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21. 发明授权

US07198413B2 Parallel optical subassembly module structure 有权
标题翻译：平行光学组件模块结构
公开(公告)号：US07198413B2
公开(公告)日：2007-04-03
申请号：US10915369
申请日：2004-08-11
申请人： Chih-Ting Kao , Chih-Hsiang Ko , Bor-Chen Tsai , Chun-Hsun Chu , Yii-Tay Chiou , Jung-Tai Chen
发明人： Chih-Ting Kao , Chih-Hsiang Ko , Bor-Chen Tsai , Chun-Hsun Chu , Yii-Tay Chiou , Jung-Tai Chen
IPC分类号： G02B6/36
CPC分类号： G02B6/4249 , G02B6/4214 , G02B6/4292
摘要： A parallel optical subassembly module structure comprises an opto-electronic device array, a base with a reflecting slope, and a micro-lens array plate with an inclined plane provided with a specific angle. The optical signal emitted from the opto-electronic device array reflects by the reflecting slope and is incident into the inclined plane of the micro-lens array plate with the specific angle. The inclined plane rectifies the optical signal to output in horizontal direction. Then the optical signal couples with the external fibers through each micro lens of the micro-lens array. The pathway of receiving the optical signal is the same as described above, but in reverse direction.
摘要翻译：平行光学子组件模块结构包括光电子器件阵列，具有反射斜面的基底和具有设置有特定角度的倾斜平面的微透镜阵列板。从光电子器件阵列发射的光信号由反射斜面反射并以特定角度入射到微透镜阵列板的倾斜平面中。倾斜平面将光信号整流以在水平方向上输出。然后，光信号通过微透镜阵列的每个微透镜与外部光纤耦合。接收光信号的路径与上述相同，但是相反。

22. 发明申请

US20050185896A1 Parallel optical subassembly module structure 有权
标题翻译：平行光学组件模块结构
公开(公告)号：US20050185896A1
公开(公告)日：2005-08-25
申请号：US10915369
申请日：2004-08-11
申请人： Chih-Ting Kao , Chih-Hsiang Ko , Bor-Chen Tsai , Chun-Hsun Chu , Yii-Tay Chiou , Jung-Tai Chen
发明人： Chih-Ting Kao , Chih-Hsiang Ko , Bor-Chen Tsai , Chun-Hsun Chu , Yii-Tay Chiou , Jung-Tai Chen
IPC分类号： G02B6/00 , G02B6/36 , G02B6/42 , H04B10/00
CPC分类号： G02B6/4249 , G02B6/4214 , G02B6/4292
摘要： A parallel optical subassembly module structure comprises an opto-electronic device array, a base with a reflecting slope, and a micro-lens array plate with an inclined plane provided with a specific angle. The optical signal emitted from the opto-electronic device array reflects by the reflecting slope and is incident into the inclined plane of the micro-lens array plate with the specific angle. The inclined plane rectifies the optical signal to output in horizontal direction. Then the optical signal couples with the external fibers through each micro lens of the micro-lens array. The pathway of receiving the optical signal is the same as described above, but in reverse direction.
摘要翻译：平行光学子组件模块结构包括光电子器件阵列，具有反射斜面的基底和具有设置有特定角度的倾斜平面的微透镜阵列板。从光电子器件阵列发射的光信号由反射斜面反射并以特定角度入射到微透镜阵列板的倾斜平面中。倾斜平面将光信号整流以在水平方向上输出。然后，光信号通过微透镜阵列的每个微透镜与外部光纤耦合。接收光信号的路径与上述相同，但是相反。

23. 发明授权

US08472646B2 Structure and manufacturing method of inversed microphone module and microphone chip component 有权
标题翻译：反相麦克风模块和麦克风芯片组件的结构和制造方法
公开(公告)号：US08472646B2
公开(公告)日：2013-06-25
申请号：US11690842
申请日：2007-03-25
申请人： Jung-Tai Chen , Chun-Hsun Chu
发明人： Jung-Tai Chen , Chun-Hsun Chu
IPC分类号： H04R25/00
CPC分类号： H04R19/005 , B81B7/0061 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/10155 , H01L2924/15151 , H01L2924/16151 , H01L2924/16195 , H04R1/2819 , H04R19/04 , H04R31/006 , H04R2201/003 , H04R2499/11 , H01L2924/00014
摘要： An inversed microphone module is provided. The module includes a substrate, a microphone chip, a back acoustic cavity cover, and a sealing material. The substrate has a plurality of connection pads and an acoustic hole. The microphone chip has a first surface and an opposite second surface. A plurality of electrically bonding portions and an acoustic sensing are disposed on the first surface. The microphone chip is electrically coupled to the connection pads of the substrate through the electrically bonding portions, and the acoustic hole corresponds to the acoustic sensing portion. The back acoustic cavity cover is fixed to the second surface and defines a back acoustic cavity with the acoustic sensing portion and the microphone chip. The sealing material encapsulates the microphone chip and covers the substrate, so that the sealing material, the substrate, the acoustic sensing portion, and the first surface define a front acoustic cavity.
摘要翻译：提供反向麦克风模块。该模块包括基底，麦克风芯片，背部声腔盖和密封材料。基板具有多个连接垫和声孔。麦克风芯片具有第一表面和相对的第二表面。多个电接合部分和声学感测设置在第一表面上。麦克风芯片通过电接合部分电耦合到基板的连接焊盘，并且声孔对应于声感测部分。背部声腔盖被固定到第二表面并且限定具有声学感测部分和麦克风芯片的反向声腔。密封材料封装麦克风芯片并覆盖基板，使得密封材料，基板，声学感测部分和第一表面限定前声学腔。

