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    • 12. 发明授权
    • Release agent partition control in imprint lithography
    • 印版光刻中的脱模剂分区控制
    • US08637587B2
    • 2014-01-28
    • US13226635
    • 2011-09-07
    • Frank Y. XuWeijun Liu
    • Frank Y. XuWeijun Liu
    • C08F2/50
    • C07D237/24B82Y10/00B82Y40/00C07C233/18G03F7/0002
    • Release agents with increased affinity toward nano-imprint lithography template surfaces interact strongly with the template during separation of the template from the solidified resist in a nano-imprint lithography process. The strong interaction between the surfactant and the template surface reduces the amount of surfactant pulled off the template surface during separation of a patterned layer from the template in an imprint lithography cycle. Maintaining more surfactant associated with the surface of the template after the separation of the patterned layer from the template may reduce the amount of surfactant needed in a liquid resist to achieve suitable release of the solidified resist from the template during an imprint lithography process. Strong association of the release agent with the surface of the template facilitates the formation of ultra-thin residual layers and dense fine features in nano-imprint lithography.
    • 在纳米压印光刻工艺中将模板与固化的抗蚀剂分离期间,与纳米压印光刻模板表面的亲和性增加的脱模剂与模板相互作用强烈。 表面活性剂和模板表面之间的强相互作用减少了在压印光刻循环中将图案化层与模板分离期间从模板表面上拉出的表面活性剂的量。 在将图案化层与模板分离之后,维持与模板表面相关的更多表面活性剂可以减少液体抗蚀剂中所需的表面活性剂的量,以在压印光刻过程中从模板中实现固化的抗蚀剂的合适释放。 脱模剂与模板表面的强相关有助于在纳米压印光刻中形成超薄的残余层和致密的精细特征。
    • 15. 发明授权
    • Enhanced densification of silicon oxide layers
    • 增强氧化硅层的致密化
    • US08541053B2
    • 2013-09-24
    • US13178057
    • 2011-07-07
    • Marlon MenezesFrank Y. XuFen Wan
    • Marlon MenezesFrank Y. XuFen Wan
    • B05D3/02B05D3/04B32B3/26
    • G03F7/0002B82Y10/00B82Y40/00H01L21/3105Y10T428/249953
    • Densifying a multi-layer substrate includes providing a substrate with a first dielectric layer on a surface of the substrate. The first dielectric layer includes a multiplicity of pores. Water is introduced into the pores of the first dielectric layer to form a water-containing dielectric layer. A second dielectric layer is provided on the surface of the water-containing first dielectric layer. The first and second dielectric layers are annealed at temperature of 600° C. or less. In an example, the multi-layer substrate is a nanoimprint lithography template. The second dielectric layer may have a density and therefore an etch rate similar to that of thermal oxide, yet may still be porous enough to allow more rapid diffusion of helium than a thermal oxide layer.
    • 致密化多层基板包括在基板的表面上提供具有第一介电层的基板。 第一介电层包括多个孔。 将水引入第一介电层的孔中以形成含水介电层。 在含水的第一介电层的表面上设置有第二介质层。 第一和第二电介质层在600℃或更低的温度下退火。 在一个实例中,多层衬底是纳米压印光刻模板。 第二电介质层可以具有与热氧化物类似的密度,因此蚀刻速率可能仍然足够多孔以允许氦比热氧化物层更快速地扩散。