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11. 发明申请

US20170071061A1 Circuit board structure and method for manufacturing a circuit board structure 审中-公开
标题翻译：用于制造电路板结构的电路板结构和方法
公开(公告)号：US20170071061A1
公开(公告)日：2017-03-09
申请号：US15355096
申请日：2016-11-18
申请人： GE Embedded Electronics Oy
发明人： Risto Tuominen , Antti Iihola , Petteri Palm
IPC分类号： H05K1/18 , H01L23/538 , H01L23/00 , H01L21/56 , H05K3/30 , H05K3/28 , H01L21/48 , H01L23/544 , H05K3/06 , H05K3/32
CPC分类号： H05K3/064 , H01L21/4846 , H01L21/56 , H01L21/568 , H01L23/13 , H01L23/5389 , H01L23/544 , H01L24/16 , H01L24/24 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/90 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/16 , H01L2224/18 , H01L2224/24227 , H01L2224/2929 , H01L2224/293 , H01L2224/81121 , H01L2224/81132 , H01L2224/81192 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/82039 , H01L2224/83132 , H01L2224/83192 , H01L2224/83203 , H01L2224/83205 , H01L2224/83851 , H01L2224/9211 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H05K1/183 , H05K1/187 , H05K1/188 , H05K3/205 , H05K3/284 , H05K3/303 , H05K3/305 , H05K3/32 , H05K3/321 , H05K3/4069 , H05K2201/0355 , H05K2201/09563 , H05K2201/0969 , H05K2201/10674 , H05K2201/10977 , H05K2203/0353 , H05K2203/063 , H05K2203/0723 , Y02P70/613 , Y10T29/4913 , H01L2224/29075 , H01L2924/00 , H01L2224/0401
摘要： The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.
摘要翻译：本公开公开了一种制造电路板结构的方法。在该方法中，制造导体层，其在导体箔的表面上包括导体箔和导体图案。将一个部件连接到导体层，并且导体层被薄化，使得导体层的导体材料从导体图案的外面去除。

12. 发明授权

US09578743B2 Circuit board 有权
标题翻译：电路板
公开(公告)号：US09578743B2
公开(公告)日：2017-02-21
申请号：US14858409
申请日：2015-09-18
申请人： NGK SPARK PLUG CO., LTD.
发明人： Makoto Nagai , Seiji Mori , Tatsuya Ito
IPC分类号： H05K1/00 , H05K1/11 , H05K1/02 , H05K1/03
CPC分类号： H05K1/11 , H01L2224/16225 , H05K1/0298 , H05K1/0313 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K3/4069 , H05K3/4644 , Y02P70/611
摘要： A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening.
摘要翻译：提供了一种电路板，其包括最外面的导体层，其包括用于倒装芯片接合的多个端子和限定电子部件安装区域中的第一开口和第二开口的最外层树脂绝缘层。电源端子和接地端子中的一个在第一开口中露出。多个信号端子在第二开口中露出。树脂绝缘层包括限定第二开口的内底面的加强部。在第一开口中暴露的端子的部分的高度，从第一开口的内底表面突出的部分的高度大于在第二开口中露出的端子的部分的高度，从内底部突出的部分第二个开口的表面。

13. 发明授权

US09538651B2 Printed wiring board and method for manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US09538651B2
公开(公告)日：2017-01-03
申请号：US14820978
申请日：2015-08-07
申请人： IBIDEN CO., LTD.
发明人： Yasushi Inagaki , Kota Noda
IPC分类号： H05K1/11 , H05K3/06 , H05K1/02 , H05K1/09 , H05K3/00 , H05K3/20 , H05K3/40 , H05K3/18
CPC分类号： H05K1/111 , H05K1/0271 , H05K1/0296 , H05K1/09 , H05K1/115 , H05K3/007 , H05K3/06 , H05K3/061 , H05K3/188 , H05K3/202 , H05K3/205 , H05K3/4007 , H05K3/4069 , H05K2201/0302 , H05K2201/0341 , H05K2201/0367 , H05K2201/09563 , H05K2201/098 , H05K2203/06 , Y02P70/611
摘要： A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.
摘要翻译：印刷布线板包括绝缘层，第一导体层，其嵌入绝缘层的第一表面中，并且包括用于连接电子部件的连接部分，从绝缘层的第二表面突出的第二导体层，阻焊层覆盖第一导体层并具有露出连接部分的开口结构，形成在连接部分上的阻挡金属层，使得阻挡层从绝缘层的第一表面突出，以及形成在阻挡层上的金属柱，使得金属柱分别位于连接部分上。每个金属柱的宽度大于相应连接部分的宽度，并且阻挡金属层包括与形成金属柱的金属材料不同的金属材料和形成第一导体层的金属材料。

