专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20130143088A1 ELECTRODE ASSEMBLY OF NOVEL STRUCTURE AND PROCESS FOR PREPARATION OF THE SAME 有权
标题翻译：新型结构的电极组件及其制备方法
公开(公告)号：US20130143088A1
公开(公告)日：2013-06-06
申请号：US13582250
申请日：2011-03-31
申请人： Jihoon Cho , Dongmyung Kim , Kiwoong Kim , Sung-Min Hwang , Hyun-Chul Jung , Sungjin Kwon , Hyeong Kim , Ki Hong Min
发明人： Jihoon Cho , Dongmyung Kim , Kiwoong Kim , Sung-Min Hwang , Hyun-Chul Jung , Sungjin Kwon , Hyeong Kim , Ki Hong Min
IPC分类号： H01M10/04
CPC分类号： H01M10/0431 , H01M2/021 , H01M2/0212 , H01M2/1653 , H01M2/1686 , H01M2/18 , H01M2/34 , H01M10/0436 , H01M10/0525 , H01M10/058 , Y02E60/122 , Y02P70/54 , Y10T29/49204
摘要： Disclosed herein is an electrode assembly of a cathode/separator/anode structure, wherein a plurality of first unit electrodes and a second electrode sheet are wound so that the first unit electrodes are opposite to the second electrode sheet via a separator sheet, and a first electrode and a second electrode have opposite polarities.
摘要翻译：本文公开了一种阴极/隔板/阳极结构的电极组件，其中缠绕多个第一单元电极和第二电极片，使得第一单元电极经由隔离片与第二电极片相对，并且第一电极和第二电极具有相反的极性。

22. 发明授权

US08331649B2 LED testing apparatus and testing method thereof 有权
标题翻译： LED测试仪器及其测试方法
公开(公告)号：US08331649B2
公开(公告)日：2012-12-11
申请号：US12630448
申请日：2009-12-03
申请人： Won Soo Ji , Wook Hee Lee , Ho Young Song , Chong Wook Cho , Sung Jae Kim , Young Su Yun , Hong Min Kim
发明人： Won Soo Ji , Wook Hee Lee , Ho Young Song , Chong Wook Cho , Sung Jae Kim , Young Su Yun , Hong Min Kim
IPC分类号： G06K9/00
CPC分类号： G06K9/2018 , G01R31/2635 , G01R31/2656 , G06T7/0004 , G06T2207/30148
摘要： There is provided an LED testing apparatus. An LED testing apparatus according to an aspect of the invention may include: a first lighting unit generating first light and irradiating the first light onto an LED having an encapsulant including a fluorescent material excited by the first light to emit light having a longer wavelength than the first light; a second lighting unit generating second light having a longer wavelength than the first light to irradiate the second light onto the LED; an image acquisition unit receiving the light emitted from the fluorescent material and the second light reflected off the LED to acquire images of the LED; and an LED state determination unit determining whether the LED is acceptable or defective using the images of the LED acquired by the image acquisition unit.
摘要翻译：提供了LED测试装置。根据本发明的一个LED测试装置可以包括：第一照明单元，其产生第一光并将第一光照射到具有包含由第一光激发的荧光材料的密封剂的LED上，以发射具有比第第一光; 第二照明单元产生具有比第一光更长的波长的第二光，以将第二光照射到LED上; 接收从荧光材料发射的光和从LED反射的第二光的图像获取单元，以获取LED的图像; 以及LED状态确定单元，使用由图像获取单元获取的LED的图像确定LED是否可接受或有缺陷。

