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    • 12. 发明授权
    • Double layer interleaved p-n diode modulator
    • 双层交错p-n二极管调制器
    • US09057832B2
    • 2015-06-16
    • US14492410
    • 2014-09-22
    • International Business Machines Corporation
    • William M. GreenJessie C. RosenbergYurii Vlasov
    • H01L21/00G02B6/134G02B6/12G02F1/025
    • G02B6/1347G02B6/12G02B2006/12061G02F1/025G02F2201/063G02F2201/15G02F2202/06G02F2202/105
    • A method for fabricating an optical modulator includes forming n-type layer, a first oxide portion on a portion of the n-type layer, and a second oxide portion on a second portion of the n-type layer, patterning a first masking layer over the first oxide portion, portions of a planar surface of the n-type layer, and portions of the second oxide portion, implanting p-type dopants in the n-type layer to form a first p-type region and a second p-type region, removing the first masking layer, patterning a second masking layer over the first oxide portion, a portion of the first p-type region, and a portion of the n-type layer, and implanting p-type dopants in exposed portions of the n-type layer, exposed portions of the first p-type region, and regions of the n-type layer and the second p-type region disposed between the substrate and the second oxide portion.
    • 一种光学调制器的制造方法包括在n型层的一部分上形成n型层,第一氧化物部分和n型层的第二部分上的第二氧化物部分,将第一掩模层图案化 第一氧化物部分,n型层的平面表面的部分和第二氧化物部分的部分,在n型层中注入p型掺杂剂以形成第一p型区和第二p型 去除所述第一掩蔽层,在所述第一氧化物部分上形成第二掩模层,所述第一p型区域的一部分和所述n型层的一部分,以及在所述第一掩模层的暴露部分中注入p型掺杂剂 n型层,第一p型区域的露出部分以及设置在基板和第二氧化物部分之间的n型层和第二p型区域的区域。
    • 15. 发明授权
    • Systems and methods for preparing films using sequential ion implantation, and films formed using same
    • 使用顺序离子注入制备膜的系统和方法,以及使用其形成的膜
    • US08269931B2
    • 2012-09-18
    • US12584939
    • 2009-09-14
    • Margaret H. AbrahamDavid P. Taylor
    • Margaret H. AbrahamDavid P. Taylor
    • G02F1/1333G02F1/1337
    • H01L21/265C23C14/0635C23C14/10C23C14/48G02B6/1347Y10T428/30Y10T428/31504
    • Systems and methods for preparing films using sequential ion implantation, and films formed using same, are provided herein. A structure prepared using ion implantation may include a substrate; an embedded structure having pre-selected characteristics; and a film within or adjacent to the embedded structure and including ions having a perturbed arrangement arising from the presence of the embedded structure. The perturbed arrangement may include the ions being covalently bonded to each other, to the embedded structure, or to the substrate, whereas the ions instead may be free to diffuse through the substrate in the absence of the embedded structure. The embedded structure may inhibit or impede the ions from diffusing through the substrate, such that the ions instead covalently bond to each other, to the embedded structure, or to the substrate. The film may include, for example, diamond-like carbon, graphene, or SiC having a pre-selected phase.
    • 本文提供了使用顺序离子注入制备膜的系统和方法以及使用其形成的膜。 使用离子注入制备的结构可以包括基底; 具有预选特征的嵌入式结构; 以及在嵌入结构内或附近的膜,并且包括由嵌入结构的存在引起的扰动布置的离子。 扰动的布置可以包括彼此共价键合的离子,嵌入结构或衬底,而离子可以在不存在嵌入结构的情况下自由地扩散通过衬底。 嵌入结构可以抑制或阻止离子通过衬底扩散,使得离子彼此共价键合到嵌入结构或衬底上。 该膜可以包括例如具有预选相的类金刚石碳,石墨烯或SiC。
    • 16. 发明申请
    • Systems and methods for preparing films using sequential ion implantation, and films formed using same
    • 使用顺序离子注入制备膜的系统和方法,以及使用其形成的膜
    • US20110064370A1
    • 2011-03-17
    • US12584939
    • 2009-09-14
    • Margaret H. AbrahamDavid P. Taylor
    • Margaret H. AbrahamDavid P. Taylor
    • G02B6/10C23C14/48B05C11/00B32B9/00
    • H01L21/265C23C14/0635C23C14/10C23C14/48G02B6/1347Y10T428/30Y10T428/31504
    • Systems and methods for preparing films using sequential ion implantation, and films formed using same, are provided herein. A structure prepared using ion implantation may include a substrate; an embedded structure having pre-selected characteristics; and a film within or adjacent to the embedded structure and including ions having a perturbed arrangement arising from the presence of the embedded structure. The perturbed arrangement may include the ions being covalently bonded to each other, to the embedded structure, or to the substrate, whereas the ions instead may be free to diffuse through the substrate in the absence of the embedded structure. The embedded structure may inhibit or impede the ions from diffusing through the substrate, such that the ions instead covalently bond to each other, to the embedded structure, or to the substrate. The film may include, for example, diamond-like carbon, graphene, or SiC having a pre-selected phase.