24. 发明申请

US20100283791A1 DISPLAY CARD AND DISPLAY CARD OPERATING METHOD 有权
标题翻译：显示卡和显示卡操作方法
公开(公告)号：US20100283791A1
公开(公告)日：2010-11-11
申请号：US12775502
申请日：2010-05-07
申请人： Pei-Jung Lin , Jung-Tai Chen
发明人： Pei-Jung Lin , Jung-Tai Chen
IPC分类号： G06T15/00
CPC分类号： G06F1/26 , G06T2200/28
摘要： The display card determines whether the first power voltage and the second power voltage supplied by the power supply are within inconsistent input timings, and ensure the third power voltage can be generated accurately to the graphics processing unit to work normally. Therefore, even when the display card cooperates with power supplies having different standards, the graphics processing unit is avoided from malfunctioning or being operated imprecisely by inconsistent timings of input power sources in reaching the display card.
摘要翻译：显示卡确定由电源提供的第一电源电压和第二电源电压是否在不一致的输入定时内，并且确保能够精确地生成第三电源电压到图形处理单元正常工作。因此，即使显示卡与具有不同标准的电源协同工作，也可避免图形处理单元由于输入电源在到达显示卡时的时序不一致而发生故障或不正确的操作。

25. 发明申请

US20100191986A1 MULTI-PHASE VOLTAGE REGULATOR MODULE SYSTEM 有权
标题翻译：多相电压调节器模块系统
公开(公告)号：US20100191986A1
公开(公告)日：2010-07-29
申请号：US12652072
申请日：2010-01-05
申请人： SHENG-CHIEH SU , Jung-Tai Chen
发明人： SHENG-CHIEH SU , Jung-Tai Chen
IPC分类号： G06F1/00
CPC分类号： G06F1/26 , H02M3/1584
摘要： A multi-phase voltage regulator module system includes a VRM and a phase control circuit. The VRM is capable of outputting a load detecting voltage which is direct proportion to the load of the CPU. The phase control circuit outputs a first level phase switching signal to the VRM, and a core voltage outputted by the VRM to the CPU is changed from N phases to M phases when the load detecting voltage increases to a first voltage. The phase control circuit a second level phase switching signal to the VRM, and the core voltage outputted by the VRM to the CPU from M phases to N phases when the load detecting voltage decreases to a second voltage. The first voltage is higher than the second voltage. M is larger than N.
摘要翻译：多相电压调节器模块系统包括VRM和相位控制电路。 VRM能够输出与CPU的负载成正比的负载检测电压。相位控制电路向VRM输出第一电平相位切换信号，并且当负载检测电压增加到第一电压时，由VRM输出到CPU的核心电压从N相变为M相。当负载检测电压降低到第二电压时，相位控制电路将VRM的第二电平相位切换信号和由VRM输出到CPU的M电压的核心电压从M相输出到N相。第一电压高于第二电压。 M大于N.