23. 发明申请

US20120304703A1 WASHING MACHINE 有权
标题翻译：洗衣机
公开(公告)号：US20120304703A1
公开(公告)日：2012-12-06
申请号：US13483361
申请日：2012-05-30
申请人： Hyun Mook KIM , Doo Pil Kim , Je Hong Min , Kalo Jin Jun , Yong Jong Park , Jae Ryong Park , Dong Pil Seo , Sang Hyeok Lee , In Cheol Jang , Sang Yeon Pyo , Jung Hee Lee , Ji Hoon Choi , Seung Oh Kim
发明人： Hyun Mook KIM , Doo Pil Kim , Je Hong Min , Kalo Jin Jun , Yong Jong Park , Jae Ryong Park , Dong Pil Seo , Sang Hyeok Lee , In Cheol Jang , Sang Yeon Pyo , Jung Hee Lee , Ji Hoon Choi , Seung Oh Kim
IPC分类号： D06F13/00 , D06F39/08 , D06F37/20 , D06F37/12 , D06F37/30
CPC分类号： D06F23/04
摘要： A washing machine having an improved structure which increases washing capacity without increasing the size of the washing machine. The washing machine includes a cabinet including an outer part and a cylindrical inner part connected to the outer part, a spin basket rotatably disposed in the inner part and including a bottom and a side wall extending from the bottom, a pulsator rotatably disposed in the spin basket, a motor provided under the spin basket, a clutch to selectively transmit power of the motor to the spin basket or the pulsator, a base plate to fix the clutch and the motor, and suspension members connecting the base plate to the upper portion of the cabinet. Wash water is stored within the spin basket and is not stored outside the spin basket during a washing cycle.
摘要翻译：一种具有改进的结构的洗衣机，其在不增加洗衣机的尺寸的情况下增加洗涤能力。洗衣机包括一个外壳和一个与外部连接的圆柱形内部的机壳，一个可旋转地设置在内部的旋转筒，包括底部和从底部延伸的侧壁，一个可旋转地设置在旋转中的波轮设置在旋转筐下的马达，用于选择性地将马达的动力传递到旋转筐或波轮的离合器，用于固定离合器和马达的基板，以及将基板连接到上部的悬挂构件内阁。洗涤水储存在旋转筒内，并且在洗涤循环期间不会储存在旋转筒外部。

24. 发明申请

US20120228780A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120228780A1
公开(公告)日：2012-09-13
申请号：US13422745
申请日：2012-03-16
申请人： Ji Hwang Kim , Kwang-Chul Choi , Sangwon Kim , Tae Hong Min
发明人： Ji Hwang Kim , Kwang-Chul Choi , Sangwon Kim , Tae Hong Min
IPC分类号： H01L23/522
CPC分类号： H01L23/36 , H01L21/563 , H01L21/76898 , H01L23/147 , H01L23/3114 , H01L23/3135 , H01L23/3192 , H01L23/48 , H01L23/481 , H01L23/49816 , H01L23/525 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/80 , H01L24/81 , H01L25/0657 , H01L2224/02379 , H01L2224/0401 , H01L2224/0519 , H01L2224/05548 , H01L2224/05556 , H01L2224/05559 , H01L2224/05567 , H01L2224/0557 , H01L2224/13021 , H01L2224/13022 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06544 , H01L2225/06568 , H01L2225/06589 , H01L2924/00014 , H01L2924/15311 , H01L2924/18161 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： Provided are a semiconductor device including a through via plug and a method of manufacturing the same. In the semiconductor device, since a redistributed interconnection pattern is disposed on a protection film of a convex-concave structure having a protrusion and a recessed portion, the semiconductor device may have improved reliability while preventing a leakage current. In the method of manufacturing the semiconductor device, since an end surface of through via structure is exposed by removing a protection film and an insulating film liner using a selective etching process, damage to the through via structure is minimized, thereby preventing copper contamination in a substrate.
摘要翻译：提供了一种包括贯通插头的半导体器件及其制造方法。在半导体器件中，由于在具有突出部和凹部的凸凹结构体的保护膜上配置重新配置的布线图形，因此能够防止漏电流的可靠性提高。在制造半导体器件的方法中，由于通过使用选择性蚀刻工艺去除保护膜和绝缘膜衬套来暴露通孔结构的端面，所以通孔结构的损坏最小化，从而防止了铜污染基质。

25. 发明申请

US20120171814A1 SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20120171814A1
公开(公告)日：2012-07-05
申请号：US13235372
申请日：2011-09-17
申请人： Eun-Kyoung CHOI , SeYoung JEONG , Kwang-chul CHOI , Tae Hong MIN , Chungsun LEE , Jung-Hwan KIM
发明人： Eun-Kyoung CHOI , SeYoung JEONG , Kwang-chul CHOI , Tae Hong MIN , Chungsun LEE , Jung-Hwan KIM
IPC分类号： H01L21/50 , H01L21/56 , H01L21/78
CPC分类号： H01L24/97 , H01L21/561 , H01L21/6835 , H01L23/3128 , H01L23/36 , H01L23/3672 , H01L23/3677 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06568 , H01L2225/06589 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer.
摘要翻译：提供半导体封装及其制造方法。在一个实施例中，为了制造半导体封装，提供其中制造有半导体芯片的晶片。在晶片上形成散热层。散热层接触半导体芯片的顶表面。此后，从晶片上分离多个半导体芯片。

