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21. 发明授权

US5528203A Coplanar waveguide-mounted flip chip 失效
标题翻译：共面波导安装的倒装芯片
公开(公告)号：US5528203A
公开(公告)日：1996-06-18
申请号：US478375
申请日：1995-06-07
申请人： Clifford A. Mohwinkel , Edwin F. Johnson , Edward B. Stoneham
发明人： Clifford A. Mohwinkel , Edwin F. Johnson , Edward B. Stoneham
IPC分类号： H01P5/08 , H01P5/12 , H03F3/60
CPC分类号： H03F3/604 , H01L2223/6644 , H03F2200/372
摘要： A radio-frequency power amplifier includes a multiple-FET chip that is flip mounted on a connection region of a substrate. An input impedance-matching network is also mounted on the substrate. The network includes a coplanar waveguide having an elongate waveguide signal conductor for each gate terminal on the FET chip with a distal end spaced from the connection region and a proximal end in the connection region. The distal ends are connected to a single base input conductor. The proximal ends are flip mounted to respective ones of gate terminals of the FET chip. A capacitor couples each of the input signal conductor distal ends to an adjacent ground conductor. The signal conductors and capacitors provide a selected impedance at a selected frequency. The capacitors may be on a separate chip flip mounted to the waveguide signal and ground conductors, and may be formed as coplanar waveguides with open-ended signal conductors. An output coplanar waveguide includes, for each drain terminal, an output signal conductor having an end in the connection region that is electrically connected to the flip mounted FET chip. This waveguide also has a length selected to provide desired impedance matching and may also have other means of impedance matching.
摘要翻译：射频功率放大器包括翻转安装在基板的连接区域上的多FET芯片。输入阻抗匹配网络也安装在基板上。网络包括共面波导，其具有用于FET芯片上的每个栅极端子的细长波导信号导体，其远端与连接区域间隔开，远端在连接区域中。远端连接到单个基本输入导体。近端被翻转安装到FET芯片的相应栅极端子。电容器将每个输入信号导体远端连接到相邻的接地导体。信号导体和电容器以选定的频率提供选定的阻抗。电容器可以在安装到波导信号和接地导体的单独的芯片上，并且可以形成为具有开放式信号导体的共面波导。输出共面波导包括针对每个漏极端子的输出信号导体，该输出信号导体在连接区域中具有电连接到翻盖式FET芯片的端部。该波导还具有选择的长度以提供期望的阻抗匹配，并且还可以具有阻抗匹配的其它手段。

22. 发明授权

US07348666B2 Chip-to-chip trench circuit structure 有权
标题翻译：芯片到芯片沟槽电路结构
公开(公告)号：US07348666B2
公开(公告)日：2008-03-25
申请号：US10883356
申请日：2004-06-30
申请人： Edward B. Stoneham , Thomas M. Gaudette
发明人： Edward B. Stoneham , Thomas M. Gaudette
IPC分类号： H01L23/34 , H01L23/48 , H01L23/52 , H01L23/12
CPC分类号： H01L24/32 , H01L23/13 , H01L24/48 , H01L24/83 , H01L25/0655 , H01L2224/05554 , H01L2224/27013 , H01L2224/45014 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/83051 , H01L2224/8385 , H01L2924/00014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1423 , H01L2924/1433 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/45015 , H01L2924/207
摘要： A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the trench, and optionally, may divide the trench into sections. A conductive adhesive layer may be applied to the substrate face and, if included, the bridge. One or more circuit chips may be mounted on the adhesive layer, with at least one edge of one circuit chip adjacent to the trench. Alternatively or additionally, an adhesive layer may be applied to a base of a chip and then mounted to the substrate face, in like fashion. The trench may accommodate excess adhesive flowing out from under the one or more chips, while the bridge retains the adhesive across the width of the trench. If the adhesive is conductive, this provides continuity of the conductive layer on the face of the substrate across the trench. In one example, pairs of circuit chips may be effectively mounted in adjacent relationship for interconnection without interference from excess adhesive.
摘要翻译：电路结构可以形成在具有面和开放沟槽的衬底中，其中将安装一个或多个芯片。至少一个桥可以延伸穿过沟槽的中间部分，并且可选地，可以将沟槽划分成多个部分。可以将导电粘合剂层施加到基板表面，如果包括桥，则应用导电粘合剂层。一个或多个电路芯片可以安装在粘合剂层上，其中一个电路芯片的至少一个边缘与沟槽相邻。或者或另外，粘合剂层可以施加到芯片的基部，然后以类似的方式安装到基板面。沟槽可以容纳从一个或多个芯片下面流出的多余的粘合剂，同时桥将粘合剂保持在沟槽的宽度上。如果粘合剂是导电的，则这提供了穿过沟槽的衬底的表面上的导电层的连续性。在一个示例中，电路芯片对可以有效地安装在相邻的关系中用于互连，而不会受到多余粘合剂的干扰。

