专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US11172549B2 High-productivity hybrid induction heating/welding assembly 有权
公开(公告)号：US11172549B2
公开(公告)日：2021-11-09
申请号：US14879727
申请日：2015-10-09
申请人： ILLINOIS TOOL WORKS INC.
发明人： Jerald Edward Jones , Valerie Lisa Rhoades , Todd Earl Holverson , Adam Nathan Cuneo , Mark Dietrich Mann
IPC分类号： H05B11/00 , B23K13/01 , B23K9/02 , B23K28/00 , B23K28/02 , B23K31/00 , B23K9/095 , B23K9/235 , B23K10/00 , B23K9/173 , B23K3/047 , B23K9/12 , B23K9/16 , B23K9/32 , B23K37/00 , B23K37/02 , B23K13/02
摘要： In certain embodiments, inductive heating is added to a metal working process, such as a welding process, by an induction heating head. The induction heating head may be adapted specifically for this purpose, and may include one or more coils to direct and place the inductive energy, protective structures, and so forth. Productivity of a welding process may be improved by the application of heat from the induction heating head. The heating is in addition to heat from a welding arc, and may facilitate application of welding wire electrode materials into narrow grooves and gaps, as well as make the processes more amenable to the use of certain compositions of welding wire, shielding gasses, flux materials, and so forth. In addition, distortion and stresses are reduced by the application of the induction heating energy in addition to the welding arc source.

12. 发明申请

US20210176867A1 REFLOW OVEN 有权
公开(公告)号：US20210176867A1
公开(公告)日：2021-06-10
申请号：US17115426
申请日：2020-12-08
申请人： ILLINOIS TOOL WORKS INC.
发明人： Yuexin CHEN , Dong ZHANG
IPC分类号： H05K3/34 , F27B9/40 , B23K1/008 , B23K3/047
摘要： The present disclosure discloses a reflow oven for processing a circuit board, the reflow oven comprising a heating zone, a plurality of heating devices and a start-stop device. The heating zone comprises a plurality of heating sub-zones, the plurality of heating devices are arranged in corresponding heating sub-zones of the plurality of heating sub-zones, and each of the plurality of heating devices is configured such that a working temperature of the corresponding heating sub-zone is in a predetermined temperature interval. The start-stop device is configured to activate or deactivate the plurality of heating devices, and the start-stop device is configured in such a way that the start-stop device activates or deactivates the plurality of heating devices according to predetermined time intervals in a process during which the circuit board sequentially passes through the plurality of heating sub-zones, such that a working temperature of each of the plurality of heating sub-zones is in a corresponding predetermined temperature interval. The reflow oven according to the present disclosure can perform soldering and processing of large-sized circuit boards and prevent the occurrence of overheating in a hearth of the reflow oven.

13. 发明授权

US10716220B2 Variable temperature controlled soldering iron 有权
公开(公告)号：US10716220B2
公开(公告)日：2020-07-14
申请号：US16532320
申请日：2019-08-05
申请人： OK International, Inc.
发明人： Hoa Nguyen
IPC分类号： B23K3/00 , H05K3/34 , B23K3/03 , B23K3/047 , B23K3/02 , B23K3/06 , B23K31/12 , B23K1/00 , B23K3/08 , H05K1/02 , H05K3/30 , B23K101/42 , G01B21/08
摘要： A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