14. 发明授权

US09468101B2 Microvia structure of flexible circuit board and manufacturing method thereof 有权
标题翻译：柔性电路板微孔结构及其制造方法
公开(公告)号：US09468101B2
公开(公告)日：2016-10-11
申请号：US14659977
申请日：2015-03-17
申请人： ADVANCED FLEXIBLE CIRCUITS CO., LTD.
发明人： Kuo-Fu Su , Gwun-Jin Lin
IPC分类号： H05K1/00 , H05K1/11 , H05K1/09 , H05K3/40 , H05K3/06
CPC分类号： H05K1/115 , H05K1/0251 , H05K1/092 , H05K3/06 , H05K3/4038 , H05K3/4069 , H05K2201/0397 , H05K2201/09845 , H05K2201/09854
摘要： Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of a flexible circuit board and a first exposed zone is defined. A second conductive layer includes a second through hole formed therein and defines a second exposed zone. A dielectric layer includes a dielectric layer through hole corresponding to the second through hole of the second conductive layer. A conductive paste layer is filled in the second through hole of the second conductive layer, the dielectric layer through hole of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste layer covers and electrically contacts the first exposed zone of the first conductive layer and the second exposed zone of the second conductive layer.
摘要翻译：柔性电路板的尿素微孔结构及其制造方法。在柔性电路板的第一导电层中形成第一通孔，并且限定第一暴露区域。第二导电层包括形成在其中的第二通孔并且限定第二暴露区域。电介质层包括与第二导电层的第二通孔对应的电介质层通孔。导电膏层填充在第二导电层的第二通孔，电介质层的电介质层通孔和第一导电层的第一通孔中，导电膏层覆盖并电接触第一导电层的第一暴露区域和第二导电层的第二暴露区域。

15. 发明申请

US20160295707A1 MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD 有权
标题翻译：多层印刷线路板和多层印刷线路板的制造方法
公开(公告)号：US20160295707A1
公开(公告)日：2016-10-06
申请号：US15022292
申请日：2014-03-26
申请人： NIPPON MEKTRON, LTD.
发明人： Shoji TAKANO , Fumihiko MATSUDA
IPC分类号： H05K3/40 , H05K3/06 , H05K1/02 , H05K1/11 , H05K3/46 , H05K1/09
CPC分类号： H05K3/4069 , H05K1/0298 , H05K1/092 , H05K1/115 , H05K3/06 , H05K3/4617 , H05K3/4623 , H05K2201/0355 , H05K2203/1383 , Y10T29/49128 , Y10T29/49165
摘要： A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.
摘要翻译：通过将粘合保护膜附着到金属箔层压片上，通过部分除去膜形成有底的通孔和绝缘膜，将导电膏填充到孔中并剥离膜来制造布线基板。通过形成粘合保护层以覆盖金属箔层压片上的图案化金属箔来制造布线基板，通过部分去除该层形成有底步骤的通孔和绝缘膜，将导电浆料填充到孔中，以及剥去保护膜。将布线基板和第二布线基板层叠，使糊状物的突出部与膏体的各突出部接触。