23. 发明授权

US5668512A Coplanar waveguide-mounted flip chip having coupled ground conductors 失效
标题翻译：具有耦合接地导体的共面波导安装的倒装芯片
公开(公告)号：US5668512A
公开(公告)日：1997-09-16
申请号：US662693
申请日：1996-06-12
申请人： Clifford A. Mohwinkel , Edwin F. Johnson , Edward B. Stoneham
发明人： Clifford A. Mohwinkel , Edwin F. Johnson , Edward B. Stoneham
IPC分类号： H01P5/08 , H01P5/12 , H03F3/60 , H01P5/00
CPC分类号： H03F3/604 , H01L2223/6644 , H03F2200/372
摘要： A radio-frequency power amplifier includes a multiple-FET chip that is flip mounted on a connection region of a substrate. An input impedance-matching network is also mounted on the substrate. The network includes a coplanar waveguide having an elongate waveguide signal conductor for each gate terminal on the FET chip with a distal end spaced from the connection region and a proximal end in the connection region. The distal ends are connected to a single base input conductor. The proximal ends are flip mounted to respective ones of gate terminals of the FET chip. A capacitor couples each of the input signal conductor distal ends to an adjacent ground conductor. The signal conductors and capacitors provide a selected impedance at a selected frequency. The capacitors may be on a separate chip flip mounted to the waveguide signal and ground conductors, and may be formed as coplanar waveguides with open-ended signal conductors. An output coplanar waveguide includes, for each drain terminal, an output signal conductor having an end in the connection region that is electrically connected to the flip mounted FET chip. This waveguide also has a length selected to provide desired impedance matching and may also have other means of impedance matching. The ground conductors of each coplanar waveguide are coupled together in the connection region.
摘要翻译：射频功率放大器包括翻转安装在基板的连接区域上的多FET芯片。输入阻抗匹配网络也安装在基板上。网络包括共面波导，其具有用于FET芯片上的每个栅极端子的细长波导信号导体，其远端与连接区域间隔开，远端在连接区域中。远端连接到单个基本输入导体。近端被翻转安装到FET芯片的相应栅极端子。电容器将每个输入信号导体远端连接到相邻的接地导体。信号导体和电容器以选定的频率提供选定的阻抗。电容器可以在安装到波导信号和接地导体的单独的芯片上，并且可以形成为具有开放式信号导体的共面波导。输出共面波导包括针对每个漏极端子的输出信号导体，该输出信号导体在连接区域中具有电连接到翻盖式FET芯片的端部。该波导还具有选择的长度以提供期望的阻抗匹配，并且还可以具有阻抗匹配的其它手段。每个共面波导的接地导体在连接区域中耦合在一起。

24. 发明授权

US5301081A Input protection circuit 失效
标题翻译：输入保护电路
公开(公告)号：US5301081A
公开(公告)日：1994-04-05
申请号：US915348
申请日：1992-07-16
申请人： Allen F. Podell , Edward B. Stoneham
发明人： Allen F. Podell , Edward B. Stoneham
IPC分类号： H01Q1/50 , H02H9/00 , H02H3/20 , H02H9/04
CPC分类号： H01Q1/50
摘要： A depletion-mode MESFET is connected between an RF input terminal and ground. The gate is connected to a negative reference voltage via a bias resistor and to ground via a capacitor. A detector couples the input terminal to the gate and includes first and second series diodes and a second resistor connected from between the first and second diodes to ground. A coil is connected between the input terminal and an output terminal connected to a GaAs integrated circuit. A Schottky diode limiter is connected to the output terminal for limiting the voltage of both positive and negative polarities that leak to the output terminal from the transistor.
摘要翻译：耗尽型MESFET连接在RF输入端和地之间。栅极通过偏置电阻连接到负参考电压，并通过电容接地。检测器将输入端子耦合到栅极并且包括第一和第二串联二极管以及从第一和第二二极管之间连接到地的第二电阻器。线圈连接在输入端子和连接到GaAs集成电路的输出端子之间。肖特基二极管限制器连接到输出端子，用于限制从晶体管泄漏到输出端子的正极性和负极性的电压。

