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    • 30. 发明授权
    • Processing method
    • US12030157B2
    • 2024-07-09
    • US17658036
    • 2022-04-05
    • DISCO CORPORATION
    • Yoshikazu Suzuki
    • B24B37/04
    • B24B37/042
    • A workpiece surface is polished by a polishing pad surface by keeping a point on an outer circumferential edge of the workpiece surface at predetermined coordinates, i.e., first coordinates, in a plane parallel to the workpiece surface but out of contact with the polishing pad surface, and keeping a point on the outer circumferential edge of the polishing pad surface at other coordinates, i.e., third coordinates, in the coordinate plane in contact with an outer circumferential edge of the workpiece surface. In this manner, the workpiece surface is polished in its entirety, and a region of the polishing pad surface in the vicinity of the outer circumferential edge thereof can be worn to the same degree as a region that is located inwardly of the above region. The polishing pad surface is thus prevented from developing a stepped profile due to the polishing of the workpiece surface.