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    • 20. 发明申请
    • PROCESS FOR PREPARING PHASE CHANGE MICROCAPSULE HAVING THERMALLY CONDUCTIVE SHELL
    • 用于制备具有导热壳的相变微生物的方法
    • US20160151757A1
    • 2016-06-02
    • US14556539
    • 2014-12-01
    • NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    • YEN-FENG SHIHYI-HSIUAN YUYEN-LIN TSENGHOU-AN HSIEH
    • B01J13/14C09K5/06
    • B01J13/14C09K5/06C09K5/063F28D20/023Y02E60/145
    • A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer. Therefore, the thermally conductive material can be dispersed stably during the encapsulation of the microcapsules, and the phase change microcapsule having the thermally conductive shell can be obtained successfully.
    • 引入了具有导热壳的相变微胶囊的制备方法。 通过加入导热纳米材料,增加了相变微胶囊封装材料的导热性。 乙烯基硅烷化合物与丙烯酸单体聚合,首先形成共聚物,然后加入导热性无机材料。 然后,准备以相变材料为芯,含有导热材料的共聚物为壳的相变微胶囊。 导热性无机材料表面的极性官能团与乙烯基硅烷化合物凝结形成化学键合,从而大大增加了导热无机材料与共聚物之间的相容性。 因此,可以在封装微胶囊期间稳定地分散导热材料,并且可以成功获得具有导热性壳的相变微胶囊。