请人： Tsutomu Tashiro , Noboru Miyamoto , Takehito Fujii , Yoshifumi Kato , Toshiki Matsumoto , Tomohiro Kato
发明人： Tsutomu Tashiro , Noboru Miyamoto , Takehito Fujii , Yoshifumi Kato , Toshiki Matsumoto , Tomohiro Kato
IPC分类号： G06F700
CPC分类号： B60W50/06 , B60W10/04 , B60W10/10 , B60W10/18 , B60W30/1819 , B60W2550/308 , B60W2550/402 , B60W2710/0666 , B60W2720/10 , B60W2720/103 , B60W2720/106
摘要： In a vehicular control system, when in the engine ECU, ATECU or brake ECU there occurs important information which requires an urgent response by any of the other ECUs, the important information is transmitted directly to the corresponding ECU through an important information communication line L1 without going through a manager ECU 10. Therefore, a controller in the ECU receives the important information and immediately controls the corresponding component based on the important information.
摘要翻译：在车辆控制系统中，当在发动机ECU中，ATECU或制动ECU出现需要任何其他ECU紧急响应的重要信息时，重要信息通过重要的信息通信线路L1直接发送到对应的ECU，而没有因此，ECU中的控制器接收重要信息，并根据重要信息立即控制相应的组件。

22. 发明申请

US20150108629A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20150108629A1
公开(公告)日：2015-04-23
申请号：US14357669
申请日：2012-02-14
申请人： Noboru Miyamoto , Masao Kikuchi
发明人： Noboru Miyamoto , Masao Kikuchi
IPC分类号： H01L23/473 , H01L23/40 , H01L23/29
CPC分类号： H01L23/473 , H01L23/29 , H01L23/3107 , H01L23/36 , H01L23/40 , H01L23/4334 , H01L23/49562 , H01L2224/48091 , H01L2224/48247 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A cooling fin 9 is joined to a semiconductor element 1. A resin 10 encapsulates the semiconductor element 1. A portion of the cooling fin 9 projects from a lower surface of the resin 10. A cooler 11 has an opening 12. The cooling fin 9 projecting from the resin 10 is inserted in the opening 12 of the cooler 11. The lower surface of the resin 10 and the cooler 11 are joined to each other by a joining material 13 such as an adhesive. Therefore, a reduction in the number of component parts and a reduction in weight can be achieved, and compatibility between the heat conductivity and the strength of joining can be ensured.
摘要翻译：冷却翅片9接合到半导体元件1.树脂10封装半导体元件1.冷却翅片9的一部分从树脂10的下表面突出。冷却器11具有开口12.冷却翅片9 从树脂10突出的部分插入到冷却器11的开口12中。树脂10的下表面和冷却器11通过诸如粘合剂的接合材料13彼此接合。因此，可以实现部件数量的减少和重量的减轻，并且可以确保导热性和接合强度之间的兼容性。

23. 发明申请

US20150076678A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20150076678A1
公开(公告)日：2015-03-19
申请号：US14376943
申请日：2012-05-28
申请人： Noboru Miyamoto
发明人： Noboru Miyamoto
IPC分类号： H01L23/04 , H01L23/46 , H01L23/50
CPC分类号： H01L23/50 , H01L23/04 , H01L23/46 , H01L23/473 , H01L25/115 , H01L25/18 , H01L2224/33 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/0002 , H02M7/003 , H01L2924/00 , H01L2924/00014
摘要： A partition in lattice form forms a plurality of housing sections. A plurality of circuit blocks including a semiconductor block and a terminal base block are electrically connected one to another in a state of being housed in the housing sections to form a power semiconductor circuit. The semiconductor block is formed by covering an IGBT with an insulating material. A collector of the IGBT is connected to an electrode through a metal plate. The electrode is led out from an inner portion of the insulating material to a side surface of the insulating material. A terminal base block includes a power terminal to which an external power wiring for supplying electric power to the IGBT is electrically connected, and a screw hole into which a screw for fixing the power wiring is inserted.
摘要翻译：格子形状的分隔物形成多个壳体部分。包括半导体块和端子基块的多个电路块在被容纳在壳体部分中的状态下彼此电连接以形成功率半导体电路。通过用绝缘材料覆盖IGBT形成半导体块。 IGBT的集电极通过金属板与电极连接。电极从绝缘材料的内部引出到绝缘材料的侧表面。端子基块包括电源端子，用于向IGBT供电的外部电力线电连接到该电源端子，以及插入用于固定电力布线的螺钉的螺孔。