26. 发明申请

US20120170947A1 APPARATUS AND METHOD FOR RECEIVING LIGHT USING MULTIPLE LIGHT RECEIVING SENSORS 审中-公开
标题翻译：使用多光接收传感器接收光的装置和方法
公开(公告)号：US20120170947A1
公开(公告)日：2012-07-05
申请号：US13225704
申请日：2011-09-06
申请人： Dong Seok KIM , Dae Gak KIM , Eun Hee KIM , So Hyun LEE , Jae Hwan LEE , Hong Min CHOI
发明人： Dong Seok KIM , Dae Gak KIM , Eun Hee KIM , So Hyun LEE , Jae Hwan LEE , Hong Min CHOI
IPC分类号： H04B10/06
CPC分类号： H04B10/116
摘要： In an apparatus and method for receiving light using multiple light receiving sensors, a light receiving apparatus includes a light receiving unit comprising multiple light receiving sensors to receive an optical signal; an analyzing unit to extract a highlighted area; a light receiving controlling unit to activate a first light receiving sensor corresponding to the highlighted area, and to determine the first light receiving sensor to be a part of a first sensor group; and a data processing unit to demodulate an optical signal received by the first sensor group into data. A method for receiving an optical signal including extracting a highlighted area; activating a light receiving sensor corresponding to the highlighted area; receiving light through the first light receiving sensor; grouping the first light receiving sensor into a first sensor group; and demodulating an optical signal received by the first sensor group into data.
摘要翻译：在使用多个光接收传感器接收光的装置和方法中，光接收装置包括光接收单元，该光接收单元包括用于接收光信号的多个光接收传感器; 提取突出显示区域的分析单元; 光接收控制单元，用于激活对应于所述突出显示区域的第一光接收传感器，以及确定所述第一光接收传感器是第一传感器组的一部分; 以及数据处理单元，用于将由第一传感器组接收的光信号解调为数据。一种用于接收光信号的方法，包括提取突出显示的区域; 激活对应于突出显示区域的光接收传感器; 通过第一光接收传感器接收光; 将第一光接收传感器分组成第一传感器组; 以及将由所述第一传感器组接收的光信号解调为数据。

27. 发明申请

US20120139097A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20120139097A1
公开(公告)日：2012-06-07
申请号：US13243806
申请日：2011-09-23
申请人： JEONGGI JIN , Yunhyeok Im , Chungsun Lee , Jung-Hwan Kim , Tae-Hong Min
发明人： JEONGGI JIN , Yunhyeok Im , Chungsun Lee , Jung-Hwan Kim , Tae-Hong Min
IPC分类号： H01L23/42 , H01L23/02
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/563 , H01L21/565 , H01L23/3135 , H01L23/3142 , H01L23/42 , H01L23/4334 , H01L23/481 , H01L23/49827 , H01L23/552 , H01L24/05 , H01L24/16 , H01L24/29 , H01L24/30 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2221/6834 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/30519 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/00014 , H01L2924/14 , H01L2924/1435 , H01L2924/15311 , H01L2924/00 , H01L2224/05552
摘要： Provided are a semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package may include a circuit substrate, a semiconductor chip mounted on the circuit substrate, a chip package interaction disposed between the circuit substrate and the semiconductor chip, a first molding portion covering part of the semiconductor chip and part of the chip package interaction, a second molding portion formed on the first molding portion, and an adhesion portion adhering the first and second molding portions to each other, the adhesion portion being disposed between the first and second molding portions.
摘要翻译：提供半导体封装和制造半导体封装的方法。半导体封装可以包括电路基板，安装在电路基板上的半导体芯片，设置在电路基板和半导体芯片之间的芯片封装相互作用，覆盖半导体芯片的一部分的第一模制部分和芯片封装相互作用的一部分，形成在第一模制部分上的第二模制部分和将第一模制部分和第二模制部分彼此粘合的粘合部分，粘合部分设置在第一和第二模制部分之间。

28. 发明授权

US08185701B2 System and method for an adaptive list prefetch 失效
标题翻译：用于自适应列表预取的系统和方法
公开(公告)号：US08185701B2
公开(公告)日：2012-05-22
申请号：US12025801
申请日：2008-02-05
申请人： Jeffrey A. Berger , You-Chin Fuh , Yue Huang , Hong Min , Terence P. Purcell , Kou-Horng A. Yang
发明人： Jeffrey A. Berger , You-Chin Fuh , Yue Huang , Hong Min , Terence P. Purcell , Kou-Horng A. Yang
IPC分类号： G06F13/00 , G06F13/28
CPC分类号： G06F17/30442
摘要： A method, system, and computer program product are provided for retrieving records into a main memory. A first number of gaps and a first total gap size are received for a list of records from a database subsystem. A determination is made of a first average gap size using the first number of gaps and the first total gap size. A determination is made as to whether the first average gap size is greater than a prestaging threshold value. Responsive to the first average gap size being equal to or less than the prestaging threshold value, a prestaging flag is set for the list of records. Then, the list of records is retrieved into the main memory using prestaging.
摘要翻译：提供了一种用于将记录检索到主存储器中的方法，系统和计算机程序产品。从数据库子系统收到记录的第一个数量和第一个总间隙大小。使用第一数量的间隙和第一总间隙尺寸确定第一平均间隙尺寸。确定第一平均间隙大小是否大于预定阈值。响应于第一平均间隙尺寸等于或小于预定阈值，为记录列表设置预置标记。然后，使用前置记录将记录列表检索到主存储器中。