    • 本文提供了使用顺序离子注入制备膜的系统和方法以及使用其形成的膜。 使用离子注入制备的结构可以包括基底; 具有预选特征的嵌入式结构; 以及在嵌入结构内或附近的膜,并且包括由嵌入结构的存在引起的扰动布置的离子。 扰动的布置可以包括彼此共价键合的离子,嵌入结构或衬底,而离子可以在不存在嵌入结构的情况下自由地扩散通过衬底。 嵌入结构可以抑制或阻止离子通过衬底扩散,使得离子彼此共价键合到嵌入结构或衬底上。 该膜可以包括例如具有预选相的类金刚石碳,石墨烯或SiC。
    • 17. 发明申请
    • Production Method for a Lateral Electro-Optical Modulator on Silicon With Auto-Aligned Implanted Zones
    • 在具有自动对准的移植区域的硅上的侧面电光调制器的制造方法
    • US20100099242A1
    • 2010-04-22
    • US12579086
    • 2009-10-14
    • Jean-Marc FEDELI
    • Jean-Marc FEDELI
    • H01L21/265
    • G02F1/025G02B6/1347G02B6/136G02B2006/12061G02B2006/12097G02B2006/12142G02F2001/0151G02F2201/063H01L21/26513H01L21/26586
    • The invention relates to a production method of a lateral electro-optical modulator on an SOI substrate, the modulator comprising a rib waveguide formed in the thin layer of silicon of the SOI substrate, the rib waveguide being placed between a doped region P and a doped region N formed in the thin layer of silicon, the rib waveguide occupying an intrinsic region of the thin layer, at least one doped zone P being formed in the rib and perpendicularly to the substrate. The method comprises masking steps of the thin layer of silicon to define therein the rib of the waveguide, etching of the rib, masking of the thin layer of silicon to delimit the parts to be doped P, doping of the parts to be doped P, masking of the thin layer of silicon to delimit the region to be doped N and doping of the region to be doped N. The masking steps utilises a hard mask whereof the pattern defines the rib of the waveguide, the zone to be doped P in the rib of the waveguide and the limit of the doped region N relative to the rib of the waveguide.
    • 本发明涉及一种在SOI衬底上的横向电光调制器的制造方法,该调制器包括形成在SOI衬底的硅薄层中的肋波导,该肋波导位于掺杂区P和掺杂 形成在硅薄层中的区域N,肋波导占据薄层的本征区域,至少一个掺杂区域P形成在肋中并垂直于衬底。 该方法包括屏蔽薄层硅的步骤以在其中限定波导的肋,蚀刻肋,掩蔽薄层的硅以限定待掺杂的部分P,掺杂待掺杂的部分P, 掩蔽硅的薄层以限定要掺杂的区域N和掺杂待掺杂区域N.掩模步骤使用硬掩模,其中图案限定波导的肋,待掺杂的区域P在 波导的肋和相对于波导的肋的掺杂区域N的极限。
    • 19. 发明申请
    • Wavelength converting element and method of manufacturing thereof
    • 波长转换元件及其制造方法
    • US20050225838A1
    • 2005-10-13
    • US11142253
    • 2005-06-02
    • Isao Tsuruma
    • Isao Tsuruma
    • G02B6/134G02F1/03G02F1/377G02F1/35
    • G02F1/3775G02B6/1347G02F1/0316G02F2201/066
    • A wavelength converting element is provided in which a fundamental wave with respect to an optical crystal substrate and a peak of a vertical transverse mode of a second harmonic are made to coincide, the converting efficiency is good, and a beam shape which enables good joining to a lens or an optical fiber is obtained. Given that an angle formed by a surface of the optical crystal substrate and a C axis of the optical crystal substrate is θ, a period at which inverted domains are formed is p, and a distance from a distal end of a comb-shaped electrode for forming the inverted domain to a central position of a waveguide is G, in the ion implantation, a concentration peak of the ion implantation is formed at a distance of substantially (G·tan θ+p/4) from the surface of the optical crystal substrate.
    • 提供一种波长转换元件,其中使相对于光学晶体基板的基波和二次谐波的垂直横向模式的峰值一致,转换效率良好,并且能够良好地接合到 获得透镜或光纤。 假设由光学晶体基板的表面和光学晶体基板的C轴形成的角度为θ,则形成反转畴的周期为p,并且与梳状电极的远端的距离为 在波导的中心位置处形成反向域为G,在离子注入中离子注入的浓度峰值形成在与光学晶体表面​​基本上(G.tanθ+ p / 4)的距离处 基质。