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    • 22. 发明授权
    • Semiconductor device and a method of manufacturing the same
    • 半导体装置及其制造方法
    • US08084303B2
    • 2011-12-27
    • US12771673
    • 2010-04-30
    • Kazuyoshi ShibaHideyuki Yashima
    • Kazuyoshi ShibaHideyuki Yashima
    • H01L21/82
    • H01L27/11546H01L27/105H01L27/11526H01L29/66825H01L29/7833H01L29/7883
    • In a memory cell array on a main surface of a semiconductor substrate, a floating gate electrode for accumulating charges for information is arranged. The floating gate electrode is covered with a cap insulating film and a pattern of an first insulating film formed thereon. Further, over the entire main surface of the semiconductor substrate, an second insulating film is deposited so that it covers the pattern of the first insulating film and a gate electrode. The second insulating film is formed by a silicon nitride film formed by a plasma CVD method. The first insulating film is formed by a silicon nitride film formed by a low-pressure CVD method. By the provision of such an first insulating film, it is possible to suppress or prevent water or hydrogen ions from diffusing to the floating gate electrode, and therefore, the data retention characteristics of a flash memory can be improved.
    • 在半导体衬底的主表面上的存储单元阵列中,布置用于累积信息电荷的浮栅电极。 浮栅电极覆盖有帽绝缘膜和形成在其上的第一绝缘膜的图案。 此外,在半导体基板的整个主表面上沉积第二绝缘膜,以覆盖第一绝缘膜和栅电极的图案。 第二绝缘膜由通过等离子体CVD法形成的氮化硅膜形成。 第一绝缘膜由通过低压CVD方法形成的氮化硅膜形成。 通过设置这样的第一绝缘膜,可以抑制或防止水或氢离子扩散到浮栅电极,因此可以提高闪速存储器的数据保持特性。
    • 23. 发明申请
    • SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20100219458A1
    • 2010-09-02
    • US12771673
    • 2010-04-30
    • KAZUYOSHI SHIBAHideyuki Yashima
    • KAZUYOSHI SHIBAHideyuki Yashima
    • H01L27/105H01L29/788
    • H01L27/11546H01L27/105H01L27/11526H01L29/66825H01L29/7833H01L29/7883
    • The data retention characteristics of a nonvolatile memory circuit are improved. In a memory cell array on a main surface of a semiconductor substrate, a floating gate electrode for accumulating charges for information is arranged. The floating gate electrode is covered with a cap insulating film and a pattern of an insulating film 4a formed thereon. Further, over the entire main surface of the semiconductor substrate, an insulating film 2a is deposited so that it covers the pattern of the insulating film 4a and a gate electrode. The insulating film 2a is formed by a silicon nitride film formed by the plasma CVD method. The insulating film 4a is formed by a silicon nitride film formed by the low-pressure CVD method. By the provision of such an insulating film 4a, it is possible to suppress or prevent water or hydrogen ions from diffusing to the floating gate electrode, and therefore, the data retention characteristics of a flash memory can be improved.
    • 提高了非易失性存储器电路的数据保持特性。 在半导体衬底的主表面上的存储单元阵列中,布置用于累积信息电荷的浮栅电极。 浮栅电极覆盖有帽绝缘膜和形成在其上的绝缘膜4a的图案。 此外,在半导体基板的整个主表面上沉积绝缘膜2a,以覆盖绝缘膜4a和栅电极的图案。 绝缘膜2a由通过等离子体CVD法形成的氮化硅膜形成。 绝缘膜4a由通过低压CVD法形成的氮化硅膜形成。 通过设置这样的绝缘膜4a,可以抑制或防止水或氢离子扩散到浮栅电极,因此可以提高闪存的数据保持特性。
    • 24. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07639541B2
    • 2009-12-29
    • US11971546
    • 2008-01-09
    • Kazuyoshi ShibaYasushi Oka
    • Kazuyoshi ShibaYasushi Oka
    • G11C11/03
    • H01L27/115G11C16/0441G11C2216/26H01L27/11521H01L27/11558
    • A semiconductor device includes a circuit forming area and a memory area including memory cells, first and second wells, a first conductor film formed over both wells and a second conductor film formed over the first well. First semiconductor regions are formed in the first region and a second semiconductor region is formed in the second region. The memory cells each include a capacitance element, including the first conductor film and second region, an element for reading data, including the first conductor film and first regions, and a selection field effect transistor, including the second conductor film and first regions. A length of the first conductor film of the capacitance element is larger than a length of the first conductor film of the element for reading data. A word line of the memory cell is connected to the second semiconductor region. During a reading data operation, a first bit line of the memory cell is connected to the first semiconductor region of the element for reading data via the selection field effect transistor.