29. 发明申请

US20120083097A1 Methods of Forming a Semiconductor Package Using a Seed Layer and Semiconductor Packages Formed Using the Same 有权
标题翻译：使用种子层形成半导体封装的方法和使用其形成的半导体封装
公开(公告)号：US20120083097A1
公开(公告)日：2012-04-05
申请号：US13187760
申请日：2011-07-21
申请人： Ju-il Choi , Kyu-Ha Lee , Jae-Hyun Phee , Jung-Hwan Kim , Tae Hong Min
发明人： Ju-il Choi , Kyu-Ha Lee , Jae-Hyun Phee , Jung-Hwan Kim , Tae Hong Min
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , H01L21/486 , H01L21/6836 , H01L21/76898 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2221/68331 , H01L2221/68345 , H01L2224/02372 , H01L2224/1146 , H01L2224/116 , H01L2224/13023 , H01L2224/13082 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16235 , H01L2224/2919 , H01L2224/73204 , H01L2224/81191 , H01L2224/81903 , H01L2224/83192 , H01L2224/8385 , H01L2224/9202 , H01L2224/9211 , H01L2224/94 , H01L2924/00013 , H01L2224/81 , H01L2224/05124 , H01L2924/00014 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2224/05599
摘要： Provided is a method of forming a semiconductor package including providing a substrate having a first side and an opposite second side and providing a wafer having a plurality of semiconductor chips, each of the semiconductor chips having a conductive pad, wherein at least one of the substrate and the wafer includes a seed pattern. The first side of the substrate is bonded to the wafer with the conductive pad positioned adjacent to the first side of the substrate and the seed pattern positioned between the conductive pad and the first side of the substrate. A through hole is then formed penetrating the substrate from the second side of the substrate to expose the seed pattern. A through electrode is formed in the through hole using the seed pattern as a seed. Corresponding devices are also provided.
摘要翻译：提供一种形成半导体封装的方法，包括提供具有第一侧和相对的第二侧的衬底，并提供具有多个半导体芯片的晶片，每个半导体芯片具有导电焊盘，其中至少一个衬底并且晶片包括种子图案。衬底的第一面被接合到晶片，其中导电焊盘定位成与衬底的第一侧相邻，并且种子图案位于导电焊盘和衬底的第一侧之间。然后从衬底的第二侧穿透衬底以形成通孔以暴露种子图案。使用种子图案作为种子在通孔中形成贯通电极。还提供了相应的设备。

30. 发明申请

US20120038123A1 Hand truck with adjustable wheel assembly 失效
标题翻译：带可调轮组件的手推车
公开(公告)号：US20120038123A1
公开(公告)日：2012-02-16
申请号：US12806421
申请日：2010-08-11
申请人： Hong Min Li
发明人： Hong Min Li
IPC分类号： B62B1/04
CPC分类号： B62B1/12 , B62B5/0086 , B62B2301/02
摘要： A hand truck includes a frame body and a wheel assembly including two wheel units spacedly supported at the frame body to switch between a first operation position and a second operation position for enabling the frame body to be tilted backward to transport a load. At the first operation position, the wheel units are switched in parallel for enabling the frame body to move at a back-and-forth direction, and at the second operation position, the wheel units are switched to align with each other for enabling the frame body to move at a left-and-right direction. Therefore, the hand truck provides two modes of movement for a two-dimensional movement.
摘要翻译：手推车包括框架体和车轮组件，其包括两个轮单元，两个轮单元间隔地支撑在框架体上，以在第一操作位置和第二操作位置之间切换，以使框架体能够向后倾斜以输送负载。在第一操作位置，车轮单元被平行切换以使框架体能够在前后方向上移动，并且在第二操作位置，车轮单元被切换成彼此对准以使框架身体在左右方向移动。因此，手推车为二维运动提供两种运动模式。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式