14. 发明申请

US20200149690A1 LED TUBE LAMP FIT FOR BEING SUPPLIED BY A BALLAST ACCORDING TO THE VOLTAGE LEVEL OF AN EXTERNAL DRIVING SIGNAL 审中-公开
公开(公告)号：US20200149690A1
公开(公告)日：2020-05-14
申请号：US16740400
申请日：2020-01-11
申请人： JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
发明人： Aiming XIONG , Xintong Liu , Xiaojia Wu
IPC分类号： F21K9/278 , F21V3/10 , F21V3/06 , F21V15/015 , F21V23/00 , B23K1/00 , B23K3/047 , F21K9/275 , F21V29/83 , F21V23/02 , F21V17/10 , H05B45/50 , H05B45/37
摘要： An LED tube lamp comprises an LED module for emitting light; a rectifying circuit for rectifying an input external driving signal to produce a rectified signal; and a ballast interface circuit coupled to the LED module and comprising a detection circuit configured to determine that the external driving signal is a high frequency or high voltage signal when the voltage level of the rectified signal is higher than a predefined first threshold level. The ballast interface circuit causes an open circuit for the LED module when the voltage level of the rectified signal is higher than a predefined second threshold level but lower than the predefined first threshold level. And the ballast interface circuit causes current conduction in the LED module when the voltage level of the rectified signal, as based on an external driving signal from an inductive ballast, is lower than the predefined second threshold level.

15. 发明申请

US20200061730A1 HEATING DEVICE 审中-公开
公开(公告)号：US20200061730A1
公开(公告)日：2020-02-27
申请号：US16489749
申请日：2018-05-25
申请人： Continental Automotive France , Continental Automotive GmbH
发明人： Cédric Benaben , Stéphane Vitali
IPC分类号： B23K1/018 , B23K3/047 , H05K13/04 , H01L23/00
摘要： A heating device suitable for heating at least one soldered joint between an electronic component including at least a first contact mound and a printed circuit board. The soldered joint on the one hand securing the electronic component to the printed circuit board and on the other hand, while providing electrical continuity, the electronic component also having an electronic-component width, and an electronic-component thickness, wherein it includes an electrical-connection suitable for being coupled to an electrical power supply and a heater suitable for reaching a temperature at least equal to the melting point of the solder.

16. 发明申请

US20190383448A1 MODE SWITCHING CIRCUIT FOR CHANGING A SIGNAL PATH IN AN LED TUBE LAMP 审中-公开
公开(公告)号：US20190383448A1
公开(公告)日：2019-12-19
申请号：US16554649
申请日：2019-08-29
申请人： JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
发明人： Aiming Xiong , Xintong Liu
IPC分类号： F21K9/278 , F21V3/10 , F21V3/06 , F21V15/015 , F21V23/00 , H05B33/08 , B23K1/00 , B23K3/047 , F21K9/275 , F21V29/83 , F21V23/02 , F21V17/10
摘要： A mode switching circuit is configured to change a signal path in a light-emitting diode (LED) tube lamp and comprises: at least one switch, configured to receive a filtered signal as a driving signal to drive an LED module in the LED tube lamp to emit light, and when a frequency of an external driving signal received by the LED tube lamp is higher than a mode switching frequency, output the driving signal to the LED module. The LED tube lamp comprises an auxiliary power module coupled to provide auxiliary power for the LED module to emit light; and the mode switching circuit is on a printed circuit board and is electrically connected to the LED module on a bendable circuit sheet in the LED tube lamp, wherein the bendable circuit sheet is disposed below the printed circuit board to be electrically connected to the printed circuit board by soldering.