16. 发明授权

US09425137B2 Wiring board 有权
标题翻译：接线板
公开(公告)号：US09425137B2
公开(公告)日：2016-08-23
申请号：US14552771
申请日：2014-11-25
申请人： IBIDEN CO., LTD.
发明人： Nobuyuki Naganuma , Michimasa Takahashi , Masakazu Aoyama
IPC分类号： H01L23/053 , H01L23/12 , H05K1/11 , H01L23/498 , H01L23/538 , H05K3/46 , H05K1/02 , H05K1/09 , H05K1/18 , H05K3/00 , H05K3/40
CPC分类号： H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H05K1/0298 , H05K1/092 , H05K1/116 , H05K1/18 , H05K3/0011 , H05K3/0094 , H05K3/4069 , H05K3/4611 , H05K3/4623 , H05K2201/09545 , H05K2201/09563 , H05K2201/096 , H05K2201/09854 , Y10T156/1056
摘要： A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other.
摘要翻译：布线板包括多个绝缘层，包括以第一，第二，第三，第四和第五绝缘层的顺序层叠的第一，第二，第三，第四和第五绝缘层。所述第一绝缘层具有包括电镀的第一导体，所述第二绝缘层具有包括电镀的第二导体，所述第三绝缘层具有包括导电糊的第三导体，所述第四绝缘层具有包括电镀的第四导体，所述第五绝缘层具有包括电镀的第五导体，并且第一导体，第二导体，第三导体，第四导体和第五导体沿着相同的轴线形成并且彼此电连接。

17. 发明授权

US09420706B2 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US09420706B2
公开(公告)日：2016-08-16
申请号：US14164900
申请日：2014-01-27
申请人： Tatsuta Electric Wire & Cable Co., Ltd.
发明人： Norihiro Yamaguchi , Hiroaki Umeda , Ken Yukawa
IPC分类号： H05K1/09 , H05K3/46 , H01B1/22 , H05K3/40 , H05K1/02 , H05K3/00
CPC分类号： H05K3/46 , H01B1/22 , H05K1/0298 , H05K1/095 , H05K3/0032 , H05K3/4069 , H05K3/462 , H05K2201/0191 , H05K2201/0272 , H05K2201/0355 , H05K2201/10378 , H05K2203/0278 , H05K2203/0425 , H05K2203/1105 , H05K2203/111 , H05K2203/1194 , H05K2203/1461 , H05K2203/1572 , Y10T29/49117 , Y10T29/49124 , Y10T29/49139 , Y10T29/49155 , Y10T29/49165
摘要： In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.
摘要翻译：在制造多层板的方法中，包括：通过激光束加工形成通孔的钻孔步骤，用含有树脂成分和金属粉末的导电膏填充通孔的步骤，以及步骤在填充的导电糊料上和下方布置图案化板的铜层或铜层部分并对其进行压制，通过使用合金糊作为导电浆料，获得导电性和长期稳定性优异的多层印刷线路板，其中至少使用在进行预热之前，使用比例A / B为10以上的预浸料，将金属粉末的一部分熔融并且彼此相邻的金属粉末合金化，其中A是在拐点处的储能模量，储能模量从增加到减少变化，B是在从60℃升高的温度分布中储能模量从降低到升高的拐点处的储能模量到200℃，并且在钻井步骤之前预热预浸料以将A / B比率降低到10以下。

