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    • 18. 发明授权
    • Defect inspection apparatus, defect inspection method, and manufacture method for semiconductor device
    • 缺陷检查装置,缺陷检查方法以及半导体装置的制造方法
    • US08270703B2
    • 2012-09-18
    • US12404430
    • 2009-03-16
    • Naohiro TakahashiIsao Motomura
    • Naohiro TakahashiIsao Motomura
    • G06K9/00
    • G01N21/9501G01N21/9503G01N2021/8854G01N2021/8858G06T7/0004G06T2207/30148H01L22/12
    • A distinguishing size for distinguishing a pseudo defect from a defect caused by a process trouble is stored in a first storage area. Defect data are stored in a second storage area. A processing unit detects a defect on a wafer surface, and stores the defect data in the second storage area. Before a defect detection process is completed for all areas of the wafer surface, a size of a defect detected in a partial area is compared with the distinguishing size stored in the first storage area. If the detected defect has a size equal to or larger than the distinguishing size, an alarm is output through an output unit, whereas if a defect having a size equal to or larger than the distinguishing size is not detected, the defect detection process is executed for the area still not subjected to the defect detection process.
    • 用于区分伪缺陷与由工艺故障引起的缺陷的区别大小被存储在第一存储区域中。 缺陷数据存储在第二存储区域中。 处理单元检测晶片表面上的缺陷,并将缺陷数据存储在第二存储区域中。 在对晶片表面的所有区域完成缺陷检测处理之前,将部分区域中检测到的缺陷的大小与存储在第一存储区域中的区别大小进行比较。 如果检测到的缺陷的大小等于或大于识别尺寸,则通过输出单元输出警报,而如果没有检测到具有等于或大于区分大小的大小的缺陷,则执行缺陷检测处理 因为该区域仍未进行缺陷检测处理。
    • 19. 发明申请
    • DEFECT REVIEW APPARATUS AND METHOD FOR WAFER
    • 缺陷评估装置和方法
    • US20100128119A1
    • 2010-05-27
    • US12614905
    • 2009-11-09
    • Naohiro Takahashi
    • Naohiro Takahashi
    • H04N7/18G06K9/00
    • G06T7/001G06T2207/10061G06T2207/30148
    • A defect review apparatus includes a storage device which stores data about a defect of an inspection target object; a first imaging device which captures an image located in a position on a surface of the inspection target object, the position being specified by information regarding the position of the inspection target object which has been input; and a control device which controls the first imaging device. The storage device stores: first defect detection data including a defect number as which the defect of the inspection target object detected by a first defect detection process is labeled, and information regarding the position of the defect; and second defect data including a defect number as which the defect of the inspection target object detected by a second defect detection process is labeled, and information regarding its position.
    • 缺陷检查装置包括存储关于检查目标对象的缺陷的数据的存储装置; 第一成像装置,其捕获位于所述检查对象物体的表面上的位置的图像,所述位置由关于被输入的检查对象物的位置的信息指定; 以及控制第一成像装置的控制装置。 存储装置存储:包括通过第一缺陷检测处理检测到的检查对象物体的缺陷被标记的缺陷数的第一缺陷检测数据和关于缺陷的位置的信息; 并且包括通过第二缺陷检测处理检测到的检查对象对象的缺陷被标记的缺陷数的第二缺陷数据以及关于其位置的信息。
    • 20. 发明授权
    • Surface inspection device and method
    • 表面检查装置及方法
    • US07653236B2
    • 2010-01-26
    • US11058645
    • 2005-02-16
    • Naohiro Takahashi
    • Naohiro Takahashi
    • G06K9/00H04N5/253H04N7/18G01N21/00
    • G06T7/0004G06T2207/30148
    • Disclosed is a surface inspection device that performs a defect inspection throughout a surface of a wafer. In the defect detection using a defect review SEM, an X-Y coordinate system is set throughout a surface (excluding a round end face) of a product wafer to allow the inspection throughout the surface of the product wafer. Therefore, the defect detection can be performed also in an area other than an effective chip area. Further, the inspection results of the area are stored in relation to the coordinates in a position where the inspection results are acquired. Therefore, the inspection results can be effectively used for an analysis and a defect cause can be investigated with a higher degree of accuracy. As a result, the quality and yield of chips can be improved.
    • 公开了一种在晶片表面进行缺陷检查的表面检查装置。 在使用缺陷检查SEM的缺陷检测中,在产品晶片的整个表面(不包括圆形端面)设置X-Y坐标系,以允许在产品晶片的整个表面上进行检查。 因此,也可以在有效芯片区域以外的区域中进行缺陷检测。 此外,该区域的检查结果相对于获取检查结果的位置处的坐标存储。 因此,检查结果可以有效地用于分析,并且可以以更高的精度来研究缺陷原因。 结果,可以提高芯片的质量和产量。