25. 发明授权

US4972250A Protective coating useful as passivation layer for semiconductor devices 失效
标题翻译：保护涂层可用作半导体器件的钝化层
公开(公告)号：US4972250A
公开(公告)日：1990-11-20
申请号：US20920
申请日：1987-03-02
申请人： Masahiro Omori , Edward B. Stoneham
发明人： Masahiro Omori , Edward B. Stoneham
IPC分类号： H01L21/314 , H01L23/29 , H01L23/31
CPC分类号： H01L23/298 , H01L23/3171 , H01L23/3192 , H01L2924/0002 , H01L2924/19041
摘要： A protective coating useful as a passivation layer for semiconductor devices incorporates a thin film of an amorphous diamond-like carbon. In one implementation, a thin film of amorphous silicon is deposited over the carbon material. The semiconductive passivation coating eliminates electrical shorts, dissipates charge build-up and protects against chemical contamination.

26. 发明授权

US4308012A Dental pulp vitality tester 失效
标题翻译：牙髓活力测试仪
公开(公告)号：US4308012A
公开(公告)日：1981-12-29
申请号：US114037
申请日：1980-01-21
申请人： Richard Tamler , Edward B. Stoneham
发明人： Richard Tamler , Edward B. Stoneham
IPC分类号： A61B5/053 , A61C19/04 , G05D23/24
CPC分类号： A61C19/04 , A61B5/0534 , G05D23/1919 , G05D23/24
摘要： A dental pulp vitality tester for selectively applying heat, cold, or electrical stimulation to a patient's tooth in a controlled reproducible manner. Broadly, the device includes a handle having a thermally and electrically conductive probe tip, a heat sink within the handle, and a thermoelectric element having a first junction thermally coupled to the probe tip and a second junction thermally coupled to the heat sink. Heating or cooling of the probe tip is accomplished by passage of electric current through the thermoelectric element. A temperature sensing device such as a thermistor is thermally coupled to the probe tip, and temperature regulation circuitry responsive to the state of the temperature sensing element regulates the current to the thermoelectric element to maintain the temperature of the probe tip constant at a predetermined desired value. The present invention includes circuitry for quantifying the stimulus applied. In particular, circuitry is provided for sensing electrical contact with the tooth, which electrical contact is strongly correlated with thermal contact. Additionally, timing circuitry measures and displays the length of time that the probe tip has been in contact with the tooth so that the precise time at which a patient response occurs may be used to render the diagnosis quantitative. Electrical stimulation is provided by regulating the current that is passed through the probe tip into the tooth rather than the voltage that is applied to the probe tip. This current is applied in pulses, and the amplitude of the current pulses is gradually increased from a minimum value in an automatic fashion so that the patient's sensitivity may be determined. Electrical contact with the tooth is monitored as with the thermal testing.
摘要翻译：一种牙髓活力测试仪，用于以受控的可重复的方式选择性地对患者的牙齿施加热，冷或电刺激。广泛地，该装置包括具有导热和导电的探针尖端的手柄，手柄内的散热器，以及具有热耦合到探针尖端的第一接头的热电元件和热耦合到散热器的第二接头。通过电流通过热电元件来实现探针尖端的加热或冷却。诸如热敏电阻的温度感测装置热耦合到探针尖端，并且响应于温度感测元件的状态的温度调节电路调节到热电元件的电流，以将探针末端的温度保持在预定的期望值。本发明包括用于量化所施加的刺激的电路。特别地，提供用于感测与牙齿的电接触的电路，该电接触与热接触强烈相关。此外，定时电路测量和显示探针尖端已经与牙齿接触的时间长度，使得可以使用发生患者反应的精确时间来定量诊断诊断。通过将通过探针尖端的电流调节到牙齿而不是施加到探针尖端的电压来提供电刺激。该电流以脉冲方式施加，并且电流脉冲的幅度以自动方式从最小值逐渐增加，从而可以确定患者的灵敏度。与热测试一起监测与牙齿的电接触。

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