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    • 21. 发明授权
    • Cooling device
    • 冷却装置
    • US07040381B2
    • 2006-05-09
    • US10502146
    • 2003-01-22
    • Ronald EiseleKlaus Kristen Olesen
    • Ronald EiseleKlaus Kristen Olesen
    • H05K7/20
    • H05K7/20927F28F3/086F28F13/02H01L23/3677H01L23/473H01L2924/0002H05K7/20345H05K7/20918H01L2924/00
    • A cooling device comprising a heat-conducting cooling plate on the side of the electronic power components to be cooled and a platelike cooling fluid distributing device. The distributing device has cooling fluid outlets on the side facing the cooling plate, said outlets being arranged at a distance from and pointing towards the cooling plate. The distributing device also comprises at least one drain outlet for the cooling fluid. The cooling device comprises a first plate in which outlets and a plurality of drain outlets are evenly distributed and a second plate and a third plate which are superimposed, wherein two plates define a feed channel that is connected to all outlets and a drain channel that is connected to all drain outlets.
    • 一种冷却装置,其包括在要冷却的电子部件的一侧的导热冷却板和板状冷却液分配装置。 分配装置在面向冷却板的一侧具有冷却流体出口,所述出口布置成与冷却板相距一定距离。 分配装置还包括用于冷却流体的至少一个排出口。 冷却装置包括第一板,其中出口和多个排出口均匀地分布,并且叠置有第二板和第三板,其中两个板限定连接到所有出口的进料通道和排放通道, 连接到所有排水口。
    • 22. 发明授权
    • Temperature sensor or temperature sensor arrangement made from glass
ceramic and bonding film resistors
    • 由玻璃陶瓷和粘结薄膜电阻制成的温度传感器或温度传感器装置
    • US5258736A
    • 1993-11-02
    • US731774
    • 1991-07-18
    • Klaus KristenHerwig Scheidler
    • Klaus KristenHerwig Scheidler
    • F24C7/02G01K7/18G01K7/22H01C7/00H05B3/00H05B3/74H01C7/10
    • H01C7/008G01K7/223
    • Temperature sensors or temperature sensor arrangements made from glass ceramic and bonding film resistors, suitable especially for control and limitation of output in glass ceramic cooking areas, are distinguished in that thin- and/or thick-film resistors are baked on supports of glass ceramic, for example, in the area of the cooking zone of a glass ceramic cooking surface, and one or more glass ceramic resistances are delimited and bonded there, and the film resistors form parallel and/or iterative circuits with the glass ceramic resistances. By suitable selection of the dimensions as well as the surface resistances and temperature coefficients of the bonding film resistors and the type of sensor circuit (parallel and/or iterative circuit), the temperature resistance characteristic of a sensor circuit can be varied within wide limits, e.g., the temperature area of use of a glass ceramic sensor can be considerably expanded toward low temperatures. The geometric shape of a sensor arrangement can be matched to the specified temperature distribution of a surface to be monitored, for example, a glass ceramic cooking surface in the area of the cooking zones, so that practically all areas of the heated surface essential for the temperature control and limitation are detected.
    • 由玻璃陶瓷和粘合膜电阻器制成的温度传感器或温度传感器装置特别适用于控制和限制玻璃陶瓷烹饪区域的输出,其特征在于薄膜和/或厚膜电阻器在玻璃陶瓷支撑件上烘烤, 例如在玻璃陶瓷烹调表面的烹调区域中,并且将一个或多个玻璃陶瓷电阻限定并结合在其上,并且膜电阻器与玻璃陶瓷电阻器形成平行和/或迭代电路。 通过适当选择尺寸以及接合薄膜电阻器的表面电阻和温度系数以及传感器电路的类型(并联和/或迭代电路),传感器电路的耐温特性可以在宽范围内变化, 例如,玻璃陶瓷传感器的使用温度范围可以显着地向低温扩展。 传感器装置的几何形状可以与待监测表面的规定温度分布匹配,例如烹饪区域中的玻璃陶瓷烹调表面,使得加热表面的几乎所有区域对于 检测温度控制和限制。