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    • 23. 发明授权
    • Topological global routing for automated IC package interconnect
    • 用于自动化IC封装互连的拓扑全局布线
    • US06516447B2
    • 2003-02-04
    • US09886265
    • 2001-06-22
    • Ken WadlandGlendine Kingsbury
    • Ken WadlandGlendine Kingsbury
    • G06F1750
    • G06F17/5077G06F2217/40
    • An automated method and system is disclosed to determine an Integrated Circuit (IC) package interconnect routing using a mathematical topological solution. A global topological routing solution is determined to provide singular ideal IC package routing solution. Topological Global Routing provides a mathematical abstraction of the problem that allows multiple optimizations to be performed prior to detailed routing. Preliminary disregard of electrical routing segment width and required clearance allows the global topological solution to be determined quickly. The global topological solution is used in conjunction with necessary design parameters to determine the optimal geometric routing solution. Guide points are determined using the geometric routing solution. A detail router uses the guide points as corners when performing the actual routing.
    • 公开了一种自动化方法和系统来确定使用数学拓扑解决方案的集成电路(IC)封装互连路由。 确定全球拓扑路由解决方案,以提供单一的理想IC封装路由解决方案。 拓扑全局路由提供了一个数学抽象的问题,允许在详细路由之前执行多个优化。 电气路由段宽度和所需间隙的初步忽略允许快速确定全局拓扑解决方案。 全局拓扑解决方案与必要的设计参数结合使用,以确定最佳几何路由解决方案。 引导点使用几何路由解决方案确定。 详细路由器在执行实际路由时使用引导点作为拐角。