    • 半导体器件包括电路形成区域和包括存储单元,第一和第二阱,形成在两个阱上的第一导体膜和形成在第一阱上的第二导体膜的存储区域。 第一半导体区域形成在第一区域中,并且在第二区域中形成第二半导体区域。 存储单元各自包括包括第一导体膜和第二区域的电容元件,包括第一导体膜和第一区域的用于读取数据的元件,以及包括第二导体膜和第一区域的选择场效应晶体管。 电容元件的第一导体膜的长度大于用于读取数据的元件的第一导体膜的长度。 存储单元的字线连接到第二半导体区域。 在读取数据操作期间,存储单元的第一位线连接到用于经由选择场效应晶体管读取数据的元件的第一半导体区域。
    • 25. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US07601581B2
    • 2009-10-13
    • US11649759
    • 2007-01-05
    • Yasuhiro TaniguchiKazuyoshi Shiba
    • Yasuhiro TaniguchiKazuyoshi Shiba
    • H01L21/8238
    • H01L21/823462H01L27/0629H01L27/105H01L27/1052H01L27/11568H01L27/11573
    • Provided is a manufacturing method of a semiconductor device, which comprises forming a film stack of a gate insulating film, a charge storage film, insulating film, polysilicon film, silicon oxide film, silicon nitride film and cap insulating film over a semiconductor substrate; removing the film stack by photolithography and etching from a low breakdown voltage MISFET formation region and a high breakdown voltage MISFET formation region; forming gate insulating films, polysilicon film and cap insulating film over the semiconductor substrate, forming a gate electrode in the low breakdown voltage MISFET formation region and high breakdown voltage MISFET formation region, and then forming a gate electrode in a memory cell formation region. By the manufacturing technology of a semiconductor device for forming the gate electrodes of a first MISFET and a second MISFET in different steps, the present invention makes it possible to provide the first MISFET and the second MISFET each having improved reliability.
    • 提供一种半导体器件的制造方法,其包括在半导体衬底上形成栅极绝缘膜,电荷存储膜,绝缘膜,多晶硅膜,氧化硅膜,氮化硅膜和帽绝缘膜的膜堆叠; 通过光刻和蚀刻从低击穿电压MISFET形成区域和高击穿电压MISFET形成区域去除膜堆叠; 在半导体衬底上形成栅极绝缘膜,多晶硅膜和帽绝缘膜,在低击穿电压MISFET形成区域和高击穿电压MISFET形成区域中形成栅电极,然后在存储器单元形成区域中形成栅电极。 通过以不同的步骤形成第一MISFET和第二MISFET的栅极的半导体器件的制造技术,本发明使得可以提供具有改善的可靠性的第一MISFET和第二MISFET。
    • 26. 发明申请
    • SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20090008690A1
    • 2009-01-08
    • US12137955
    • 2008-06-12
    • Kazuyoshi SHIBAHideyuki Yashima
    • Kazuyoshi SHIBAHideyuki Yashima
    • H01L27/108H01L29/788H01L21/336
    • H01L27/11546H01L27/105H01L27/11526H01L29/66825H01L29/7833H01L29/7883
    • The data retention characteristics of a nonvolatile memory circuit are improved. In a memory cell array on a main surface of a semiconductor substrate, a floating gate electrode for accumulating charges for information is arranged. The floating gate electrode is covered with a cap insulating film and a pattern of an insulating film 4a formed thereon. Further, over the entire main surface of the semiconductor substrate, an insulating film 2a is deposited so that it covers the pattern of the insulating film 4a and a gate electrode. The insulating film 2a is formed by a silicon nitride film formed by the plasma CVD method. The insulating film 4a is formed by a silicon nitride film formed by the low-pressure CVD method. By the provision of such an insulating film 4a, it is possible to suppress or prevent water or hydrogen ions from diffusing to the floating gate electrode, and therefore, the data retention characteristics of a flash memory can be improved.
    • 提高了非易失性存储器电路的数据保持特性。 在半导体衬底的主表面上的存储单元阵列中,布置用于累积信息电荷的浮栅电极。 浮栅电极覆盖有帽绝缘膜和形成在其上的绝缘膜4a的图案。 此外,在半导体基板的整个主表面上沉积绝缘膜2a,以覆盖绝缘膜4a和栅电极的图案。 绝缘膜2a由通过等离子体CVD法形成的氮化硅膜形成。 绝缘膜4a由通过低压CVD法形成的氮化硅膜形成。 通过设置这样的绝缘膜4a,可以抑制或防止水或氢离子扩散到浮栅电极,因此可以提高闪存的数据保持特性。
    • 28. 发明申请
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US20070207575A1
    • 2007-09-06
    • US11649759
    • 2007-01-05
    • Yasuhiro TaniguchiKazuyoshi Shiba
    • Yasuhiro TaniguchiKazuyoshi Shiba
    • H01L21/8238
    • H01L21/823462H01L27/0629H01L27/105H01L27/1052H01L27/11568H01L27/11573
    • Provided is a manufacturing method of a semiconductor device, which comprises forming a film stack of a gate insulating film, a charge storage film, insulating film, polysilicon film, silicon oxide film, silicon nitride film and cap insulating film over a semiconductor substrate; removing the film stack by photolithography and etching from a low breakdown voltage MISFET formation region and a high breakdown voltage MISFET formation region; forming gate insulating films, polysilicon film and cap insulating film over the semiconductor substrate, forming a gate electrode in the low breakdown voltage MISFET formation region and high breakdown voltage MISFET formation region, and then forming a gate electrode in a memory cell formation region. By the manufacturing technology of a semiconductor device for forming the gate electrodes of a first MISFET and a second MISFET in different steps, the present invention makes it possible to provide the first MISFET and the second MISFET each having improved reliability.
    • 提供一种半导体器件的制造方法,其包括在半导体衬底上形成栅极绝缘膜,电荷存储膜,绝缘膜,多晶硅膜,氧化硅膜,氮化硅膜和帽绝缘膜的膜堆叠; 通过光刻和蚀刻从低击穿电压MISFET形成区域和高击穿电压MISFET形成区域去除膜堆叠; 在半导体衬底上形成栅极绝缘膜,多晶硅膜和帽绝缘膜,在低击穿电压MISFET形成区域和高击穿电压MISFET形成区域中形成栅电极,然后在存储器单元形成区域中形成栅电极。 通过以不同的步骤形成第一MISFET和第二MISFET的栅极的半导体器件的制造技术,本发明使得可以提供具有改善的可靠性的第一MISFET和第二MISFET。