26. 发明申请

US20080083960A1 PACKAGE STRUCTURE AND PACKAGING METHOD OF MEMS MICROPHONE 有权
标题翻译： MEMS麦克风的包装结构和包装方法
公开(公告)号：US20080083960A1
公开(公告)日：2008-04-10
申请号：US11759940
申请日：2007-06-08
申请人： Jung-Tai Chen , Chun-Hsun Chu
发明人： Jung-Tai Chen , Chun-Hsun Chu
IPC分类号： H01L29/84 , H01L21/56
CPC分类号： H04R1/04 , H01L24/97 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A package structure of a micro-electromechanical system (MEMS) type microphone is disclosed. The MEMS microphone comprises a substrate, a MEMS chip, an acoustic wave cover, and an encapsulant. The substrate has connection pads. The MEMS chip is electrically coupled to the connection pads. The MEMS chip includes an acoustic wave sensing portion. The acoustic wave cover is fixed on the MEMS chip for covering without contacting the acoustic wave sensing portion and defining an acoustic wave cavity space. The acoustic wave cover has an opening for allowing an acoustic wave to enter or exit out of the acoustic cavity space. The encapsulant encapsulates the substrate, the MEMS chip, and the acoustic wave cover, wherein a surface of the acoustic wave cover is exposed. The exposed surface of the acoustic wave cover is along the same level as the surface of the encapsulant.
摘要翻译：公开了一种微机电系统（MEMS）型麦克风的封装结构。 MEMS麦克风包括基板，MEMS芯片，声波盖和密封剂。衬底具有连接焊盘。 MEMS芯片电耦合到连接焊盘。 MEMS芯片包括声波感测部分。声波罩固定在MEMS芯片上用于覆盖而不接触声波感测部分并且限定声波腔空间。声波罩具有用于允许声波进入或离开声腔空间的开口。密封剂封装衬底，MEMS芯片和声波罩，其中声波罩的表面被暴露。声波罩的暴露表面与密封剂表面的水平相同。

27. 发明申请

US20100162010A1 SWITCHING POWER CIRCUIT AND COMPUTER SYSTEM 有权
标题翻译：切换电源电路和计算机系统
公开(公告)号：US20100162010A1
公开(公告)日：2010-06-24
申请号：US12631053
申请日：2009-12-04
申请人： SHENG-CHIEH SU , JUNG-TAI CHEN
发明人： SHENG-CHIEH SU , JUNG-TAI CHEN
IPC分类号： G06F1/26
CPC分类号： H02M1/34 , H02M3/156 , H02M2001/346 , Y02B70/1491
摘要： The invention relates to a switching power circuit connected to a motherboard of a computer system. The switching power circuit includes a PWM circuit and a snubber circuit. The PWM circuit includes a phase terminal, and it may output an output voltage to the motherboard via the phase terminal. The snubber circuit includes a zener diode. A negative terminal of the zener diode is connected to the phase terminal, and a positive terminal is connected to the ground terminal. The level of a breakdown voltage of the zener diode is equal to the level of the output voltage in a steady state.
摘要翻译：本发明涉及连接到计算机系统的主板的开关电源电路。开关电源电路包括PWM电路和缓冲电路。 PWM电路包括相位端子，并且可以经由相位端子将输出电压输出到母板。缓冲电路包括齐纳二极管。齐纳二极管的负端子连接到相位端子，正极端子连接到接地端子。齐纳二极管的击穿电压的电平等于稳定状态下输出电压的电平。

28. 发明申请

US20090014847A1 INTEGRATED CIRCUIT PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE 审中-公开
标题翻译：集成电路封装结构与电磁干扰屏蔽结构
公开(公告)号：US20090014847A1
公开(公告)日：2009-01-15
申请号：US11968982
申请日：2008-01-03
申请人： Jung-Tai Chen , Chun-Hsun Chu , Wood-Hi Cheng
发明人： Jung-Tai Chen , Chun-Hsun Chu , Wood-Hi Cheng
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L23/3121 , H01L23/3135 , H01L24/48 , H01L25/16 , H01L2224/16 , H01L2224/48227 , H01L2224/8592 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit (IC) package structure with an electromagnetic interference (EMI) shielding structure utilizes double-layer successive cladding process. A dielectric coating layer and an EMI shielding layer material are sequentially coated on surface of a carrying substrate, an IC on the carrying substrate, and all the other devices. The EMI shielding layer is closely adhered to and bonded on a ground metal area exposed on an upper surface of the carrying substrate, the EMI shielding layer on the package is connected to a ground plane under the carrying substrate in series, so as to form a protection cover having a closed EMI shielding space to isolate the interference of electromagnetic waves from outside.
摘要翻译：具有电磁干扰（EMI）屏蔽结构的集成电路（IC）封装结构采用双层连续包层工艺。电介质涂层和EMI屏蔽层材料依次涂覆在承载基板的表面，载体基板上的IC以及所有其它装置上。 EMI屏蔽层紧密地粘接在暴露在承载基板的上表面上的接地金属区域上，封装上的EMI屏蔽层与承载基板下的接地平面连接，形成一个保护盖具有闭合的EMI屏蔽空间，以隔离电磁波与外部的干扰。