17. 发明授权

US10500661B2 Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom 有权
公开(公告)号：US10500661B2
公开(公告)日：2019-12-10
申请号：US15344532
申请日：2016-11-06
申请人： Toyota Motor Engineering & Manufacturing North America, Inc. , University of Maryland, College Park
发明人： Hannes Martin Hinrich Greve , F. Patrick McCluskey , Shailesh N. Joshi
IPC分类号： B23K37/00 , B23K1/00 , B23K3/08 , B23K3/047 , B23K35/26 , C22C13/00 , H01L23/00 , B23K20/02 , B23K20/233 , B23K20/26 , B23K101/42
CPC分类号： B23K1/0016 , B23K3/0478 , B23K3/085 , B23K20/026 , B23K20/233 , B23K20/26 , B23K35/262 , C22C13/00 , H01L24/29 , H01L24/75 , H01L24/83 , B23K2101/42 , H01L24/32 , H01L2224/29111 , H01L2224/29294 , H01L2224/29295 , H01L2224/29311 , H01L2224/29324 , H01L2224/29347 , H01L2224/29355 , H01L2224/32227 , H01L2224/32245 , H01L2224/75102 , H01L2224/75251 , H01L2224/75501 , H01L2224/75901 , H01L2224/8309 , H01L2224/8381 , H01L2224/83825 , H01L2224/83908 , H01L2924/10253 , H01L2924/10272 , H01L2224/29311 , H01L2924/00014 , H01L2224/29347 , H01L2924/00014 , H01L2224/29355 , H01L2924/00014 , H01L2224/29294 , H01L2924/00014 , H01L2224/29324 , H01L2924/00014
摘要： Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways.

18. 发明申请

US20190061032A1 SYSTEM AND METHOD FOR JOINING STRUCTURES OF DISSIMILAR MATERIAL 审中-公开
公开(公告)号：US20190061032A1
公开(公告)日：2019-02-28
申请号：US15686915
申请日：2017-08-25
申请人： GM GLOBAL TECHNOLOGY OPERATIONS LLC
发明人： Paul J. Wolcott
IPC分类号： B23K1/00 , B23K3/047 , B23K3/08 , B23K11/20
摘要： A system and method for joining structures includes a method of joining a first panel to a second panel. A first workpiece formed of a first material is positioned adjacent a second workpiece formed of a second material and joined with a joining process. At least one welding insert is formed from the joined first and second workpieces having an upper portion formed of the first material and a lower portion formed of the second material. The at least one welding insert is positioned between a first panel formed of the first material and a second panel formed of the second material and placed between first and second electrodes of a welding device. First and second electrodes of the welding device generate an electric current to join the first panel, at least one welding insert, and the second panel.

19. 发明授权

US10090274B2 Flip chip interconnection with reduced current density 有权
公开(公告)号：US10090274B2
公开(公告)日：2018-10-02
申请号：US14667490
申请日：2015-03-24
申请人： Efficient Power Conversion Corporation
发明人： Robert Strittmatter , Seshadri Kolluri , Robert Beach , Jianjun Cao , Alana Nakata
IPC分类号： H01L23/00 , B23K1/00 , B23K3/047 , B23K3/06 , H01L23/482 , B23K101/42
摘要： A method and system for electrically connect a semiconductor device with a flip-chip form factor to a printed circuit board. An exemplary embodiment of the method comprises: aligning solder contacts on the device with a first copper contact and a second copper contact of the external circuitry, and, applying a supply current only directly to a buried layer of the first copper and not directly to the layer which is nearest the device, such that no current is sourced to the device through the layer nearest the device.

20. 发明申请

US20180272452A1 WAX WELDING APPARATUS AND METHOD OF USE 审中-公开
公开(公告)号：US20180272452A1
公开(公告)日：2018-09-27
申请号：US15467864
申请日：2017-03-23
申请人： PCC STRUCTURALS, INC.
发明人： Connie A. Clark , Hoa Nguyen
IPC分类号： B23K3/047 , H05B3/26 , B22C7/02
CPC分类号： B23K3/047 , B22C7/02 , B22C7/026 , B23K3/0338 , H05B3/262 , H05B2203/03
摘要： An apparatus for wax welding is provided that includes a removable cartridge adapted for operative engagement with a power supply. The removable cartridge includes a tube defining a proximal end portion, a distal end portion, a longitudinal axis, and a hollow bore, and a self-regulating heater is disposed within the tube. The apparatus further includes a tip secured to the distal end portion of the tube within the hollow bore, the tip defining a proximal end portion having an internal cavity. The tip defines an upper surface, a lower surface, and the tip is oriented relative to a longitudinal axis of the cartridge.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式