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    • 11. 发明授权
    • Relief printing plate precursor for laser engraving, process for making relief printing plate, and relief printing plate
    • 用于激光雕刻的浮雕印版前体,凸版印刷版印刷版和凸版印刷版
    • US08557503B2
    • 2013-10-15
    • US13105542
    • 2011-05-11
    • Takashi Kawashima
    • Takashi Kawashima
    • C08K5/24G03C1/00B05D3/06
    • B41C1/05B41N1/12G03F7/0755G03F7/2055Y10T428/24479Y10T428/24802
    • A relief printing plate precursor for laser engraving is provided that includes above a support, as a crosslinked relief-forming layer, a thermally crosslinked layer of a resin composition for laser engraving that includes (Component A) a compound containing a hydrolyzable silyl group and/or a silanol group and that does not include (Component B) a binder polymer or includes it at less than 2 wt % relative to the total weight on a non-volatile component basis. There are also provided a process for making a relief printing plate that includes a step of preparing the relief printing plate precursor for laser engraving and a step of forming a relief layer by laser-engraving the crosslinked relief-forming layer, and a relief printing plate that includes a relief layer formed by the process for making a relief printing plate.
    • 提供了一种用于激光雕刻的浮雕印版前体,其包括作为交联凸版形成层的支撑体上方的用于激光雕刻的树脂组合物的热交联层,所述热交联层包含(组分A)含有可水解甲硅烷基的化合物和/ 或硅烷醇基团,并且不包括(组分B)粘合剂聚合物,或者在非挥发性组分的基础上,相对于总重量小于2重量%。 还提供了一种制造凸版印刷版的方法,包括制备用于激光雕刻的凸版印刷版前体的步骤和通过激光雕刻交联凸版形成层形成浮雕层的步骤和凸版​​印刷版 其包括通过用于制造凸版印刷版的方法形成的浮雕层。
    • 20. 发明授权
    • Latent hardener, process for producing the same, and adhesive containing latent hardener
    • 潜在硬化剂,其制造方法和含有潜在硬化剂的粘合剂
    • US08044117B2
    • 2011-10-25
    • US12703104
    • 2010-02-09
    • Takayuki MatsushimaMasao Saito
    • Takayuki MatsushimaMasao Saito
    • C08K9/06C08K5/24B32B9/00B29C65/00
    • C09J163/00C08G59/18C08G59/188C08G59/682C08G59/70C08J3/241Y10T156/10Y10T428/2998
    • A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.
    • 本发明的潜在性固化剂(30)包括芯部件(31)和覆盖在芯部件(31)的表面上的胶囊(37)。 芯构件(31)包括保留在二次颗粒(32)的间隙(38)中的二次颗粒(32)和固化剂(35)。 固化剂(35)在环境温度下为液体。 当胶囊(37)被破坏使得固化剂(35)被发射到粘合剂中时,固化剂(35)与粘合剂中的其它成分混合。 在环境温度下为液体的金属醇化物或在环境温度下为液体的金属螯合物用作固化剂(35),同时将硅烷偶联剂加入到粘合剂中。 在固化剂(35)和硅烷偶联剂之间发生反应以产生阳离子。 通过这些阳离子,环氧树脂在聚合中经历阳离子。 由于阳离子产生反应在比常规粘合剂的情况下低的温度下进行,所以在常规粘合剂的情况下,固化进行得更快且温度更低。