18. 发明申请

US20160183371A1 MICROVIA STRUCTURE OF FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：柔性电路板的微观结构及其制造方法
公开(公告)号：US20160183371A1
公开(公告)日：2016-06-23
申请号：US14659977
申请日：2015-03-17
申请人： ADVANCED FLEXIBLE CIRCUITS CO., LTD.
发明人： KUO-FU SU , GWUN-JIN LIN
IPC分类号： H05K1/11 , H05K3/40 , H05K3/06 , H05K1/09
CPC分类号： H05K1/115 , H05K1/0251 , H05K1/092 , H05K3/06 , H05K3/4038 , H05K3/4069 , H05K2201/0397 , H05K2201/09845 , H05K2201/09854
摘要： Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of a flexible circuit board and a first exposed zone is defined. A second conductive layer includes a second through hole formed therein and defines a second exposed zone. A dielectric layer includes a dielectric layer through hole corresponding to the second through hole of the second conductive layer. A conductive paste layer is filled in the second through hole of the second conductive layer, the dielectric layer through hole of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste layer covers and electrically contacts the first exposed zone of the first conductive layer and the second exposed zone of the second conductive layer.
摘要翻译：柔性电路板的尿素微孔结构及其制造方法。在柔性电路板的第一导电层中形成第一通孔，并且限定第一暴露区域。第二导电层包括形成在其中的第二通孔并且限定第二暴露区域。电介质层包括与第二导电层的第二通孔对应的电介质层通孔。导电膏层填充在第二导电层的第二通孔，电介质层的电介质层通孔和第一导电层的第一通孔中，导电膏层覆盖并电接触第一导电层的第一暴露区域和第二导电层的第二暴露区域。

19. 发明授权

US09332650B2 Method of producing multilayer circuit board 有权
标题翻译：生产多层电路板的方法
公开(公告)号：US09332650B2
公开(公告)日：2016-05-03
申请号：US13494417
申请日：2012-06-12
申请人： Shingo Yoshioka , Hiroaki Fujiwara
发明人： Shingo Yoshioka , Hiroaki Fujiwara
IPC分类号： H05K3/02 , H05K3/18 , H05K1/16 , H05K3/10 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/38 , H05K3/40 , H05K3/46
CPC分类号： H05K3/184 , H01L2224/48091 , H01L2224/48227 , H01L2924/15173 , H01L2924/15311 , H05K1/0206 , H05K1/023 , H05K1/0284 , H05K1/11 , H05K1/162 , H05K3/0014 , H05K3/0032 , H05K3/107 , H05K3/381 , H05K3/4069 , H05K3/4647 , H05K3/4661 , H05K2201/09381 , H05K2201/096 , H05K2201/09736 , H05K2203/0108 , H05K2203/0565 , Y10T29/49114 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2924/00014
摘要： The present invention relates to a method of producing a multilayer circuit board including: a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the film.
摘要翻译：本发明涉及一种制造多层电路板的方法，包括：在绝缘基板的表面上形成可溶胀树脂膜的成膜步骤，形成电路槽的电路槽形成步骤，该电路槽的深度等于或等于大于膜的外表面上的可溶胀树脂膜的厚度，在电路槽的表面和可溶胀树脂膜的表面上沉积电镀催化剂或其前体的催化剂沉积步骤，分离步骤，用特定的液体使溶胀性树脂膜溶胀，然后从膨胀的基材表面分离溶胀的树脂膜;以及电镀处理步骤，仅在由镀催化剂或电镀催化剂形成的镀层催化剂的区域形成无电镀膜电镀催化剂前体在分离膜后保持未分离。

20. 发明申请

US20160095216A1 CIRCUIT BOARD 有权
标题翻译：电路板
公开(公告)号：US20160095216A1
公开(公告)日：2016-03-31
申请号：US14858409
申请日：2015-09-18
申请人： NGK SPARK PLUG CO., LTD.
发明人： Makoto NAGAI , Seiji MORI , Tatsuya ITO
IPC分类号： H05K1/11 , H05K1/03 , H05K1/02
CPC分类号： H05K1/11 , H01L2224/16225 , H05K1/0298 , H05K1/0313 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K3/4069 , H05K3/4644 , Y02P70/611
摘要： A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening.
摘要翻译：提供了一种电路板，其包括最外面的导体层，其包括用于倒装芯片接合的多个端子和限定电子部件安装区域中的第一开口和第二开口的最外层树脂绝缘层。电源端子和接地端子中的一个在第一开口中露出。多个信号端子在第二开口中露出。树脂绝缘层包括限定第二开口的内底面的加强部。在第一开口中暴露的端子的部分的高度，从第一开口的内底表面突出的部分的高度大于在第二开口中露出的端子的部分的高度，从内底部突出的部分第二个开口的表面。

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