24. 发明申请

US20110309776A1 SEMICONDUCTOR CIRCUIT DEVICE INCLUDING SWITCHING ELEMENT 有权
标题翻译：包括开关元件的半导体电路设备
公开(公告)号：US20110309776A1
公开(公告)日：2011-12-22
申请号：US13042791
申请日：2011-03-08
申请人： Noboru MIYAMOTO
发明人： Noboru MIYAMOTO
IPC分类号： H02P27/06
CPC分类号： H02P27/06 , H02M2001/0029
摘要： A semiconductor circuit device includes a semiconductor circuit including a switching element, a temperature monitoring unit, and a control unit. The temperature monitoring unit detects or estimates a temperature of a component connected to an inside or an outside of the semiconductor circuit. Here, the temperature of the component changes in accordance with a frequency of a current flowing through the component, and the frequency of the current flowing through the component changes in accordance with a switching frequency of the switching element. The control unit adjusts the switching frequency of the switching element such that the temperature of the component is equal to a target temperature.
摘要翻译：半导体电路器件包括具有开关元件，温度监控单元和控制单元的半导体电路。温度监视单元检测或估计连接到半导体电路的内部或外部的部件的温度。这里，元件的温度根据流过元件的电流的频率而变化，流过元件的电流的频率根据开关元件的开关频率而变化。控制单元调节开关元件的开关频率，使得元件的温度等于目标温度。

25. 发明授权

US07899563B2 Protective system feedback control device 有权
标题翻译：保护系统反馈控制装置
公开(公告)号：US07899563B2
公开(公告)日：2011-03-01
申请号：US12170788
申请日：2008-07-10
申请人： Noboru Miyamoto , Koichi Ushijima
发明人： Noboru Miyamoto , Koichi Ushijima
IPC分类号： G05B9/02
CPC分类号： G05B11/40 , G05B13/021 , H02M1/32 , H02M3/157
摘要： A system control device includes a protective control section for providing protective control while allowing a first control command value computation section to perform computations during a period during which a first feedback control section exercises control; a control command value decrease section; a termination time acquisition section for acquiring the information about the termination time for the protective control; and a termination control section which uses a control command value decreased by the control command value decrease section as the initial control command value after the termination time.
摘要翻译：一种系统控制装置，包括：保护控制部，用于提供保护控制，同时允许第一控制命令值计算部在第一反馈控制部进行控制的期间内执行计算; 控制指令值减少部分; 终止时间获取部，用于获取关于所述保护控制的终止时间的信息; 以及终止控制部，其使用由控制指令值减少部减少的控制指令值作为终止时间之后的初始控制指令值。