29. 发明申请

US20080315433A1 SELF-ALIGNED WAFER OR CHIP STRUCTURE, SELF-ALIGNED STACKED STRUCTURE AND METHODS FOR FABIRCATING THE SAME 有权
标题翻译：自对准的波形或芯片结构，自对准的堆叠结构及其制作方法
公开(公告)号：US20080315433A1
公开(公告)日：2008-12-25
申请号：US11946814
申请日：2007-11-28
申请人： Jung-Tai Chen , Tzong-Che Ho , Chun-Hsun Chu
发明人： Jung-Tai Chen , Tzong-Che Ho , Chun-Hsun Chu
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L21/76898 , H01L23/481 , H01L23/66 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/02311 , H01L2224/02313 , H01L2224/0401 , H01L2224/05025 , H01L2224/05147 , H01L2224/0557 , H01L2224/05647 , H01L2224/13025 , H01L2224/13099 , H01L2224/16146 , H01L2224/16147 , H01L2224/2518 , H01L2224/81136 , H01L2224/81801 , H01L2225/0652 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/30107 , H01L2224/05552
摘要： A self-aligned wafer or chip structure including a substrate, at least one first concave base, at least one second concave base, at least one connecting structure and at least one bump is provided. The substrate has a first surface and a second surface, and at least one pad is formed on the first surface. The first concave base is disposed on the first surface and electrically connected to the pad. The second concave base is disposed on the second surface. The connecting structure passes through the substrate and disposed between the first and second concave bases so as to be electrically connected to the first and second concave bases. The bump is filled in the second concave base and protrudes out of the second surface.
摘要翻译：提供了包括衬底，至少一个第一凹入基底，至少一个第二凹形基底，至少一个连接结构和至少一个凸块的自对准晶片或芯片结构。衬底具有第一表面和第二表面，并且在第一表面上形成至少一个衬垫。第一凹形基底设置在第一表面上并电连接到垫。第二凹形基底设置在第二表面上。连接结构通过基板并且设置在第一和第二凹形基座之间，以便电连接到第一和第二凹形基部。凸块被填充在第二凹入基底中并突出到第二表面之外。

30. 发明授权

US07352590B2 Eject-lever apparatus for optical transceiver 有权
标题翻译：光收发器弹出杆装置
公开(公告)号：US07352590B2
公开(公告)日：2008-04-01
申请号：US11081496
申请日：2005-03-17
申请人： Zong-Yuan Wu , Wen-Shan Lin , Chia-Ping Wei , Jiun-Shian Yu , Jin-Sheng Chang , Jung-Tai Chen
发明人： Zong-Yuan Wu , Wen-Shan Lin , Chia-Ping Wei , Jiun-Shian Yu , Jin-Sheng Chang , Jung-Tai Chen
IPC分类号： H05K5/00
CPC分类号： G02B6/4246 , G02B6/4284
摘要： The eject-lever apparatus of the present invention is arranged in an optical transceiver having a substrate, where the optical transceiver is being received in a housing having a slot arranged therein with the substrate being plugged into the slot, the apparatus comprising: at least a lever having a cam arranged therein, being disposed at the receiving end of the optic fiber of the optical transceiver; and at least a linkage rod, being deposed on a side of the optical transceiver, wherein the lever is actuated to rotate about an axis from a first location thereof to a second position thereof by exerting a force thereon while driving the cam to rotate accordingly for transmitting the force to an end of the linkage rod enabling the linkage rod to exert a force on the housing so as to generate a reacting force acting on the lever and thus cause the optical transceiver to move out to compress an elastic body and be ejected from the slot gradually; finally, the substrate is totally released from the slot for freeing the optical transceiver from the housing while the lever is in the second position, and thereafter, a resilience force generated by the compressed elastic body enables the returning of the lever from the second position to the first position while the lever is lightly moved.
摘要翻译：本发明的弹射杆装置被布置在具有基板的光收发器中，其中光收发器被接收在具有布置在其中的狭槽的壳体中，其中基板被插入到槽中，该装置包括：至少一个杠杆具有布置在其中的凸轮，设置在光收发器的光纤的接收端; 以及至少一个连接杆，其被放置在光学收发器的一侧上，其中所述杆被致动以通过在其上施加力而围绕轴线从其第一位置旋转到第二位置，同时驱动所述凸轮以相应地旋转，以便将力传递到连杆的端部，使得连杆能够对壳体施加力，以便产生作用在杆上的反作用力，从而使光收发器移出以压缩弹性体并从槽逐渐; 最后，当杠杆处于第二位置时，基板从槽中完全释放，用于将光收发器从壳体释放，此后，由压缩弹性体产生的弹力使得杠杆从第二位置返回到杠杆轻轻移动时的第一个位置。

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