26. 发明授权

US07777533B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07777533B2
公开(公告)日：2010-08-17
申请号：US12116570
申请日：2008-05-07
申请人： Noboru Miyamoto , Natsuki Tsuji
发明人： Noboru Miyamoto , Natsuki Tsuji
IPC分类号： H03B1/00 , H03K3/00
CPC分类号： H02M1/38 , H02M2001/385 , H03K17/0828 , H03K17/165
摘要： The present invention provides a semiconductor device includes arms formed by two semiconductor elements, a map memory device which stores therein a correlation map between a control value for each of the arms and an optimized dead time to be set for the control value or is capable of storing the same therein, drive control value acquiring means for acquiring a drive control value of each of the arms, and a dead time generating circuit for extracting the optimized dead time corresponding to the drive control value from the correlation map. The time taken until the other of the semiconductor elements is turned on after one thereof has received a command to turn off the same is the optimized dead time extracted by the dead time generating circuit.
摘要翻译：本发明提供了一种半导体器件，包括由两个半导体元件形成的臂，地图存储器件，其中存储有用于每个臂的控制值与要设置的控制值的优化死区时间之间的相关图，或者能够存储其中的驱动控制值获取装置，用于获取每个臂的驱动控制值;以及死区时间生成电路，用于从相关图提取与驱动控制值相对应的优化死区时间。在其中一个半导体元件中的一个已经接收到关闭它的命令之后，其余的半导体元件所经过的时间是由死区时间产生电路提取的优化的死区时间。

27. 发明申请

US20090161726A1 Temperature detection system 有权
标题翻译：温度检测系统
公开(公告)号：US20090161726A1
公开(公告)日：2009-06-25
申请号：US12137916
申请日：2008-06-12
申请人： Noboru Miyamoto , Akira Yamamoto
发明人： Noboru Miyamoto , Akira Yamamoto
IPC分类号： G01K7/00
CPC分类号： G01K7/42 , G01K7/01
摘要： A temperature detection system includes a power semiconductor device, a chip temperature detection device for detecting a temperature of the power semiconductor device, loss-related characteristic value acquiring means for acquiring a loss-related characteristic value that is a characteristic to decide a loss of the power semiconductor device, difference value calculating means for calculating, from the loss-related characteristic value, a difference value between the temperature of the power semiconductor device and a temperature detected by the chip temperature detection device, a corrected temperature signal generating part for generating a corrected temperature signal by adding the temperature detected by the chip temperature detection device and the difference value, and an output part for outputting the corrected temperature signal to the outside.
摘要翻译：温度检测系统包括功率半导体装置，用于检测功率半导体装置的温度的芯片温度检测装置，损失相关特性值获取装置，用于获取作为决定损耗的特性的损失相关特性值功率半导体装置，差值计算装置，用于根据损耗相关特性值计算功率半导体器件的温度与由芯片温度检测装置检测的温度之间的差值;校正温度信号产生部分，用于产生通过将由芯片温度检测装置检测到的温度和差值相加来校正温度信号，以及输出部分，用于将校正的温度信号输出到外部。

28. 发明授权

US09418910B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09418910B2
公开(公告)日：2016-08-16
申请号：US14385311
申请日：2012-07-05
申请人： Noboru Miyamoto , Naoki Yoshimatsu
发明人： Noboru Miyamoto , Naoki Yoshimatsu
IPC分类号： H01L23/34 , H01L23/31 , H01L23/16 , H01L25/07 , H01L23/373 , H01L23/433 , H01L23/495 , H01L25/18
CPC分类号： H01L23/31 , H01L23/16 , H01L23/3121 , H01L23/3142 , H01L23/34 , H01L23/3735 , H01L23/4334 , H01L23/49562 , H01L23/49575 , H01L25/072 , H01L25/18 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2924/1305 , H01L2924/13055 , H01L2924/00 , H01L2924/00014
摘要： A circuit pattern is bonded to a top surface of a ceramic substrate. A cooling body is bonded to an undersurface of the ceramic substrate. An IGBT and a FWD are provided on the circuit pattern. A coating film covers a junction between the ceramic substrate and the circuit pattern, and a junction between the ceramic substrate and the cooling body. A mold resin seals the ceramic substrate, the circuit pattern, the IGBT, the FWD, the cooling body, and the coating film etc. The ceramic substrate has higher thermal conductivity than the coating film. The coating film has lower hardness than the mold resin and alleviates stress applied from the mold resin to the ceramic substrate. The circuit pattern and the cooling body includes a groove contacting the mold resin without being covered with the coating film.
摘要翻译：电路图案被结合到陶瓷衬底的顶表面。冷却体与陶瓷基板的下表面接合。在电路图案上提供IGBT和FWD。涂膜覆盖陶瓷基板和电路图案之间的接合部以及陶瓷基板与冷却体之间的接合部。模具树脂密封陶瓷基板，电路图案，IGBT，FWD，冷却体和涂膜等。陶瓷基板具有比涂膜更高的热导率。涂膜具有比模制树脂低的硬度，并且减轻了从模制树脂施加到陶瓷基板的应力。电路图案和冷却体包括与模制树脂接触而不被覆膜覆盖的槽。

29. 发明授权

US09263356B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US09263356B2
公开(公告)日：2016-02-16
申请号：US14376943
申请日：2012-05-28
申请人： Noboru Miyamoto
发明人： Noboru Miyamoto
IPC分类号： H01L23/04 , H01L25/11 , H01L25/18 , H01L23/473 , H01L23/46 , H01L23/50 , H02M7/00
CPC分类号： H01L23/50 , H01L23/04 , H01L23/46 , H01L23/473 , H01L25/115 , H01L25/18 , H01L2224/33 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/0002 , H02M7/003 , H01L2924/00 , H01L2924/00014
摘要： A partition in lattice form forms a plurality of housing sections. A plurality of circuit blocks including a semiconductor block and a terminal base block are electrically connected one to another in a state of being housed in the housing sections to form a power semiconductor circuit. The semiconductor block is formed by covering an IGBT with an insulating material. A collector of the IGBT is connected to an electrode through a metal plate. The electrode is led out from an inner portion of the insulating material to a side surface of the insulating material. A terminal base block includes a power terminal to which an external power wiring for supplying electric power to the IGBT is electrically connected, and a screw hole into which a screw for fixing the power wiring is inserted.
摘要翻译：格子形状的分隔物形成多个壳体部分。包括半导体块和端子基块的多个电路块在被容纳在壳体部分中的状态下彼此电连接以形成功率半导体电路。通过用绝缘材料覆盖IGBT形成半导体块。 IGBT的集电极通过金属板与电极连接。电极从绝缘材料的内部引出到绝缘材料的侧表面。端子基块包括电源端子，用于向IGBT供电的外部电力线电连接到该电源端子，以及插入用于固定电力布线的螺钉的螺孔。

30. 发明申请

US20150003016A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM 审中-公开
标题翻译：半导体器件和半导体系统
公开(公告)号：US20150003016A1
公开(公告)日：2015-01-01
申请号：US14361757
申请日：2012-03-19
申请人： Noboru Miyamoto , Takaaki Shirasawa
发明人： Noboru Miyamoto , Takaaki Shirasawa
IPC分类号： H01L23/473 , H01L23/16
CPC分类号： H01L23/473 , H01L23/16 , H01L23/4334 , H01L2924/0002 , H01L2924/00
摘要： It is an object of the present invention to provide a semiconductor device which is easily replaceable and a semiconductor system using the semiconductor device. The semiconductor device of the present invention includes a semiconductor chip, a cooler that cools the semiconductor chip, a housing that houses the semiconductor chip and the cooler, a transfer resin that seals the semiconductor chip and the cooler inside the housing, electrodes connected to the semiconductor chip, and a joining pipe attached to the cooler, the joining pipe letting in and out a flow of a refrigerant from and to the cooler. The electrodes and the joining pipe are formed to protrude from the same surface of the housing in substantially the same direction.
摘要翻译：本发明的目的是提供一种易于替换的半导体器件和使用该半导体器件的半导体系统。本发明的半导体器件包括半导体芯片，冷却半导体芯片的冷却器，容纳半导体芯片和冷却器的壳体，密封壳体内的半导体芯片和冷却器的转移树脂，连接到半导体芯片的电极半导体芯片和连接到冷却器的接合管，接合管使制冷剂从冷却器流出。电极和接合管形成为从壳体的相同表面沿基本相同的方向突出。

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